Unlock instant, AI-driven research and patent intelligence for your innovation.

A low thermal expansion coefficient polyimide film and its production process

A technology of polyimide film and low thermal expansion coefficient, which is applied in the field of polyimide film with low thermal expansion coefficient and its production process, can solve the problems of limited application range and large thermal expansion coefficient, and achieve excellent optical performance and low thermal expansion Coefficient of CTE, the effect of excellent mechanical properties

Active Publication Date: 2022-08-02
湖南国柔科技有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional polyimide film has a large coefficient of thermal expansion (CTE generally ranging from 40-65ppm / K), which is much higher than the CTE of the metal substrate (copper foil is about 17ppm / K), which greatly limits range of application

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A low thermal expansion coefficient polyimide film and its production process
  • A low thermal expansion coefficient polyimide film and its production process
  • A low thermal expansion coefficient polyimide film and its production process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A polyimide film with a low thermal expansion coefficient, the production process of which comprises the following steps:

[0026] S1. Synthesis of polyamic acid:

[0027] Under an inert gas atmosphere and an ice-water bath, 20 mmol of the diamine represented by the structural formula (I) and 5 mmol of 4,4'-diaminobenzoic anilide (DBN) were dissolved in 68.044 g of N,N-dimethylformaldehyde acetamide, and then add pyromellitic dianhydride (26 mmol in total) in 4 times under ice-water bath, every interval of 8-10 minutes, after the addition is completed, continue to stir the reaction under ice-water bath for 7 hours until it is completely dissolved, and the solid is obtained. The content is 32% viscous polyamic acid solution;

[0028] Wherein, the preparation method of the diamine shown in structural formula (I) comprises the following steps:

[0029] Step 1, add 15.8g p-chloronitrobenzene, 7.7g 3,5-dihydroxybenzoic acid, 41.4g anhydrous potassium carbonate and 200mL N,...

Embodiment 2

[0036] A kind of polyimide film of low thermal expansion coefficient, the production technique of this film is identical with embodiment 1, except in the synthesis of polyamic acid, the pyromellitic dianhydride of 26mmol is replaced with the 3,3' of 26mmol, 4,4'-diphenyl ether tetracarboxylic dianhydride, the related performance test results of the polyimide film products obtained therefrom are also shown in Table 1.

Embodiment 3

[0038] A kind of polyimide film of low thermal expansion coefficient, the production technique of this film is identical with embodiment 1, except in the synthesis of polyamic acid, the pyromellitic dianhydride of 26mmol is replaced with the 3,3' of 26mmol, 4,4'-biphenyltetracarboxylic dianhydride, the related performance test results of the polyimide film products obtained therefrom are also shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a polyimide film with a low thermal expansion coefficient and a production process thereof. The production process comprises the following steps: S1, adding diamine into an organic solvent under an inert gas atmosphere and an ice-water bath to form a solution I; S2, adding the dianhydride to the solution I for a stirring reaction to obtain a polyamic acid solution; S3, subjecting the obtained polyamic acid solution to imidization treatment to obtain a polyimide film. Wherein, the diamine is a diamine containing an ether bond group, a benzimidazole group and a fluorine-containing group. The polyimide film provided by the present invention simultaneously introduces structural units such as ether bond groups, amide groups, benzimidazole groups and fluorine-containing groups into the repeating structural units of the polymer chain, so that the final prepared polyimide film The amine film not only exhibits excellent optical properties, excellent mechanical properties, thermal stability and light transmittance, but also obtains a low thermal expansion coefficient CTE. The polyimide film can be used as a base film material in flexible printed circuit boards.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyimide film with a low thermal expansion coefficient and a production process thereof. Background technique [0002] Polyimide film is a very important film material with very good thermal stability, mechanical properties and electrical properties, and has been widely used in space, microelectronics, new energy and other fields. Polyimide is often used as the base film material of flexible circuit boards, which requires it to have a low coefficient of linear thermal expansion (CTE) to match the CTE of the metal substrate, so as to avoid the difference in CTE during the heat treatment process and cooling process. Too much will cause the film to curl, break, peel and other problems. The traditional polyimide film has a large coefficient of thermal expansion (CTE is generally in the range of 40-65ppm / k), much higher than the CTE of the metal substrate (copper foil is...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18C07D235/18
CPCC08G73/1071C08G73/1042C08G73/1039C08G73/1078C08G73/1007C08J5/18C07D235/18C08J2379/08
Inventor 高保清项婧侯忞辰蒲明良
Owner 湖南国柔科技有限公司