Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Nano-diamond cutter and preparation method and application thereof

A technology of nano-diamond and diamond tools, which is applied in metal processing equipment, manufacturing tools, welding equipment, etc., and can solve problems such as difficult welding and difficult preparation of diamond tools

Active Publication Date: 2020-12-04
SHANGHAI ZHENGSHI TECH CO LTD
View PDF8 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although diamond is a known superhard material, it has many excellent properties, such as the highest hardness, the best wear resistance, etc.; but at the same time, it is precisely because of its unique high hardness, wear resistance , Difficult to weld and other characteristics, and make the preparation of diamond tools more difficult
With the continuous improvement of model accuracy, reliability, hit rate and service life in civil or military aspects, my country's diamond tool production requirements have not yet reached the ideal level

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Nano-diamond cutter and preparation method and application thereof
  • Nano-diamond cutter and preparation method and application thereof
  • Nano-diamond cutter and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] This example provides a kind of preparation method of nano-diamond cutting tool, and it comprises the steps:

[0070] (1) Pretreatment process: 5mm square CVD single crystal diamond

[0071] Stress microscope inspection: check that there is more stress inside the diamond, and the stress is less;

[0072] X-ray transmission inspection: no cracks or holes inside the diamond;

[0073] Heat treatment: high-purity nitrogen (99.99%), 650°C, 10h;

[0074] Cold treatment: no;

[0075] Heat treatment: no;

[0076] (2) Cutting and shaping process: laser directional cutting (the power of the laser cutting is 500W, the wavelength is 192nm), and four 2.5mm square diamond single crystal substrates are obtained;

[0077] (3) Polishing process:

[0078] Matrix orientation: X-ray diffraction orientation;

[0079] Substrate fixation: take (100) crystal face grinding, use silver brazing, welding in argon protective atmosphere, welding temperature 450-600 ℃;

[0080] Substrate polis...

Embodiment 2

[0090] This example provides a kind of preparation method of nano-diamond cutting tool, and it comprises the steps:

[0091] (1) Pretreatment process: irregular high temperature and high pressure single crystal diamond with a diameter of 5 mm;

[0092] Stress microscope inspection: check that there are a large number of irregular stress layers inside the diamond, and the stress is relatively large;

[0093] X-ray transmission inspection: there are cracks on the surface and inside, and there are a large number of uneven nanometer to micrometer holes inside;

[0094] Heat treatment: high-purity nitrogen (99.99%), 650°C, 10h;

[0095] Cold treatment: liquid nitrogen (minus 196°C), treatment for 5 hours;

[0096] Hot pressing treatment: 130MPa, 180℃, 10h;

[0097] (2) Cutting and shaping process: laser directional cutting (the power of the laser cutting is 1kW, the wavelength is 512nm), 1 piece of 2.5mm irregular single crystal substrate, 3 pieces of 0.2-0.5mm irregular single ...

Embodiment 3

[0111] This example provides a kind of preparation method of nano-diamond cutting tool, and it comprises the steps:

[0112] (1) Pretreatment process: irregular natural single crystal diamond with a diameter of 5mm;

[0113] Stress microscope inspection: check that there are a large number of irregular stress layers inside the diamond, and the stress is relatively large;

[0114] X-ray transmission inspection: there are cracks on the surface and inside;

[0115] Heat treatment: high-purity nitrogen (99.99%), 650°C, 10h;

[0116] Cold treatment: no;

[0117] Hot pressing treatment: 130MPa, 180℃, 10h;

[0118] (2) Cutting and shaping process: laser directional cutting (the power of the laser cutting is 2kW, the wavelength is 1190nm), to obtain 2 pieces of 2.5mm irregular single crystal substrates, and 2 pieces of 0.2-0.5mm irregular single crystal substrates;

[0119] (3) Polishing process:

[0120] Matrix orientation: X-ray diffraction orientation;

[0121] Substrate fixa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
surface roughnessaaaaaaaaaa
surface roughnessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a preparation method and application of a nano-diamond cutter. Diamond is adopted as a raw material in the method, and the method includes a cutting and shaping procedure, a polishing procedure and a cutting edge machining procedure, and further particularly comprises a pretreatment procedure carried out before the cutting and shaping procedure and a surface modification procedure carried out after the cutting edge machining procedure. The pretreatment procedure is used for eliminating defects in the diamond as much as possible; the surface modification procedure is used for forming a protective layer on the surface of a cutting edge; in the polishing procedure, firstly, a diamond cutter base material is detected to recognize the crystal face of the diamond, then the crystal face (100) or the crystal face (110) of the diamond is selected to be subjected to subsequent polishing, and the polished crystal face serves as a front cutter face; and a protective cuttergrinding method or a laser directional cleavage method is adopted in the cutting edge machining procedure. The nano-diamond cutter prepared through the method can reach the cutting edge precision of 15 nm, and is suitable for being applied to the fields of turning, nano-probes, biological sectioning and the like.

Description

technical field [0001] The invention belongs to the field of preparation of diamond cutters, and in particular relates to a nanometer diamond cutter and its preparation method and application. Background technique [0002] At present, in the processing of ultra-precision optical devices and ultra-high-precision optical devices, especially for nano-precision ultra-precision processing, whether it is for civil or national defense, it occupies an increasingly important proportion, such as grazing in X-ray telescopes. The mirror surface requires ultra-precision machining to meet the axial shape accuracy of 0.2μm, the radial arc accuracy of 2μm / 1.5m and the surface roughness of RMS5nm; another example is the aluminum-based disk of the computer hard disk storage, the surface roughness of the ultra-precision machining The lower the degree, the larger the storage capacity and the higher the reading rate of the magnetic head; in addition, in the optical systems of CCD, digital camera...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B23K26/38C23C16/50C23C16/34C23C16/02C23C16/32
CPCB24B29/02B23K26/38C23C16/50C23C16/345C23C16/0245C23C16/325
Inventor 王涛王箫满卫东张雪梅朱长征徐念龚闯
Owner SHANGHAI ZHENGSHI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com