Ceramic bonding area surface modification method suitable for ceramic/metal connection

A technology of metal connection and ceramic bonding, applied in the field of ceramic metal connection, to achieve the effect of broadening the selection range, enhancing bonding, and enhancing surface energy

Active Publication Date: 2021-03-12
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the problems existing in the prior art, the present invention provides a method for modifying the surface of the ceramic bonding area suitable for ceramic / metal connection. The present invention modifies the surface of the ceramic so that the ceramic obtains a highly active surface and strengthens the surface of the ceramic. surface energy, so that the metal material composited with ceramics can be better attached to the surface of the ceramics. After the modification of the present invention, the selection of metal materials composited with ceramics will not be due to the metal and ceramics and brazing Whether the wettability of the material is good or not is limited, which greatly broadens the selection range of metal materials composited with ceramics, so that metal materials with good properties can be better applied in ceramics and metal composites, and at the same time avoid brazing Difficulty in selecting welding materials

Method used

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  • Ceramic bonding area surface modification method suitable for ceramic/metal connection
  • Ceramic bonding area surface modification method suitable for ceramic/metal connection
  • Ceramic bonding area surface modification method suitable for ceramic/metal connection

Examples

Experimental program
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Effect test

Embodiment 1

[0046] This embodiment is carried out by adopting the above-mentioned scheme 2, including: step 1, magnetron sputtering coating, step 2, vacuum sintering and step 3, titanium trihydride sintering, which are three stages;

[0047] Step 1, magnetron sputtering coating, through DC magnetron sputtering technology, the metal target (that is, the material of magnetron sputtering coating) selects NiTi35 alloy, its nominal melting point is 1141 ° C, and the target is installed in the magnetron sputtering equipment On the cathode, in argon vacuum (vacuum degree not greater than 10 -3 Pa) and direct current and room temperature (25°C), the target atoms are sputtered onto the surface of the SiC ceramic sample, and the film thickness is controlled at 100nm;

[0048] Step 2, vacuum sintering, using a -3 Pa) in the sintering furnace of the component NiTi alloy, which is 90% of the melting point of the NiTi alloy (calculated according to the thermodynamic temperature scale K) and kept at 10...

Embodiment 2

[0051] The process of this embodiment is the same as that of embodiment 2, except that no titanium sponge is placed during the vacuum sintering in step two and the titanium hydride sintering in step three.

[0052] Depend on figure 1 It can be seen that the wettability of the surface of SiC ceramic samples to pure water is poor, and the surface energy of SiC ceramic samples is low.

[0053] Depend on figure 2 It can be seen that after the magnetron sputtering coating, due to the existence of the NiTi coating, the surface energy of the NiTi coating is lower, and the wettability to pure water is significantly reduced.

[0054] As can be seen from Figure 3(a) and Figure 3(b), after vacuum sintering, in Example 1, due to the addition of titanium sponge for protection, the surface oxidation of the NiTi coating was prevented, and the NiTi coating was crystallized at the same time. The surface energy of the NiTi coating is greatly improved, and the wettability with water is signif...

Embodiment 3

[0057] This embodiment is carried out using the above scheme 1, including the two stages of step 1 magnetron sputtering coating and step 2 vacuum sintering;

[0058] Step 1, magnetron sputtering coating, through DC magnetron sputtering technology, the metal target (that is, the material of magnetron sputtering coating) selects NiTi35 alloy, its nominal melting point is 1141 ° C, and the target is installed in the magnetron sputtering equipment On the cathode, in argon vacuum (vacuum degree not greater than 10 -3 Pa) and direct current and room temperature (25°C), the target atoms are sputtered onto the surface of the SiC ceramic sample, and the film thickness is controlled at 300nm;

[0059] Step 2, titanium hydride sintering, place the SiC ceramic sample in a corundum crucible, and use titanium hydride powder with a particle size of 38-250 microns to fill the gap between the sample and the corundum crucible until the relative density of the powder is 60%. The corundum crucib...

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Abstract

The invention discloses a ceramic bonding area surface modification method suitable for ceramic/metal connection. The method comprises the following steps: carrying out magnetron sputtering coating onthe surface of a ceramic component to coat the surface of the ceramic component with a metal coating; using titanium hydride powder for carrying out titanium hydride sintering on the ceramic component plated with the metal coating film on the surface under the vacuum condition, generating a titanium layer on the surface of the metal coating film, and during titanium hydride sintering, filling theceramic component and the periphery with the titanium hydride powder; and after titanium hydride sintering is finished, finishing surface modification of the ceramic bonding area prepared from the ceramic/metal integrated component. By using the method, an alloying transition layer can be formed in the ceramic and metal bonding area, the surface energy of the ceramic bonding area can be remarkably improved, the wettability of the ceramic surface to the metal material is improved, and thus the joint performance and the stability of the ceramic/metal integrated component are improved.

Description

technical field [0001] The invention relates to the technical field of ceramic-metal connection, in particular to a method for modifying the surface of a ceramic joint area suitable for ceramic / metal connection. Background technique [0002] By connecting ceramics and metals as a whole, the technology of making composite structural parts by using the respective advantages of ceramics and metals is an advanced structural parts manufacturing technology commonly used at present. [0003] Generally speaking, ceramics have excellent chemical stability, high heat resistance, excellent wear resistance and high melting point, which are difficult for conventional metals to achieve. While metal has good comprehensive mechanical properties and strength, but its high temperature performance is limited. Therefore, if metal is used as the substrate and covered with a layer of ceramics as protection, the above-mentioned properties of the metal substrate can be greatly improved, thereby ac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B37/02C04B41/90C04B41/88
CPCC04B37/023C04B41/90C04B41/88C04B41/52C04B41/5133C04B41/009C04B2237/122C04B2237/123C04B2237/343C04B2237/365C04B41/5144C04B41/4529C04B41/4515C04B41/4547C04B41/455C04B35/565C04B35/10
Inventor 杨强刘洋王富王迎鑫
Owner XI AN JIAOTONG UNIV
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