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Deplating solution for outer lead electroplated layer of integrated circuit and preparation method of deplating solution

A technology for integrated circuits and outer leads, which is applied in the field of deplating solution and its preparation for the electroplating layer of the outer leads of integrated circuits. The effect of plating efficiency and corrosion inhibition

Active Publication Date: 2021-03-16
南通麦特隆新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the main component of the deplating solution in this invention application is nitric acid, and the use of nitric acid will produce more NO and NO2 gases during the deplating process, which will cause certain air pollution and damage to the human body.

Method used

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  • Deplating solution for outer lead electroplated layer of integrated circuit and preparation method of deplating solution
  • Deplating solution for outer lead electroplated layer of integrated circuit and preparation method of deplating solution

Examples

Experimental program
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Effect test

Embodiment 1

[0045] Embodiment 1 provides a kind of deplating solution of the electroplating layer of the outer lead wire of an integrated circuit, and raw material comprises following concentration: citric acid 175g / L, sulfuric acid 175g / L, sodium lauryl sulfate 25g / L, hydrogen peroxide 225g / L , poly(dehydrated malic anhydride-methyl acrylate) 70g / L, auxiliary agent (sodium chloride and ammonium citrate, weight ratio is 3:2) 40g / L, amine organic matter (diethanolamine and n-hexylamine, weight ratio 4:1) 175g / L.

[0046] In this example, poly(dehydrated malic anhydride-methyl acrylate) is self-made, and the steps include the following steps: (1) The temperature of the reaction vessel is raised to 60° C., 75 g of dehydrated malic anhydride is added and nitrogen protection is introduced, and preheated for 15 minutes; (2) 35g methyl acrylate was added to the reaction vessel, and continued stirring for 25 minutes, and 2g of n-dodecyl mercaptan was added; (3) the temperature was raised to 80-90...

Embodiment 2

[0051] The specific implementation of the present embodiment is the same as that of Example 1, except that the dehydrated malic anhydride is 80 g, methyl acrylate is 30 g, and ammonium persulfate is 1 g.

[0052] The deplating solution prepared in this embodiment is denoted as T2.

Embodiment 3

[0054] The specific implementation of this embodiment is the same as that of Example 1, except that the weight ratio of sodium chloride and ammonium citrate is 4:1.

[0055] The deplating solution prepared in this embodiment is denoted as T3.

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Abstract

The invention discloses a deplating solution for an outer lead electroplated layer of an integrated circuit. The deplating solution is prepared from the following raw materials of, in concentration, 150-200g / L of organic acid, 150-200g / L of inorganic acid, 20-30g / L of surfactant, 200-250g / L of peroxide, 60-80g / L of additives, 20-60g / L of auxiliaries and 150-200g / L of amine organic matters. The prepared deplating solution has excellent deplating efficiency, corrosion inhibition and deplating capacity, is suitable for popularization in the field of electroplating, and has a wide development prospect.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a deplating solution for an electroplating layer of an integrated circuit outer lead and a preparation method thereof. Background technique [0002] The coating process is widely used in the industrial field because of its excellent appearance and corrosion resistance of the coating layer. For example, electroplating a film layer containing copper, nickel, gold, titanium and other metals on a stainless steel substrate, because the coated film layer has high hardness, good wear resistance and high chemical stability, it can greatly improve the performance of the stainless steel substrate. The appearance and performance and anti-corrosion and anti-oxidation properties. [0003] Microelectronics technology is an important way to realize miniaturization, multi-function and high reliability of electronic systems. It has been widely used in various fields in recent years, and integrated ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/16C23F1/18
CPCC23F1/16C23F1/18Y02P10/20
Inventor 陆建辉袁军华王承国
Owner 南通麦特隆新材料科技有限公司