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Water-based electronickelling sealing agent and preparation method thereof

A technology of electroplating nickel and sealing agent, applied in the field of water-based nickel electroplating sealer and preparation, can solve problems such as poor resistance to salt spray corrosion, achieve good sealing effect, enhance wettability, and improve resistance to salt spray corrosion. Effect

Active Publication Date: 2021-02-26
上海昕沐化学科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above-mentioned shortcoming of prior art, the object of the present invention is to provide a kind of water-based electroplating nickel sealing agent, is used to solve the problem of poor salt spray corrosion resistance of water-based electroplating nickel sealing agent in the prior art, at the same time, The present invention will also provide a kind of preparation method of water-based electroplating nickel sealing agent

Method used

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  • Water-based electronickelling sealing agent and preparation method thereof
  • Water-based electronickelling sealing agent and preparation method thereof
  • Water-based electronickelling sealing agent and preparation method thereof

Examples

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Embodiment 1

[0061] The raw materials used in Examples 1 to 5 are all the same except for the complexing agent, but the proportions are different. The imidazole heterocycles and derivatives thereof added in the water-based electroplating nickel sealing agent of Examples 1 to 5 are respectively Imidazole (Example 1), Methylimidazole (Example 2), Benzotriazole (Example 3), Tolylbenzotriazole (Example 4) and Methylimidazole (Example 5). There are certain differences between Embodiment 6 and Embodiment 7 and Embodiment 1 to Embodiment 5 in terms of raw materials.

[0062] The preparation process of the water-based electroplating nickel sealing agent of embodiment 1~embodiment 7 is as follows:

[0063] 1. Add alcohol solvent into the container, then add the fused heterocyclic compound containing mercapto (-SH), stir until completely dissolved, divide the water into two parts with similar volumes, add one part into the container and continue stirring until the solution is clear;

[0064] 2. Add...

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Abstract

The invention relates to the technical field of water-based electronickelling sealing agents, in particular to a water-based electronickelling sealing agent. The agent is prepared from the raw materials in parts: 30-150 parts of an alcohol solvent, 2-20 parts of a sulfydryl-containing fused heterocyclic compound, 30-150 parts of alkylol amine, 10-80 parts of an anionic surfactant, 1-8 parts of fatty amine polyoxyethylene ether, 30-150 parts of alcohol ether, 0.5-15 parts of a complexing agent, and 500-850 parts of water. The preparation method includes the steps of mixing the raw materials, and stirring to clarify. The water-based electronickelling sealing agent solves the problem of poor salt spray corrosion resistance of a water-based electronickelling sealing agent in the prior art, canform a bright and transparent adsorption film on the electronickelling surface, seals pores in the surface of a nickel layer, and remarkably improves the salt spray corrosion resistance of an electronickelling layer. In addition, after being sealed by the water-based electronickelling sealing agent, the electronickelling surface does not need to be heated and dried, and can directly enter a processing procedure after being naturally aired in air.

Description

technical field [0001] The invention relates to the technical field of water-based electroplating nickel sealing agent, in particular to a water-based electroplating nickel sealing agent and a preparation method. Background technique [0002] Electroplated nickel has excellent anti-corrosion and wear-resistant properties. It is often used as the conduction, decoration, protection or functional layer of components, and is used in various fields such as aerospace, national defense and military, consumer electronics, petrochemical and civil construction. However, in the process of electroplating nickel, due to the influence of the properties of the substrate, process parameters and electrolyte conditions, it is difficult to ensure that the deposition of nickel atoms is completely dense. hole. For electroplated nickel with pores, the oxidizing medium in the external environment can easily invade the coating, corrode the substrate, and cause the electroplated nickel layer to los...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/48
CPCC25D5/48
Inventor 章磊陈金明李政柱
Owner 上海昕沐化学科技有限公司
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