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A kind of nanometer diamond tool and its preparation method and application

A nano-diamond and diamond tool technology, applied in metal processing equipment, manufacturing tools, welding equipment and other directions, can solve the problems of difficult welding and difficult preparation of diamond tools.

Active Publication Date: 2021-03-23
SHANGHAI ZHENGSHI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although diamond is a known superhard material, it has many excellent properties, such as the highest hardness, the best wear resistance, etc.; but at the same time, it is precisely because of its unique high hardness, wear resistance , Difficult to weld and other characteristics, and make the preparation of diamond tools more difficult
With the continuous improvement of model accuracy, reliability, hit rate and service life in civil or military aspects, my country's diamond tool production requirements have not yet reached the ideal level

Method used

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  • A kind of nanometer diamond tool and its preparation method and application
  • A kind of nanometer diamond tool and its preparation method and application
  • A kind of nanometer diamond tool and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] This example provides a kind of preparation method of nano-diamond cutting tool, and it comprises the steps:

[0070] (1) Pretreatment process: 5mm square CVD single crystal diamond

[0071] Stress microscope inspection: check that there is more stress inside the diamond, and the stress is less;

[0072] X-ray transmission inspection: no cracks or holes inside the diamond;

[0073] Heat treatment: high-purity nitrogen (99.99%), 650°C, 10h;

[0074] Cold treatment: no;

[0075] Heat treatment: no;

[0076] (2) Cutting and shaping process: laser directional cutting (the power of the laser cutting is 500W, the wavelength is 192nm), and four 2.5mm square diamond single crystal substrates are obtained;

[0077] (3) Polishing process:

[0078] Matrix orientation: X-ray diffraction orientation;

[0079] Substrate fixation: take (100) crystal face grinding, use silver brazing, welding in argon protective atmosphere, welding temperature 450-600 ℃;

[0080] Substrate polis...

Embodiment 2

[0090] This example provides a kind of preparation method of nano-diamond cutting tool, and it comprises the steps:

[0091] (1) Pretreatment process: irregular high temperature and high pressure single crystal diamond with a diameter of 5 mm;

[0092] Stress microscope inspection: check that there are a large number of irregular stress layers inside the diamond, and the stress is relatively large;

[0093] X-ray transmission inspection: there are cracks on the surface and inside, and there are a large number of uneven nanometer to micrometer holes inside;

[0094] Heat treatment: high-purity nitrogen (99.99%), 650°C, 10h;

[0095] Cold treatment: liquid nitrogen (minus 196°C), treatment for 5 hours;

[0096] Hot pressing treatment: 130MPa, 180℃, 10h;

[0097] (2) Cutting and shaping process: laser directional cutting (the power of the laser cutting is 1kW, the wavelength is 512nm), 1 piece of 2.5mm irregular single crystal substrate, 3 pieces of 0.2-0.5mm irregular single ...

Embodiment 3

[0111] This example provides a kind of preparation method of nano-diamond cutting tool, and it comprises the steps:

[0112] (1) Pretreatment process: irregular natural single crystal diamond with a diameter of 5mm;

[0113] Stress microscope inspection: check that there are a large number of irregular stress layers inside the diamond, and the stress is relatively large;

[0114] X-ray transmission inspection: there are cracks on the surface and inside;

[0115] Heat treatment: high-purity nitrogen (99.99%), 650°C, 10h;

[0116] Cold treatment: no;

[0117] Hot pressing treatment: 130MPa, 180℃, 10h;

[0118] (2) Cutting and shaping process: laser directional cutting (the power of the laser cutting is 2kW, the wavelength is 1190nm), to obtain 2 pieces of 2.5mm irregular single crystal substrates, and 2 pieces of 0.2-0.5mm irregular single crystal substrates;

[0119] (3) Polishing process:

[0120] Matrix orientation: X-ray diffraction orientation;

[0121] Substrate fixa...

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Abstract

The invention discloses a method for preparing a nano-diamond tool and its application. The method uses diamond as a raw material. In addition to the cutting and shaping process, the polishing process and the cutting edge processing process, it also particularly includes the pre-processing before the cutting and shaping process. Treatment process and the surface modification process carried out after the edge processing process, wherein the pretreatment process is used to eliminate the defects in the diamond as much as possible; the surface modification process is used to form a protective layer on the edge surface; in the polishing process: first The diamond tool base material is tested to identify the crystal plane of the diamond, and then the (100) crystal plane or (110) crystal plane of the diamond is selected for subsequent polishing, and the polished crystal plane is used as the rake face; the cutting edge processing process adopts Protective sharpening method or laser directional cleaving method. The nano-diamond tool produced by the invention can achieve a cutting edge precision of 1-5nm, and is suitable for application in fields such as turning, nano-probes, and biological slices.

Description

technical field [0001] The invention belongs to the field of preparation of diamond cutters, and in particular relates to a nanometer diamond cutter and its preparation method and application. Background technique [0002] At present, in the processing of ultra-precision optical devices and ultra-high-precision optical devices, especially for nano-precision ultra-precision processing, whether it is for civil or national defense, it occupies an increasingly important proportion, such as grazing in X-ray telescopes. The mirror surface requires ultra-precision machining to meet the axial shape accuracy of 0.2μm, the radial arc accuracy of 2μm / 1.5m and the surface roughness of RMS5nm; another example is the aluminum-based disk of the computer hard disk storage, the surface roughness of the ultra-precision machining The lower the degree, the larger the storage capacity and the higher the reading rate of the magnetic head; in addition, in the optical systems of CCD, digital camera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B29/02B23K26/38C23C16/50C23C16/34C23C16/02C23C16/32
CPCB24B29/02B23K26/38C23C16/50C23C16/345C23C16/0245C23C16/325
Inventor 王涛王箫满卫东张雪梅朱长征徐念龚闯
Owner SHANGHAI ZHENGSHI TECH CO LTD
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