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Preparation method of precious metal anode for PCB horizontal electroplating

A technology of precious metals and anodes, applied in the direction of electrodes, metal material coating technology, liquid chemical plating, etc., can solve the problems of increased consumption of additives, achieve the effects of improved conversion efficiency, reduced anode cost, and good catalytic activity

Active Publication Date: 2021-04-16
XIAN TAIJIN NEW ENERGY & MATERIALS SCI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the PCB horizontal electroplating industry, Ir-Ta coating is still used, and the consumption of additives will increase due to the generation of oxygen.

Method used

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  • Preparation method of precious metal anode for PCB horizontal electroplating
  • Preparation method of precious metal anode for PCB horizontal electroplating
  • Preparation method of precious metal anode for PCB horizontal electroplating

Examples

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Effect test

preparation example Construction

[0033] The preparation method of the noble metal anode used for PCB horizontal electroplating provided by the present invention, the coating of the titanium anode is an Ir-Ta system noble metal coating containing a cobalt source, and the specific preparation steps are as follows:

[0034] S1. Titanium substrate pretreatment: degrease, degrease, pickle and etch the surface of the titanium substrate with a cleaning agent;

[0035] S2. Preparation of active liquid: accurately weigh a certain amount of chloroiridic acid and dissolve it in n-butanol solvent, stir at room temperature until completely dissolved to form solution A; accurately weigh a certain amount of tantalum pentachloride n-butanol solution to dissolve In n-butanol solvent, stir at room temperature until completely dissolved to form solution B; accurately weigh a certain amount of CoCl 2 ·6H 2 O is dissolved in n-butanol solvent, stirred at room temperature until completely dissolved to form solution C; solution A,...

Embodiment 1

[0038] This example provides a method for preparing a noble metal anode for horizontal electroplating of PCBs, and the scanning electron microscope image of the anode for horizontal electroplating of PCBs prepared by it can be found in figure 1 . The preparation method specifically includes:

[0039] S1. Titanium substrate pretreatment: degreasing and degreasing the surface of the titanium substrate, sandblasting, thermal shaping, pickling and other treatments;

[0040] S2, prepare active liquid: accurately weigh a certain amount of chloroiridic acid and dissolve it in n-butanol solvent (the metal ion concentration is 0.3mol / L), stir at room temperature until completely dissolved to form solution A; accurately weigh a certain amount The n-butanol solution of tantalum pentachloride is dissolved in n-butanol solvent (concentration of metal ions is 0.3mol / L), is stirred at room temperature until completely dissolving, forms solution B; Solution A, solution B are Ir according to ...

Embodiment 2

[0043] This example provides a method for preparing a noble metal anode for horizontal electroplating of PCBs, and the scanning electron microscope image of the anode for horizontal electroplating of PCBs prepared by it can be found in figure 2 . The preparation method specifically includes:

[0044] S1. Titanium substrate pretreatment: degreasing and degreasing the surface of the titanium substrate, sandblasting, thermal shaping, pickling and other treatments;

[0045] S2, prepare active liquid: accurately weigh a certain amount of chloroiridic acid and dissolve it in n-butanol solvent (the metal ion concentration is 0.3mol / L), stir at room temperature until completely dissolved to form solution A; accurately weigh a certain amount The n-butanol solution of tantalum pentachloride is dissolved in n-butanol solvent (the metal ion concentration is 0.3mol / L), stirred at room temperature until completely dissolved to form solution B; accurately weigh a certain amount of CoCl 2 ...

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Abstract

The invention belongs to the technical field of PCB horizontal electroplating, and relates to a preparation method of a precious metal anode for PCB horizontal electroplating. The method comprises the following steps that 1), the surface of a titanium substrate is pretreated; 2), an active solution is prepared, specifically, an iridium source, a tantalum source and a cobalt source are dissolved in an organic solvent to form a solution A, a solution B and a solution C, the solution A, the solution B and the solution C are uniformly mixed according to a molar ratio of Ir:Ta:Co of 7:3:(1.5-6) to form an active solution D; and 3), sintering is conducted. According to the preparation method, Co3O4 with good stability is introduced into a traditional iridium-tantalum system coating, good catalytic activity is achieved, the Fe2+ conversion efficiency is improved, and the anode cost is reduced; and besides, an n-butyl alcohol solvent with high viscosity is adopted as the preparation solvent of the active solution, so that the diffusion rate of the solution is well controlled, and noble metal active components are more uniformly dispersed on the surface of the titanium substrate.

Description

technical field [0001] The invention belongs to the technical field of PCB horizontal electroplating, relates to a noble metal anode used for PCB horizontal electroplating, and in particular to a preparation method of a noble metal anode used for PCB horizontal electroplating. Background technique [0002] With the development of the 5G era, printed circuit board manufacturing is developing rapidly in the direction of multi-layer, layered, functional and integrated. Printed circuit design uses a large number of tiny holes, narrow spacing, and thin wires to conceive and design electric furnace graphics, making printed circuit board manufacturing technology more difficult; while conventional vertical electroplating processes cannot meet high-quality, high-reliability interconnections Hole technical requirements. Therefore, the horizontal electroplating technology has emerged as the times require, and its advantages are more advanced than the current disposal rack plating proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/12C23G1/10C23C18/08C23C18/12
CPCY02P10/20
Inventor 薛建超窦泽坤冯庆贾波郝小军赵新泽康轩齐杨勃
Owner XIAN TAIJIN NEW ENERGY & MATERIALS SCI TECH CO LTD
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