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Preparation method of copper alloy composite material for electronic packaging and product

A technology of electronic packaging and composite materials, which is applied in the direction of metal material coating technology, electrolytic coating, liquid chemical plating, etc., can solve the problem that the comprehensive performance cannot meet the high requirements of electronic packaging, and achieve the improvement of electromagnetic shielding performance and electromagnetic shielding performance High, the effect of improving thermal conductivity

Active Publication Date: 2021-01-29
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The preparation of traditional copper alloy materials is simply a multi-phase combination, and its comprehensive performance can no longer meet the high requirements of electronic packaging. How to improve the comprehensive performance of copper alloy composite materials and play a role in promoting the development of the electronic information industry is the current research topic focus

Method used

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  • Preparation method of copper alloy composite material for electronic packaging and product
  • Preparation method of copper alloy composite material for electronic packaging and product
  • Preparation method of copper alloy composite material for electronic packaging and product

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Experimental program
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Effect test

Embodiment 1

[0036] The preparation of copper alloy composite material for electronic packaging comprises the following steps:

[0037] (1) Preparation of electroless silver-plating solution: in the silver nitrate solution with a concentration of 10g / L, add ammoniacal liquor with a mass fraction of 25% until the solution is clarified to obtain the electroless silver-plating main salt solution; glucose is added to deionized water to obtain the concentration 100g / L reducing solution;

[0038] (2) Preparation of electroplating solution: Add nickel sulfate hexahydrate solution, nickel dichloride hexahydrate solution, ascorbic acid solution, iron salt solution, sodium saccharin solution, sodium lauryl sulfate solution and water dispersion of CNTs to the boric acid solution in sequence solution, obtain electroplating solution, wherein the concentration of boric acid is 15g / L, the concentration of nickel sulfate hexahydrate is 100g / L, the concentration of nickel dichloride solution hexahydrate is...

Embodiment 2

[0043] Preparation of copper alloy composite materials for electronic packaging:

[0044] (1) The preparation of electroless silver plating solution: in the silver nitrate solution that concentration is 8g / L, add the ammoniacal liquor that mass fraction is 20% to solution clarification, obtain electroless silver plating main salt solution; Glucose is added in deionized water, obtain concentration 110g / L reducing solution;

[0045] (2) Preparation of electroplating solution: Add nickel sulfate hexahydrate solution, nickel dichloride hexahydrate solution, ascorbic acid solution, iron salt solution, sodium saccharin solution, sodium lauryl sulfate solution and water dispersion of CNTs to the boric acid solution in sequence solution, obtain electroplating solution, wherein the concentration of boric acid is 25g / L, the concentration of nickel sulfate hexahydrate is 130g / L, the concentration of nickel dichloride solution hexahydrate is 15g / L, the concentration of ascorbic acid is 3g...

Embodiment 3

[0050] The preparation of copper alloy composite material for electronic packaging comprises the following steps:

[0051] (1) Preparation of electroless silver plating solution: in the silver nitrate solution whose concentration is 12g / L, adding mass fraction is 30% ammoniacal liquor to solution clarification, obtains electroless silver plating main salt solution; Glucose is added in deionized water, obtains concentration 90g / L reducing solution;

[0052] (2) Preparation of electroplating solution: Add nickel sulfate hexahydrate solution, nickel dichloride hexahydrate solution, ascorbic acid solution, iron salt solution, sodium saccharin solution, sodium lauryl sulfate solution and water dispersion of CNTs to the boric acid solution in sequence solution, obtain electroplating solution, wherein the concentration of boric acid is 20g / L, the concentration of nickel sulfate hexahydrate is 115g / L, the concentration of nickel dichloride solution hexahydrate is 12g / L, the concentrat...

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Abstract

The invention discloses a preparation method of a copper alloy composite material for electronic packaging and the product. The method comprises the following steps: preparing an electroplating solution; carrying out chemical silvering and heat treatment on polyurethane foam to remove the polyurethane foam to obtain silver foam; electroplating the silver foam to obtain carbon nanotube / iron / nickel(CNTs / Fe / Ni) composite foam, and carrying out heat treatment; and filling copper powder, carrying out cold press molding, and carrying out hot press sintering to finally obtain the copper alloy composite material. The CNTs / Fe / Ni composite foam is used as a three-dimensional framework reinforcing phase, the filling copper powder is used as a tough phase, large-area agglomeration of the CNTs does not occur inside, and the structural integrity of the material is reserved. The prepared copper alloy composite material is high in electromagnetic shielding performance, good in heat conductivity, highin tensile strength, good in ductility and low in expansion coefficient, and the performance requirement of copper alloy for electronic packaging is met.

Description

technical field [0001] The invention belongs to the technical field of copper alloy materials for electronic packaging, and in particular relates to a method for preparing a copper alloy composite material for electronic packaging and a product thereof. Background technique [0002] Due to its excellent electrical and thermal conductivity, copper alloy materials are widely used in integrated circuits, heat dissipation and electrical contact materials. At present, modern electronic products are developing in the direction of thinness, small size and high density. Therefore, the performance requirements of copper alloy materials for electronic packaging are gradually increasing, such as: tensile strength, ductility, electromagnetic shielding performance and thermal conductivity. [0003] The preparation of traditional copper alloy materials is simply a multi-phase combination, and its comprehensive performance can no longer meet the high requirements of electronic packaging. H...

Claims

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Application Information

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IPC IPC(8): C22C9/00C23C18/44C23C18/16C25D5/54C25D15/00C25D3/56C22C1/10
CPCC22C9/00C22C26/00C23C18/44C23C18/1644C23C18/1641C25D5/54C25D15/00C25D3/562C22C1/10C22C2026/002
Inventor 刘意春陈雅芝汪从珍李凤仙陶静梅李才巨鲍瑞方东易健宏
Owner KUNMING UNIV OF SCI & TECH