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Samarium-iron-cobalt film electroplating liquid and preparation method thereof

An electroplating solution, samarium-iron technology, applied in the field of samarium-iron-cobalt thin-film electroplating solution and its preparation, can solve problems such as difficult binary co-deposition and inability to realize co-deposition of Sm-Fe-Co ternary alloy, achieving a breakthrough technology Bottleneck, controllable electrochemical co-deposition, effect of uniform element distribution

Active Publication Date: 2021-03-12
CHINA JILIANG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional electrochemical deposition techniques are used to prepare magnetic thin films only for binary alloys, especially when preparing alloy thin films containing rare earth elements. Due to the high reduction potential of rare earth elements, it is difficult to achieve binary co-deposition with other transition metals.
[0003] In the prior art, some electroplating solutions can achieve co-deposition of Sm-Fe binary alloys, but cannot achieve co-deposition of Sm-Fe-Co ternary alloys

Method used

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  • Samarium-iron-cobalt film electroplating liquid and preparation method thereof
  • Samarium-iron-cobalt film electroplating liquid and preparation method thereof
  • Samarium-iron-cobalt film electroplating liquid and preparation method thereof

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Embodiment 1

[0025] A preparation method of a novel samarium-iron-cobalt thin film electroplating solution, comprising the following steps:

[0026] Add 3g of boric acid, 3g of sodium citrate, 2g of glacial acetic acid, 10g of complexing agent (including 3g of sulfamic acid and 7g of glycine) and 1g of potassium nitrate into deionized water at 40°C. Adjust the pH to 1.0, add 5g of cobalt chloride, 10g of samarium chloride, 5g of ferrous chloride, and 7g of ferric chloride to the mixed solution, stir and dissolve, then add the remaining amount of deionized water to a total volume of 1L, and add hydroxide Sodium adjusts the pH of the solution to 3.0 to obtain a new type of samarium-iron-cobalt thin film electroplating solution.

Embodiment 2

[0028] A preparation method of a novel samarium-iron-cobalt thin film electroplating solution, comprising the following steps:

[0029] Add 4g of boric acid, 4g of sodium citrate, 3g of glacial acetic acid, 15g of complexing agent (7g of sulfamic acid, 8g of glycine), and 1g of potassium nitrate into deionized water at 45°C, stir well and dissolve to form a mixed solution, adjust the pH with HCl 1.5, add 10g of cobalt chloride, 15g of samarium chloride, 10g of ferrous chloride, and 20g of ferric chloride to the mixed solution, stir and dissolve, then add the remaining amount of deionized water to a total volume of 1L, add sodium hydroxide to adjust The pH of the solution is 2.5, and a novel samarium-iron-cobalt thin film electroplating solution is obtained.

Embodiment 3

[0031] A preparation method of a novel samarium-iron-cobalt thin film electroplating solution, comprising the following steps:

[0032] Add 5g of boric acid, 3g of sodium citrate, 5g of glacial acetic acid, 25g of complexing agent (10g of sulfamic acid, 15g of glycine), and 2g of potassium nitrate into deionized water at 50°C, stir well and dissolve to form a mixed solution, adjust the pH with HCl 3.0, add 10g of cobalt chloride, 15g of samarium chloride, 8g of ferrous chloride, and 20g of ferric chloride to the mixed solution and stir to dissolve, then add the remaining amount of deionized water to a total volume of 1L, add sodium hydroxide to adjust The pH of the solution is 3.5, and a novel samarium-iron-cobalt thin film electroplating solution is obtained.

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Abstract

The invention discloses a samarium-iron-cobalt film electroplating solution. The samarium-iron-cobalt film electroplating solution comprises the following components of, in mass concentration, 5-15g / Lof cobalt salt, 10-40g / L of ferric salt, 8-30g / L of samarium salt, 10-35g / L of complexing agent, 3-7g / L of boric acid, 2-5g / L of glacial acetic acid, 3-6g / L of sodium citrate, 1-3g / L of potassium phosphate or potassium nitrate and a solvent water, and the invention further discloses a preparation method of the samarium-iron-cobalt film electroplating solution. By adopting the electroplating solution disclosed by the invention, three elements of Sm, Fe and Co can be simultaneously deposited, and a samarium-iron-cobalt film prepared by adopting the electroplating solution has the advantages ofcontrollable element content, uniform element distribution and the like, the invention provides an excellent ligand and electroplating liquid for development of a new generation of rare earth permanent magnet material Sm (FeCo) 12, the samarium-iron-cobalt amorphous film prepared from the electroplating solution has high saturation magnetic induction intensity and higher intrinsic coercive force.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a samarium-iron-cobalt thin film electroplating solution and a preparation method thereof. Background technique [0002] Electrochemical deposition technology has the advantages of simple operation and low cost, and has a very wide range of applications in surface treatment and magnetic material preparation. Conventional electrochemical deposition techniques to prepare magnetic films are only for binary alloys, especially when preparing alloy films containing rare earth elements. Due to the high reduction potential of rare earth elements, it is difficult to achieve binary co-deposition with other transition metals. [0003] In the prior art, some electroplating solutions can realize co-deposition of Sm-Fe binary alloys, but cannot realize co-deposition of Sm-Fe-Co ternary alloys. Contents of the invention [0004] In view of the above situation, in order to overcome the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56H01F41/26
CPCC25D3/562H01F41/26
Inventor 俞能君任泽松杨婉琪吴琼泮敏翔张朋越葛洪良
Owner CHINA JILIANG UNIV
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