A preparation method of adhesive for adhesive tape solder, adhesive tape solder and brazing method

A brazing method and binder technology are applied in the field of adhesive tape brazing filler metal and brazing, and the preparation field of adhesive tape brazing filler metal, which can solve the health hazards of production personnel, non-compliance with environmental protection requirements, and poor alloy uniformity. and other problems, to achieve the effect of ensuring full decomposition, good flexibility, and low carbon residue after welding

Active Publication Date: 2022-02-22
林铁松
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AI-Extracted Technical Summary

Problems solved by technology

[0004] The problem solved by the present invention is that the existing adhesive tape solder adhesive tape is thick, poor applicability, poor alloy uniformity, low allo...
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Method used

Preferably, described solder powder comprises the particle of four kinds of different particle diameters, and the weight ratio of the particle of described four kinds of different particle diameters is arranged successively according to the order that particle diameter increases is 5-25%, 20-35% %, 25-35%, and 15-25%. In some specific embodiments, the solder powder includes particles with four diameters of 5 μm, 10 μm, 30 μm, and 50 μm, and the weight ratio of each component is: 5-25% of particles with a diameter of 5 μm, 20-35% of particles with a diameter of 10 μm, 25-35% for 30 μm diameter particles, 15-35% for 50 μm diameter particles. Therefore, in this embodiment, by adjusting the ratio of particles of various sizes, the gaps in the coarse particles are just filled by the medium particles, and the gaps in the medium particles are just filled by the fine particles, so that the material can be packed most densely and the accumulation of the solder powder can be improved. The density improves the welding quality of the sticky solder.
Preferably, described solder powder is high temperature solder powder, and described solder powder is selected from the one in nickel-based solder powder, cobalt-based solder powder or copper-based solder powder, thus can Satisfy the preparation of a variety of adhesive tape solders, and have a wide range of applications.
[0065] The preparation method in the present embodiment provided two insulation platforms before the brazing temperature, which ensured that the binder was fully decomposed, and s...
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Abstract

The invention provides a method for preparing a binder for sticky solder, a sticky solder and a brazing method, and relates to the technical field of brazing processing. The preparation method of the binder for sticky solder includes: The weight ratio of each component, 30-70% epoxy resin, 21-63% plasticizer and 3-21% toughening agent are placed in the stirrer, and stirred at a speed of 30-60r/min for 5 ‑15min to prepare the binder. The binder for adhesive tape brazing filler metal of the present invention is suitable for many kinds of brazing filler metals, has simple preparation process, no pollution to the environment, and low amount of residual carbon after welding. The prepared adhesive tape solder has good flexibility, can be processed into various shapes, is suitable for vacuum brazing under complex conditions, and has uniform joint structure and excellent performance after welding.

Application Domain

Welding/cutting media/materialsSoldering media

Technology Topic

PlasticizerBrazing +3

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  • A preparation method of adhesive for adhesive tape solder, adhesive tape solder and brazing method

Examples

  • Experimental program(6)

Example Embodiment

[0025] An embodiment of the present invention provides a method for preparing an adhesive for adhesive tape solder, comprising: according to the weight ratio of each component, 30-70% of epoxy resin, 21-63% of plasticizer and 3 -21% of the toughening agent is placed in a stirrer and stirred at a speed of 30-60r/min for 5-15min to prepare the binder.
[0026] In the present embodiment, epoxy resin is used for bonding solder powder. In some preferred embodiments, the grade of epoxy resin is E44, and it is a bisphenol A type epoxy resin with strong adhesion and a thermal decomposition temperature T d The temperature is 385°C-413°C, and the amount of residual carbon after welding is low. And compared with the polymethyl methacrylate that mostly uses in the prior art, epoxy resin E44 is cheap, has cost advantage, and polymethyl methacrylate is solid under normal temperature, needs heating and complex process in the preparation process , while the epoxy resin E44 is liquid at room temperature and has a certain viscosity. The stirring time required during the mixing process is short, and there is no need for long-term drying after the preparation is completed, which simplifies the process and further reduces energy consumption.
[0027] In this embodiment, the plasticizer is used to increase the plasticity of the adhesive tape solder when rolling. In some preferred embodiments, the plasticizer includes terpene resin and the first diluent, and the plasticizer consists of The terpene resin with a weight ratio of 10-50% and the first diluent with a weight ratio of 50-90% are placed in a stirrer and stirred at a speed of 30-60r/min for 5-15min.
[0028] Terpene resin in the present embodiment, molecular formula is (C 10 h 16 ) n , the material has high cohesion and strong adhesion, which can increase the plasticity of the binder and improve the processing performance. The thermal decomposition temperature T of terpene resin d It is about 160 ℃, and the amount of residual carbon after welding is low.
[0029] In this embodiment, the first diluent swells the plasticizer, making the plasticizer a liquid that is easy to add and mix at room temperature. In some preferred embodiments, the first diluent is selected from N-formazol One or more of pyrrolidone, acetone, ethyl acetate, and dibutyl phthalate.
[0030] In this embodiment, the toughening agent is used to increase the toughness of the adhesive tape solder during rolling. In some preferred embodiments, the toughening agent includes an elastomer and a second diluent, and the toughening agent consists of The elastomer with a weight ratio of 60-95% and the second diluent with a weight ratio of 5-40% are placed in a stirrer and stirred at a speed of 30-60r/min for 5-15min.
[0031] In some preferred embodiments, the elastomer is selected from one or more of ethyl cellulose, styrene-based thermoplastic elastomer, acrylonitrile-butadiene-styrene terpolymer, butadiene rubber .
[0032] In this embodiment, the second diluent swells the toughening agent, making the toughening agent a liquid that is easy to add and mix at room temperature. In some preferred embodiments, the second diluent is selected from ethyl acetate , absolute ethanol, acetone or one or more.
[0033] Therefore, the binder for adhesive tape solder of the present invention is suitable for many kinds of solder, has simple preparation process, no pollution to the environment, and low amount of residual carbon after welding. The prepared adhesive tape solder has good flexibility, can be processed into various shapes, is suitable for vacuum brazing under complex conditions, and has uniform joint structure and excellent performance after welding.
[0034] The embodiment of the present invention also provides a kind of adhesive tape solder, including solder powder and the binder prepared according to the preparation method of the adhesive tape solder binder, and the adhesive tape solder has a weight ratio of 6-14% of the binder and 86-94% of the solder powder are placed in a stirrer, stirred at a speed of 30-60r/min for 20-60min, fully mixed and rolled to a thickness of 0.1-2mm adhesive tape solder.
[0035] Preferably, the solder powder is a high-temperature solder powder, and the solder powder is selected from one of nickel-based solder powder, cobalt-based solder powder or copper-based solder powder, thus meeting various requirements. The preparation of sticky solder has a wide range of applications.
[0036] Preferably, the solder powder includes particles of four different particle sizes, and the weight ratios of the particles of the four different particle sizes are arranged in order of increasing particle size as 5-25%, 20-35%, 25%. -35% and 15-25%. In some specific embodiments, the solder powder includes particles with four diameters of 5 μm, 10 μm, 30 μm, and 50 μm, and the weight ratio of each component is: 5-25% of particles with a diameter of 5 μm, 20-35% of particles with a diameter of 10 μm, 25-35% for 30 μm diameter particles, 15-35% for 50 μm diameter particles. Therefore, in this embodiment, by adjusting the ratio of particles of various sizes, the gaps in the coarse particles are just filled by the medium particles, and the gaps in the medium particles are just filled by the fine particles, so that the material can be packed most densely and the accumulation of the solder powder can be improved. The density improves the welding quality of the sticky solder.
[0037] Therefore, the adhesive tape solder in the embodiment of the present invention has good flexibility, can be processed into various shapes, and is suitable for vacuum brazing under complex conditions. The post-weld joint has uniform structure, excellent performance and low post-weld carbon residue.
[0038] like figure 1 As shown, the embodiment of the present invention also provides a brazing method, comprising the following steps:
[0039] Step S1, pre-welding treatment, smoothing the surface of the workpiece to be welded with 100-2000 mesh sandpaper, ultrasonically cleaning the to-be-welded part of the workpiece to be welded with acetone for 5-10 minutes, and attaching the adhesive tape solder to the parts to be welded;
[0040] Step S2, place the whole workpiece to be welded in a vacuum brazing furnace, close the furnace door and use a vacuum pump to evacuate the furnace into a vacuum state, then raise the temperature to 550-600°C at a heating rate of 8-10°C/min, and keep warm for 5 -10min, at this time the temperature has reached the decomposition temperature of the binder component in the adhesive tape solder, the binder component is fully decomposed, and the decomposition products are discharged by the vacuum pump;
[0041] Step S3, continue to raise the temperature to 700-750°C at a heating rate of 8-10°C/min, keep it warm for 5-10min to ensure the uniformity of the overall temperature of the workpiece to be welded, and then raise the temperature to the first temperature at a heating rate of 5°C/min Preset the temperature and keep it warm for 5-10 minutes. At this time, the solder powder melts and forms a good metallurgical bond with the alloy on both sides. Finally, it cools down to room temperature at a cooling rate of 10°C/min to complete the welding.
[0042] Preferably, the first preset temperature in step S2 is the melting temperature of the adhesive tape solder, so as to ensure that the solder powder melts and forms a good metallurgical bond with the alloys on both sides.
[0043] Compared with the prior art, the brazing method of the present invention has two times of heat preservation before the brazing temperature, which ensures that the binder is fully decomposed, and at the same time improves the uniformity of the overall temperature of the workpiece to be welded, the structure is uniform, and the performance is excellent. After welding, the residual carbon content of the brazed joint is low, only 0.05%-0.5%.

Example Embodiment

[0044] Example 1
[0045] An embodiment of the present invention provides a method for preparing a binder for adhesive tape solder, comprising:
[0046] Mix 40g terpene resin and 60g dibutyl phthalate evenly, seal the container and let it stand for 18h, transfer the mixture to a stirrer, and stir for 5min at a speed of 60r/min to make a plasticizer; Dibutyl phthalate can also be replaced by one or more of N-methylpyrrolidone, acetone or ethyl acetate, and its quality is configured according to the weight ratio of each component;
[0047] Mix 75g of ethyl cellulose and 25g of absolute ethanol evenly, seal the container and let it stand for 18 hours, then transfer the mixture to a stirrer, and stir for 5 minutes at a speed of 60r/min to make a toughening agent; wherein ethyl cellulose is also It can be replaced by one or more of styrene-based thermoplastic elastomer, acrylonitrile-butadiene-styrene terpolymer, butadiene rubber, and one or both of ethyl acetate and acetone can be used for absolute ethanol. kind;
[0048] Put 50g of epoxy resin E44, 40g of plasticizer and 10g of toughening agent in a stirrer, and stir at a speed of 60r/min for 5min to obtain a binder.
[0049] The embodiment of the present invention provides a preparation method of adhesive tape solder, comprising:
[0050] Thoroughly mix solder particles with diameters of 5 μm, 10 μm, 30 μm, and 50 μm at a ratio of 10 g: 35 g: 35 g: 20 g to obtain solder powder;
[0051] Mix 10g of binder and 90g of solder powder evenly, place in a stirrer, and stir at a speed of 50r/min for 60min to obtain "paste" solder. The preparation is completed after the "paste" solder is rolled into a 0.5mm thick adhesive tape solder. In the welding test, the sticky solder has good wettability, low carbon residue, uniform joint structure and high joint strength.

Example Embodiment

[0052] Example 2
[0053] An embodiment of the present invention provides a method for preparing a binder for adhesive tape solder, comprising:
[0054] Mix 20g of terpene resin with 15g of dibutyl phthalate and 15g of ethyl acetate evenly, seal the container and let it stand for 12h, transfer the mixture to a stirrer, and stir for 10min at a speed of 30r/min.
[0055] made into plasticizers;
[0056] Evenly mix 84g of styrene-based thermoplastic elastomer with 16g of ethyl acetate, seal the container and let it stand for 12h, transfer the mixture to a stirrer, and stir at a speed of 50r/min for 8min to make a toughening agent;
[0057] 45g epoxy resin E44, 44g plasticizer and 11g toughening agent are fully mixed to obtain adhesive;
[0058] Fully mix the solder particles with diameters of 5 μm, 10 μm, 30 μm, and 50 μm in the ratio of 8g: 34g: 35g: 23g to obtain solder powder;
[0059] Mix 12g of binder and 88g of solder powder evenly, place in a stirrer, and stir at a speed of 60r/min for 30min to obtain "paste" solder. The preparation is completed by rolling the "paste" solder into a 1mm thick adhesive tape solder. In the welding test, the sticky solder has good wettability, low carbon residue, uniform joint structure and high joint strength.

PUM

PropertyMeasurementUnit
Thermal decomposition temperature160.0°C

Description & Claims & Application Information

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