Preparation method of precious metal anode for PCB horizontal electroplating

A technology of precious metals and anodes, applied in the direction of electrodes, metal material coating technology, liquid chemical plating, etc., can solve the problems of increased consumption of additives, achieve the effects of improved conversion efficiency, reduced anode cost, and good catalytic activity
CN112663124AActive Publication Date: 2021-04-16XIAN TAIJIN NEW ENERGY & MATERIALS SCI TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XIAN TAIJIN NEW ENERGY & MATERIALS SCI TECH CO LTD
Publication Date
2021-04-16

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Abstract

The invention belongs to the technical field of PCB horizontal electroplating, and relates to a preparation method of a precious metal anode for PCB horizontal electroplating. The method comprises the following steps that 1), the surface of a titanium substrate is pretreated; 2), an active solution is prepared, specifically, an iridium source, a tantalum source and a cobalt source are dissolved in an organic solvent to form a solution A, a solution B and a solution C, the solution A, the solution B and the solution C are uniformly mixed according to a molar ratio of Ir:Ta:Co of 7:3:(1.5-6) to form an active solution D; and 3), sintering is conducted. According to the preparation method, Co3O4 with good stability is introduced into a traditional iridium-tantalum system coating, good catalytic activity is achieved, the Fe2+ conversion efficiency is improved, and the anode cost is reduced; and besides, an n-butyl alcohol solvent with high viscosity is adopted as the preparation solvent of the active solution, so that the diffusion rate of the solution is well controlled, and noble metal active components are more uniformly dispersed on the surface of the titanium substrate.
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Description

technical field

[0001] The invention belongs to the technical field of PCB horizontal electroplating, relates to a noble metal anode used for PCB horizontal electroplating, and in particular to a preparation method of a noble metal anode used for PCB horizontal electroplating. Background technique

[0002] With the development of the 5G era, printed circuit board manufacturing is developing rapidly in the direction of multi-layer, layered, functional and integrated. Printed circuit design uses a large number of tiny holes, narrow spacing, and thin wires to conceive and design electric furnace graphics, making printed circuit board manufacturing technology more difficult; while conventional vertical electroplating processes cannot meet high-quality, high-reliability interconnections Hole technical requirements. Therefore, the horizontal electroplating technology has emerged as the times require, and its advantages are more advanced than the current disposal rack plating proc...

Claims

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