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Liquid metal flexible electron and preparation method and application thereof

A liquid metal, flexible technology, applied in applications, other household appliances, printed circuit manufacturing, etc., can solve problems such as high cost, unsuitable for large-scale application promotion, and cumbersome processes

Active Publication Date: 2021-01-01
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Microchannels are constructed by photolithography, the process is cumbersome and costly, and it is not suitable for large-scale application and promotion
Using a 3D metal printer to directly print flexible circuits, although the manufacturing process is simplified and materials are saved, the cost of this 3D metal printer is still high

Method used

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  • Liquid metal flexible electron and preparation method and application thereof
  • Liquid metal flexible electron and preparation method and application thereof
  • Liquid metal flexible electron and preparation method and application thereof

Examples

Experimental program
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preparation example Construction

[0041] The invention provides a method for preparing liquid metal flexible electronics, comprising the following steps;

[0042] According to the circuit pattern, the ABS plastic model is obtained by 3D printing;

[0043] Ion sputtering is carried out on the surface of the ABS plastic model to form a gold film to obtain a gold-plated ABS circuit;

[0044] Putting Ecoflex silica gel into the mold, then placing the gold-plated ABS circuit in the air in the mold, so that the gold-plated ABS circuit does not contact the mold, and then curing to obtain a cured model;

[0045] The cured model was soaked in acetone to dissolve the ABS plastic model, and a microchannel with gold plating on the inner wall was obtained in the Ecoflex substrate;

[0046] Injecting gallium indium eutectic into the microchannel with gold plating on the inner wall, then inserting copper wires into the liquid metal at both ends of the microchannel with gold plating on the inner wall, and then attaching gold p...

Embodiment 1

[0065] Use relevant software to draw circuit patterns in the computer, and print out the ABS plastic model with a 3D printer; place the printed ABS plastic model in an ion sputtering device for 60 seconds, and coat a layer of gold film on its surface; Put the silica gel into the mold, then place the gold-plated ABS circuit in the air, let it stand at room temperature for 2 hours to cure, and get the cured model; soak the cured model (including the cured Ecoflex and ABS model) together in the acetone solution for 12 hours , acetone dissolves the ABS model, takes out the Ecoflex in which the ABS is completely dissolved from the acetone solution, and after rinsing, a microchannel with gold plating on the inner wall is obtained in the Ecoflex substrate; the gallium indium eutectic (EGaIn, Ga: 74.5%, In: 25.5%, wt%) is injected from one end of the channel, and then a copper wire with a length of 60mm is inserted into the liquid metal at both ends of the channel, and then Ecoflex sil...

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Abstract

The invention provides a liquid metal flexible electron and a preparation method and application thereof, and belongs to the technical field of liquid metal flexible electrons. According to the method, the characteristic that ABS plastic can be dissolved by acetone is utilized, 3D printing is utilized, a micro-channel is rapidly constructed in the Ecoflex silica gel which is a flexible substrate,and then liquid metal is injected into the channel to complete manufacturing of flexible electrons. According to the method, a traditional photoetching process does not need to be adopted for micro-channel construction, the operation steps can be greatly simplified, and the cost is reduced. A gold film on the surface of ABS is transferred to the surface of the Ecoflex silica gel flexible substrate, the wettability of liquid metal in a channel is improved, subsequent liquid metal injection operation is facilitated, and the prepared liquid metal flexible circuit is high in elasticity, can meet various deformation requirements and is stable in electrical performance in the service process.

Description

technical field [0001] The invention relates to the technical field of liquid metal flexible electronics, in particular to a liquid metal flexible electronics and its preparation method and application. Background technique [0002] Liquid metals such as gallium-based and bismuth-based alloys are a large class of emerging functional materials with unique physical and chemical properties. They are liquid at room temperature and have properties such as high boiling point, strong electrical conductivity, and high thermal conductivity. The manufacturing process does not require high-temperature smelting. It is environmentally friendly and non-toxic, and has low melting point characteristics that conventional high melting point metal materials do not have. Its shaping ability in molten state creates conditions for quickly creating different forms of functional devices, and is very suitable for the manufacture of flexible electronics. [0003] At present, the methods for preparing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K1/11H05K3/10
CPCH05K1/09H05K1/118H05K3/107H05K2203/1327B33Y80/00B29L2031/34B29K2055/02B29C64/30B33Y40/20C23C14/205H05K3/103H05K3/16H05K2203/1305H05K2203/1311H05K3/1241H05K3/105H05K2203/1322H05K3/125
Inventor 冯亮刘雅铭冯欢欢王丽张月月张振超王敏郑婷婷赵维巍马星张嘉恒
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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