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High-stability water-borne epoxy resin and preparation method thereof

A water-based epoxy resin with high stability technology, applied in the field of coating materials, can solve the problems of high bond strength, high hardness, poor heat resistance and impact damage resistance of epoxy resin

Inactive Publication Date: 2021-05-07
上海瀚岱化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Epoxy resin cured products have large internal stress, brittle quality, poor impact resistance and moisture resistance, etc.
The shortcomings of epoxy resin, such as high bonding strength, high cross-linking curing density, high hardness, poor flexibility, poor heat resistance and impact damage resistance, limit its application to a large extent, and are usually introduced into other materials through chemical modification. Group to improve performance, or add ideal curing agent to improve the performance of epoxy resin

Method used

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  • High-stability water-borne epoxy resin and preparation method thereof
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  • High-stability water-borne epoxy resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Dissolve the compound represented by formula II in toluene, add aqueous sodium hydroxide solution, heat while stirring, stir at a constant temperature when the temperature rises to 65°C, and add glycidol dropwise, and dropwise complete within 2 hours; raise the temperature , kept at 80°C for 1.5h; add distilled water, stir, statically separate and remove the water layer, evaporate the toluene layer to dryness under reduced pressure to obtain the compound shown in formula I; the molar ratio of the compound shown in formula II to glycidyl alcohol is n: (2n+2 to 2n+4); the content of sodium hydroxide in the aqueous sodium hydroxide solution is 0.5n-1.5n moles; the volume ratio of distilled water and toluene is 3:1.

[0023] Obtain reaction product 569.7g, m / z 728.30, hydrogen spectrum sees figure 1 .

Embodiment 2

[0025] Dissolve the compound shown in formula II in toluene, add aqueous sodium hydroxide solution, heat while stirring, when the temperature rises to 60°C, stir at a constant temperature and add glycidol dropwise, and the dropwise addition is completed within 2 hours; raise the temperature , kept at 75°C for 2h; add distilled water, stir, statically separate and remove the water layer, evaporate the toluene layer under reduced pressure to obtain the compound shown in formula I; the molar ratio of the compound shown in formula II to glycidyl alcohol is n:( 2n+2 to 2n+4); the content of sodium hydroxide in the aqueous sodium hydroxide solution is 0.5n-1.5n moles; the volume ratio of distilled water and toluene is 4:1.

[0026] Obtain reaction product 469.4g, m / z 728.30, hydrogen spectrum see figure 1 .

Embodiment 3

[0028] Dissolve the compound shown in formula II in toluene, add aqueous sodium hydroxide solution, heat while stirring, when the temperature rises to 70°C, stir at a constant temperature and add glycidol dropwise, and the dropwise addition is completed within 2 hours; raise the temperature , kept at 85°C for 1h; add distilled water, stir, statically separate and remove the water layer, evaporate the toluene layer to dryness under reduced pressure to obtain the compound shown in formula I; the molar ratio of the compound shown in formula II to glycidyl alcohol is n:( 2n+2 to 2n+4); the content of sodium hydroxide in the aqueous sodium hydroxide solution is 0.5n-1.5n moles; the volume ratio of distilled water and toluene is 2:1.

[0029] Obtain reaction product 416.7g, m / z 728.30, hydrogen spectrum sees figure 1 .

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PUM

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Abstract

The invention provides high-stability water-borne epoxy resin. The structural formula of the high-stability water-borne epoxy resin is represented by a formula I. The invention also provides a preparation method of the high-stability water-borne epoxy resin. The water-borne epoxy resin provided by the invention is simple in preparation process and relatively low in cost; according to the resin, a high-rigidity main chain is formed by introducing naphthyl hydroxyl, benzene hydroxyl and glycidol, meanwhile, an aliphatic chain with hydroxyl is introduced to the benzene hydroxyl, and the hydroxyl on the aliphatic chain and the hydroxyl on the main chain both have good bonding performance; and after being cured, the epoxy resin can form a stable structure with oxygen atoms on the main chain, so that the stability of the epoxy resin is ensured.

Description

technical field [0001] The invention relates to the field of coating materials, in particular to a high-stability waterborne epoxy resin and its preparation method and application. Background technique [0002] Resins containing two or more epoxy groups are called epoxy resins. The epoxy groups are highly active and can react with many curing agents to form a three-dimensional crosslinked network structure. It has been more than 60 years since the development of epoxy resin, and the output is increasing continuously, and the number of new varieties is increasing. There are tons of applications. [0003] Epoxy resins have a large number of active and polar groups: epoxy groups, ether bonds, light groups, etc., so they have more excellent performance and reactivity. Different types of epoxy resins can be cross-linked and cured with corresponding curing agents to form a three-dimensional network structure, and various performance requirements for production and life can be me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/06C09D5/08C09D163/00
CPCC08G59/06C08G59/022C09D163/00C09D5/08
Inventor 沈岳吕宏飞伍宽平沈君岱
Owner 上海瀚岱化学有限公司
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