A kind of high out-of-plane thermal conductivity polyimide film and preparation method thereof

Abstract

The invention discloses a polyimide film with high out-of-plane thermal conductivity and a preparation method thereof, belonging to the technical field of polyimide materials. The difference between the preparation method of the high out-of-plane thermal conductivity polyimide film of the present invention and the prior art is that the defoaming polyamic acid resin is extruded from the die lip of the die head of the film casting extrusion equipment to whereabouts In the process to the support body, the effect of the electric field is applied, and the direction of the electric field is perpendicular to the falling direction of the defoaming polyamic acid resin; when passing through the casting furnace, the orientation is upward and positive between the front roller and the rear roller. For the hot air on the back of the support, the temperature of the hot air is 150-170°C. The polyimide film prepared by the method of the present invention also has good electrical properties and mechanical properties while having high out-of-plane thermal conductivity and in-plane thermal conductivity, and simultaneously prepares a self-supporting film without adding a release agent. It can be easily and completely peeled off from the support under the premise.

Description

technical field [0001] The invention relates to polyimide materials, in particular to a polyimide film with high out-of-plane thermal conductivity and a preparation method thereof. Background technique [0002] Polyimide (PI) film is the film insulation material with the best comprehensive performance, and is widely used in the fields of microelectronics and electronic packaging. In recent years, electronic components are developing towards high density, high power, high integration and light weight, which will inevitably generate a lot of heat during operation and work. If the heat dissipation problem cannot be solved in a timely and effective manner, It will directly affect the working efficiency, reliability and service life of electronic components. In order to ensure the normal operation of electronic components for a long time and with high reliability, it is necessary to improve the thermal conductivity of the polyimide film on the basis of ensuring insulation. [0...

AI Technical Summary

Problems solved by technology

However, the thickness of the mainstream heat conduction film products in the market is 25μm and 38μm, which means that the maximum particle size of the filler must be less than 25μm, while the position of the smallest channel size of the conventional die is the lip of the die lip, and the opening of the lip is 0.2-0.6mm Between, much larger than the particle size of the filler, therefore, it is difficult to achieve the orientation effect described in the patent when the flake filler in the above invention is extruded using the existing conventional die

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