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Liquid crystal polymer film and manufacturing method thereof

A liquid crystal polymer and liquid crystal technology, applied in chemical instruments and methods, electronic equipment, layered products, etc., can solve the problem that the heat resistance and high frequency characteristics of the liquid crystal polymer film are difficult to simultaneously achieve and highlight the potential of industrial application , low energy consumption, strong binding effect

Active Publication Date: 2021-03-12
UNIV OF SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The present invention mainly solves the problem that the bonding strength between the liquid crystal polymer film and the metal foil and the heat resistance and high-frequency characteristics of the liquid crystal polymer film are difficult to be simultaneously achieved in the process of preparing the circuit substrate of the liquid crystal polymer material in the prior art. technical issues

Method used

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  • Liquid crystal polymer film and manufacturing method thereof
  • Liquid crystal polymer film and manufacturing method thereof
  • Liquid crystal polymer film and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0057] Core LCD polymer layer 1 liquid crystal polymer resin selective melting point T m1 The liquid crystal polymer resin having a lower melting point in the composite liquid crystal polymer layer 2 of 320 ° C, a liquid crystal polymer resin having a lower melting point in the composite liquid crystal polymer layer 2. m2 The liquid crystal copolyester of 280 ° C for hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid; the liquid crystal polymer material is dried in a vacuum drying tank, the drying temperature is 150 ° C, the drying time is 5 hours, The water content of the resin after drying is less than 300 ppm.

[0058] Resin used by the composite liquid crystal polymer layer 2: Type T m2 The liquid crystal polymer resin accounted for the total mass percentage of the total amount of the liquid crystal polymer film is 15%, and the two liquid crystal polymers are mixed uniform, and the blended grain is blended in the same double screw extruder. The liquid crystal polymer material ...

Embodiment 2

[0061] Core LCD polymer layer 1 liquid crystal polymer resin selective melting point T m1 The liquid crystal polymer resin having a lower melting point in the composite liquid crystal polymer layer 2 of 320 ° C, a liquid crystal polymer resin having a lower melting point in the composite liquid crystal polymer layer 2. m2 The liquid crystal copolyester of 280 ° C for hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid; the liquid crystal polymer material is dried in a vacuum drying tank, the drying temperature is 150 ° C, the drying time is 5 hours, The water content of the resin after drying is less than 300 ppm.

[0062] Resin used by the composite liquid crystal polymer layer 2: Type T m2The liquid crystal polymer resin accounted for the total mass percentage of the total amount of the liquid crystal polymer film is 15%, and the two liquid crystal polymers are mixed uniform, and the blended grain is blended in the same double screw extruder. The liquid crystal polymer material a...

Embodiment 3

[0064] A liquid crystal polymer film having a thickness of 40 μm was prepared using the same method in Example 2; an electrolytic copper foil having a thickness of 12 μm and a surface roughness of approximately 1.5 μm were selected as a metal foil 3. According to the sequential stack of copper foil / liquid crystal polymer film, the plate hot pressing machine with a surface hardness is 90 degrees at a temperature of 295 ° C, and the pressure is 100 kg / cm. 2 The liquid crystal polymer film and the copper foil are laminated together under the conditions of 5 s, and obtain a single-sided copper flexible circuit board, such as figure 2 As shown, the composite liquid crystal polymer layer 2 bonds the copper foil to the liquid crystal polymer film as an adhesive layer.

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Abstract

The present invention relates to a liquid crystal polymer film and a manufacturing method thereof, the liquid crystal polymer film comprises a core liquid crystal polymer layer and a composite liquidcrystal polymer layer covering at least one surface of the core liquid crystal polymer layer, and the core liquid crystal polymer layer comprises a liquid crystal polymer resin with a melting point ofTm1; the composite liquid crystal polymer layer comprises liquid crystal polymer resin with the melting point of Tm1 and liquid crystal polymer resin with the melting point of Tm2, Tm1 is larger thanTm2, and the liquid crystal polymer resin with the melting point of Tm2 accounts for 10.0-80.0% of the total mass of the liquid crystal polymer film. The technical problem that the bonding strength between the liquid crystal polymer film and the metal foil and the heat resistance and the high-frequency characteristic of the liquid crystal polymer film are difficult to combine at the same time inthe process of preparing the circuit substrate of the liquid crystal polymer material in the prior art can be solved.

Description

Technical field [0001] The present invention belongs to the field of liquid crystal polymer film preparation, and more particularly to a liquid crystal polymer film and a method of fabricating thereof. Background technique [0002] The circuit board for mobile phones, computer, communication base stations, routers, and vehicle information terminals, etc., which supports support to connect each functional module in electronic devices. With the rapid development of mobile devices, the wiring density, flexibility, flexibility of the board, and the corresponding flexible circuit board / antenna are also critical. [0003] At present, the substrate for preparing the flexible antenna is mainly a polyimide liquid crystal polymer film. Since the dielectric constant and dielectric loss are large, the high-frequency transmission loss of the antenna prepared by the antenna is severe, and the structure Poor performance, only for SUB-6G and the following high frequency antennas. LCD polymer i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B27/08B32B27/34B32B27/40B32B7/02C08J5/18C08L67/00C08L67/04B29C48/21
CPCB32B27/08B32B27/34B32B27/40B32B7/02C08J5/18B29C48/21B32B2250/24B32B2270/00B32B2307/306B32B2457/00C08J2367/00C08J2367/04C08J2467/04
Inventor 李良彬赵浩远
Owner UNIV OF SCI & TECH OF CHINA
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