Composite solder preformed sheet as well as preparation method and packaging method thereof

A technology of preformed sheet and composite welding, which is applied in welding equipment, welding/cutting media/materials, manufacturing tools, etc. It can solve the problems of fast interface diffusion rate and interface performance degradation, achieve rapid preparation, improve compatibility, and inhibit The effect of substrate element diffusion
CN112192085APending Publication Date: 2021-01-08HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
Publication Date
2021-01-08
Patent Text Reader

Abstract

The invention provides a composite solder preformed sheet as well as a preparation method and a packaging method thereof. The composite solder preformed sheet comprises a substrate; the substrate is apre-sintered silver film; one side or two sides of the substrate is / are provided with a solder layer / solder layers; and solder of the solder layers is low-temperature tin-based solder or high-temperature frit. With adoption of the technical scheme, the composite solder preformed sheet can effectively improve the compatibility of sintered silver and a heterogeneous substrate interface, connectionbetween the sintered silver solder and different metal substrates or ceramic substrates is achieved, in addition, an intermetallic compound or a glassy barrier layer can be generated through the interface, substrate element diffusion is inhibited, the reliability of the sintering welding spot is enhanced, the interface connection performance of the sintered silver material and different metal or ceramic interfaces is improved, and rapid preparation of the low-temperature interconnection high-temperature service welding spot can be achieved.
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Description

technical field

[0001] The invention belongs to the technical field of electronic materials, and in particular relates to a composite solder preform, a preparation method thereof, and a packaging method. Background technique

[0002] At present, power semiconductor devices are widely used in the field of power electronics, which can realize functions such as power conversion and signal control of power equipment. Power semiconductor chips generate a lot of heat due to their high frequency and high current density in service. In order to ensure the reliable operation of the chip, it is necessary to dissipate the heat through the connection material with high heat dissipation. In addition, in order to reduce the thermal stress after soldering and improve device reliability, low-temperature connection is also one of the demands of chip packaging.

[0003] Nano-silver solder, such as nano-silver paste and nano-silver film, is currently the most promising interconnect material ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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