Laser melting forming method and device for pure copper part

A laser melting and control device technology, which is applied in the direction of improving process efficiency, improving energy efficiency, and additive processing, can solve the problems of high difficulty in deformation control and complicated injection molding process, so as to avoid pure copper oxidation and process easy effect

Inactive Publication Date: 2020-11-17
NAT INST CORP OF ADDITIVE MFG XIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the injection molding process is complicated, the degree of deformation of the product is difficult to control, and there are many factors affecting defects. The content of debonding agent ne

Method used

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  • Laser melting forming method and device for pure copper part

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Comparison scheme
Effect test

Embodiment 1

[0058] The laser melting and forming experiment of copper parts was carried out on pure copper powder. The laser power was 400W, the scanning rate was 800mm / s, the substrate was heated to 200°C, and the layer thickness was 50 microns. Without thermal imaging and ultrasonic vibration closed-loop control, Before forming, the 40-layer forming surface showed obvious metallic luster, and the forming continued, the surface gradually darkened, and the surface unevenness was more obvious. Using an optical microscope to observe the metallographic sample in the furnace, it is found that there are a large number of unfused regions above 5mm in the sample.

Embodiment 2

[0060] The laser melting and forming experiment of copper parts is carried out on pure copper powder. The laser power is 400W, the scanning rate is 800mm / s, the substrate is heated to 200°C, and the layer thickness is 50 microns. Thermal imaging and ultrasonic vibration are used for closed-loop control. Ultrasonic vibration device The vibration frequency is 25KHz, and the output power can be adjusted within the range of 100-500W. The output power of ultrasonic vibration was controlled at 150W, and the energy input of the first 95 layers was found to be moderate through thermal imaging, and then the energy input was weak, and the metallic luster of the surface gradually weakened, but the smoothness of the surface was better than that of Example 1. Observing the internal tissue, it was found that no fusion occurred in the interval range of the sample height of 11-20mm, and the tissue was obviously better than that of Example 1.

Embodiment 3

[0062] The laser melting and forming experiment of copper parts is carried out on pure copper powder. The laser power is 400W, the scanning rate is 800mm / s, the substrate is heated to 200°C, and the layer thickness is 50 microns. Thermal imaging and ultrasonic vibration are used for closed-loop control. Ultrasonic vibration device The vibration frequency is 25KHz, and the output power can be adjusted within the range of 100-500W. Observe the effect of ultrasonic vibration on the defects in the furnace metallographic samples. No ultrasonic vibration is introduced into the first 40 layers, and ultrasonic vibration is introduced from the 40th to 80th layers. Thermal imaging shows that there is no significant difference in energy input compared with the first 40 layers; as the forming continues, the ultrasonic vibration is increased according to the molten pool temperature monitored by thermal imaging. Output power of vibration, homogenization of energy input area in the process. ...

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Abstract

The invention discloses a laser melting forming method and device for a pure copper part. The forming method comprises the steps that a substrate is arranged on a heating plate, and the substrate is preheated; a forming bin is vacuumized and then filled with inert gas; pure copper powder is stacked on the substrate layer by layer, laser scanning melting is carried out layer by layer according to apreset scanning path, and finally the pure copper part is formed; the forming method further comprises the steps that monitoring is carried out on the temperature of a molten pool in the laser scanning melting process; and when the temperature of the molten pool is lower than the preset temperature, the substrate is controlled to vibrate until the temperature of the molten pool is recovered to apreset temperature range value. According to the laser melting forming method and device for the pure copper part, the problem of pure copper oxidation can be avoided, the technological process is simple, convenient and stable, and the pure copper part can be formed at a time; and meanwhile, the liquidity of molten metal in a molten pool is improved, bubbles overflow quickly, the solidification state of the molten pool is improved under the action of ultrasonic vibration, sufficient feeding is achieved, and the phenomena of incomplete fusion in layers and poor interlayer bonding in the pure copper solidification process are reduced.

Description

[0001] The present application relates to the technical field of pure copper preparation, in particular to a laser melting forming method and forming device for pure copper parts. Background technique [0002] Pure copper has excellent electrical and thermal conductivity, and has high chemical stability. It has certain corrosion resistance in the atmosphere, fresh water and condensed water. It is often used in blast furnace tuyeres, cooling plates, blowers that require high thermal conductivity Oxygen nozzle and high conductivity electrode holder, electrical connector column and other parts. [0003] Generally, pure copper parts are formed by casting, powder metallurgy and injection molding. However, the casting process of pure copper is much more complicated than other copper alloys, the casting reject rate is high, and the product quality is up and down. The main problems are incomplete deoxidation, degassing and slag removal. Due to the poor fluidity of pure copper, large ...

Claims

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Application Information

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IPC IPC(8): B22F3/105B33Y10/00B33Y30/00B33Y50/02
CPCB33Y10/00B33Y30/00B33Y50/02Y02P10/25
Inventor 孙苗卢秉恒马明贺琛
Owner NAT INST CORP OF ADDITIVE MFG XIAN
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