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Electrolyte of high-elongation electrolytic copper foil and application of electrolyte

A technology of electrolytic copper foil and electrolyte, applied in electrolysis process, electroforming and other directions, can solve the problems of unclear component content control and use, difficult production process control, many additive components, etc., to achieve good quality stability, Adjustment of roughness and mechanical properties, effect of less additive composition

Active Publication Date: 2020-12-22
ZHEJIANG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Generally speaking, although the research on the additive formula of electrolytic copper foil is extensive, the existing additive components have many components and complex functions, and the control and use of each component content are not clear, and the production process control is very difficult.

Method used

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  • Electrolyte of high-elongation electrolytic copper foil and application of electrolyte
  • Electrolyte of high-elongation electrolytic copper foil and application of electrolyte
  • Electrolyte of high-elongation electrolytic copper foil and application of electrolyte

Examples

Experimental program
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Effect test

Embodiment 1

[0042] (1) Electrolyte is configured by copper sulfate pentahydrate, sulfuric acid, hydrochloric acid, sulfur-containing organic matter solution and deionized water, wherein the concentration of copper ions is 70g / L, the concentration of sulfuric acid is 80g / L, and the concentration of chloride ions is 16 mg / L. The concentration of sodium polydithiodipropane sulfonate is 1.0mg / L, and the prepared electrolyte is poured into the flat plate electroplating device.

[0043] (2) A titanium plate coated with an iridium dioxide coating and a pure titanium plate are used as the anode plate and the cathode plate respectively, and the two plates are placed in the electrolyte in parallel. Among them, the deposition surface of the cathode plate is polished with 2000 mesh water sandpaper and polished to a surface roughness of Ra=0.15 μm with a 2.5 μm polishing agent. Use running water to wash from the upper part of the cathode plate to the lower part, and use absorbent cotton to wipe down sl...

Embodiment 2

[0048] The concentration of sodium polydithiodipropane sulfonate is 3mg / L, the concentration of chloride ion is 20mg / L, the deposition temperature is 60°C, and the current density is 65 A / dm 2 , and the rest are the same as in Embodiment 1.

[0049] The matte roughness Rz of the prepared copper foil is 1.882 μm, the (220) texture coefficient accounts for 69.81%, the color of the copper foil is normal, and the warpage is less than 10mm; after being stored at room temperature for one month, the room temperature tensile strength of the copper foil is 312MPa, The elongation at room temperature is 10.67%.

Embodiment 3

[0051] The copper ion concentration is 100g / L, the sulfuric acid concentration is 130g / L, the sodium polydisulfide dipropane sulfonate concentration is 5mg / L, and the chloride ion concentration is 40mg / L, and all the other are identical with embodiment one.

[0052] The matte roughness Rz of the prepared copper foil is 1.612 μm, the (220) texture coefficient accounts for 71.81%, the color of the copper foil is normal, and the warpage is less than 10mm; after being stored at room temperature for one month, the normal temperature tensile strength of the copper foil is 332MPa, The elongation at room temperature is 10.1%.

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Abstract

The invention discloses an electrolyte of high-elongation electrolytic copper foil. The electrolyte contains copper sulfate, sulfuric acid, deionized water and an additive, wherein the additive contains a sulfur-containing organic matter and chloride ions; the head group of the sulfur-containing organic matter at least contains one thiol group or disulfide group, and the tail end of the sulfur-containing organic matter at least contains one acidic sulfonic acid group; and the chlorine ions are introduced by adding hydrochloric acid or copper chloride. The concentration range of sulfur-containing organic matter in the electrolyte is 0-5mg / L, and the concentration range of the chloride ions is 1-40mg / L. The invention also discloses a method for preparing the electrolytic copper foil by usingthe electrolyte, the (220) surface texture coefficient of the electrolytic copper foil prepared with the method accounts for 50%-70%, the normal-temperature elongation is 7%-11%, and the normal-temperature tensile strength is greater than 300 MPa.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil preparation, and in particular relates to an electrolytic solution of electrolytic copper foil containing additives and its application. Background technique [0002] Due to the advantages of simple production process, high efficiency and low cost, electrolytic copper foil is widely used in the production of copper clad laminates, printed circuit boards and lithium-ion battery negative materials. Copper foil is often subjected to high temperature and high pressure during processing and use. The higher elongation can ensure that the copper foil will not crack or break during processing, which is conducive to improving the stability of printed circuit boards and the capacity of lithium-ion batteries. , cycle life, etc. During the electrodeposition process of copper ions, due to the different growth rates of each crystal plane, there will be a phenomenon of preferred orientation, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D1/04C25D3/38
CPCC25D1/04C25D3/38
Inventor 刘嘉斌刘玲玲潘建锋韩高荣孙玥方攸同
Owner ZHEJIANG UNIV
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