Method for enhancing photoetching resolution of dense patterns
A lithography resolution and graphics technology, which is applied in microlithography exposure equipment, photoplate making process of pattern surface, optics, etc., can solve the problems of huge capital cost and uneconomical lithography machine, and achieve the goal of improving resolution Effect
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[0033] Example one
[0034] The method for enhancing the lithography resolution of dense patterns in this embodiment adopts a double exposure process, and the specific process includes:
[0035] Coat a layer of developable glue 101 uniformly on the substrate 100 and bake, such as figure 1 Shown.
[0036] The substrate 100 may be a single crystal silicon, polysilicon, silicon dioxide, silicon nitride, gallium nitride, gallium arsenide, aluminum oxide, silicon carbide, indium phosphide, or other metal or metal alloy substrates.
[0037] The developable glue 101 is different from photoresist. It has a certain solubility in alkaline developer without exposure, and its dissolution rate can be changed by baking temperature and time. Generally, the dissolution rate in alkaline developer is 0.1 to 200 nanometers / sec. The developable glue 101 is also resistant to dissolution by the photoresist solvent. The material of the developable glue that meets the above conditions may be a metal peeli...
Example Embodiment
[0057] Example two
[0058] The method for enhancing the lithography resolution of dense patterns in this embodiment adopts a double exposure process, and the specific process includes:
[0059] Coat a layer of developable glue 101 uniformly on the substrate 100 and bake, such as figure 1 Shown.
[0060] The substrate 100 may be a single crystal silicon, polysilicon, silicon dioxide, silicon nitride, gallium nitride, gallium arsenide, aluminum oxide, silicon carbide, indium phosphide, or other metal or metal alloy substrates.
[0061] The developable glue 101 is different from photoresist. It has a certain solubility in alkaline developer without exposure, and its dissolution rate can be changed by baking temperature and time. Generally, the dissolution rate in alkaline developer is 0.1 to 200 nanometers / sec. The developable glue 101 is also resistant to dissolution by organic developing solutions and photoresist solvents. The material of the developable glue that meets the above c...
Example Embodiment
[0086] Example three
[0087] The method for enhancing the lithography resolution of dense patterns in this embodiment adopts a double exposure process, and the specific process includes:
[0088] Coat a layer of developable glue 101 uniformly on the substrate 100 and bake, such as figure 1 Shown.
[0089] Coat a layer of photoresist 102 uniformly on the developable adhesive 101 and bake, such as figure 2 Shown.
[0090] Through the first photolithography exposure process, based on the mask used in this step, an exposed area 102a and a non-exposed area 102b are formed on the photoresist 102, such as image 3 Shown.
[0091] The post-exposure development process is performed, and the exposed area 102a is removed by an alkaline developer. At the same time, the alkaline developer can also dissolve the developable glue 101 under the photoresist 102. After a predetermined time, a Figure 4 In the structure shown, the exposed area 102a in the photoresist 102 is dissolved and removed by the ...
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