A kind of high-strength and medium-conductivity copper-nickel-silicon-tin-magnesium alloy foil and processing method thereof

A copper-nickel-silicon, magnesium alloy technology, applied in the direction of metal rolling, can solve the problem of high temperature softening resistance requirements.

Active Publication Date: 2022-07-29
中色正锐(山东)铜业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the continuous development of thinner and lighter alloy foils, part of the tensile strength and anti-softening temperature are sacrificed, and the heating problem associated with electronic equipment cannot be ignored. Therefore, the improvement of anti-high temperature softening performance is increasingly demanding for electronic components. higher

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  • A kind of high-strength and medium-conductivity copper-nickel-silicon-tin-magnesium alloy foil and processing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] (1) Smelting and casting: First, the cathode copper and nickel plate are smelted and added to the kettle, and the smelting temperature is set to 1290°C. When the temperature in the kettle reaches 1240°C, silicon ingots, copper-magnesium alloys and copper-tin alloys are added, and the smelting is continued for 25 minutes. Casting at a temperature of 1250°C, casting speed of 90mm / min, and processing into a square ingot (205mm*605mm); the composition range is (mass percentage), Ni 2.6%, Si 0.45%, Sn 0.08%, Mg 0.12%, The balance is copper and impurities below 0.1%;

[0036] (2) Solid solution: Heating by step-by-step homogenization heating, the temperature range is 795~1200 ℃, ten cells are divided in the furnace, each cell independently controls the temperature, the first cell is 795 ° C, and the tenth cell is 795 ° C. 1200 ℃, the other areas are raised in steps at 45 ℃, the speed is 12m / min, and then hot working at 900 ℃, the total processing rate is 96%, the final rollin...

Embodiment 2

[0048] (1) Smelting and casting: First, the cathode copper and nickel plate are smelted and added to the kettle, and the smelting temperature is set to 1270°C. When the temperature in the kettle reaches 1220°C, silicon ingots, copper-magnesium alloys and copper-tin alloys are added, and the smelting continues for 30 minutes. Casting at a temperature of 1260°C, a casting speed of 90mm / min, processing into an ingot, the size of the ingot is (205mm*605mm); the composition range is (mass percentage), Ni 2.6%, Si 0.65%, Sn 0.06% , Mg 0.18%, Mg 0.18%, the balance is copper and impurities below 0.1%.

[0049] (2) Solid solution: Heating by step-by-step homogenization heating, the temperature range is 795~1200 ℃, ten cells are divided in the furnace, each cell independently controls the temperature, the first cell is 795 ° C, and the tenth cell is 795 ° C. 1200 ℃, other areas are raised in steps at 45 ℃, the speed is 12m / min, and then hot working is carried out at a temperature of 880...

Embodiment 3

[0062] (1) Smelting and casting: First, the cathode copper and nickel plate are smelted and added to the kettle, and the smelting temperature is set to 1270 ℃. When the temperature in the kettle reaches 1260 ℃, silicon ingots, copper-magnesium alloys and copper-tin alloys are added, and the smelting is continued for 25 minutes. Casting at a temperature of 1230°C, a casting speed of 90mm / min, and processing into an ingot (205mm*605mm); the composition range is (mass percentage), Ni2.75%, Si 0.35%, Sn 0.06%, Mg 0.15% , the balance is copper and impurities below 0.1%;

[0063] (2) Solid solution: Heating by step-by-step homogenization heating, the temperature range is 795~1200 ℃, ten cells are divided in the furnace, each cell independently controls the temperature, the first cell is 795 ° C, and the tenth cell is 795 ° C. 1200 ℃, other areas are raised in steps at 45 ℃, the speed is 12m / min, and then hot working is carried out at a temperature of 930 ℃, the total processing rate...

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Abstract

The invention discloses a high-strength medium-conductivity copper-nickel-silicon-tin-magnesium alloy foil and a processing method thereof. The thickness of the high-strength medium-conductivity copper-nickel-silicon-tin-magnesium alloy foil is 0.03-0.15 mm, and includes the following raw materials by weight: Nickel 2.4-2.8%, silicon 0.3-1%, tin 0.05-0.1%, magnesium 0.03-0.2%, the balance is copper and a small amount of impurities; the impurity content is less than 0.1%, through smelting casting-solution heat treatment- It is prepared by the method of milling surface, primary cold rolling, secondary solid solution, secondary cold rolling, tertiary solid solution, primary aging, tertiary cold rolling, stress relief annealing, surface cleaning, stretch bending and straightening. In the present invention, on the basis of Cu-Ni-Si, trace amounts of Sn and Mg are added, and through casting, hot working, cold working and aging treatment, high-strength and medium-conductivity copper-nickel-silicon-tin-magnesium alloy foils with a thickness of 0.03-0.15 mm are obtained. The tensile strength is over 700MPa, the electrical conductivity is ≥40%IACS, and the softening resistance temperature is over 550℃, which can meet the requirements of ultra-thin and high-strength structural supports for communications, mobile phones and other industries.

Description

technical field [0001] The invention belongs to the technical field of copper alloy foil processing, in particular to a high-strength and medium-conductivity copper-nickel-silicon-tin-magnesium alloy foil and a processing method thereof. Background technique [0002] With the rapid development of related information industries such as electronic communication, the demand for integrated circuits is increasing, and the requirements for them are also getting higher and higher. At present, the core of electronic information technology is integrated circuits. Chips and lead frames are packaged to form integrated circuits. As the main structural material of integrated circuit packaging, lead frames play an important role in circuits, such as carrying chips, connecting chips and external circuit boards. Signal, installation and fixation, etc. It can be seen that the lead frame plays a huge role in integrated circuit devices and various assembly procedures. How to effectively impro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/06C22F1/08B21B1/40
CPCC22C9/06C22F1/08C22F1/002B21B1/40
Inventor 郭丽丽李学帅姜业欣蔡兰英郑殿水田原晨苏花鲜
Owner 中色正锐(山东)铜业有限公司
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