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A kind of nano-twinned copper film material and its preparation method and application

A nano-twinned copper and nano-twinned technology, applied in the direction of nanotechnology, nanotechnology, metal pattern materials, etc., can solve the problems of weak mechanical properties and inability to meet the mechanical service performance requirements of copper interconnection materials, and achieve optimal material The effect of mechanical properties, strong practicability and simple operation

Active Publication Date: 2022-03-15
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Electroplating non-uniform nano-twinned copper will have inherently weak mechanical properties, which cannot meet the requirements of copper interconnect materials for mechanical service properties

Method used

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  • A kind of nano-twinned copper film material and its preparation method and application
  • A kind of nano-twinned copper film material and its preparation method and application
  • A kind of nano-twinned copper film material and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] 1. Plating solution preparation. Prepare the electroplating solution with the following component ratios and disperse it fully and evenly: copper ion 40g / L, sulfuric acid 40g / L, chloride ion 30ppm, accelerator 80ppm, auxiliary agent 20ppm, pure water 250mL;

[0072] Wherein, the accelerator is gelatin with a coagulation value of 100 bloom, and the auxiliary agent is sodium oleate.

[0073] 2. Cathode pretreatment. High-purity titanium plates are used as cathodes, which are fully degreased, pickled, and washed in sequence.

[0074] 3. DC electroplating. Immerse the titanium plate cathode and phosphorus copper anode (phosphorus content 0.05wt.%) in the plating solution, apply 300rpm mechanical stirring and 700W 50Hz ultrasonic, control the temperature of the plating solution to 30°C. Then access the rectifier, with 4A / dm 2 Electroplating at current density for 150min.

[0075] 4. Coating post-treatment. Take out the coating and the substrate, rinse repeatedly with p...

Embodiment 2

[0078] 1) Plating solution preparation. Prepare the electroplating solution with the following component ratios and disperse it fully and evenly: copper ion 40g / L, sulfuric acid 20g / L, chloride ion 50ppm, accelerator 30ppm, auxiliary agent 10ppm, pure water 250mL;

[0079] Wherein, the accelerator is gelatin with a coagulation value of 80 bloom, and the auxiliary agent is sodium laurate.

[0080]2) Cathode pretreatment. High-purity titanium plates are used as cathodes, which are fully degreased, pickled, and washed in sequence.

[0081] 3) DC electroplating. Immerse the titanium plate cathode and phosphorus copper anode (phosphorus content 0.05wt.%) in the plating solution, apply 300rpm magnetic stirring and 300W 50Hz ultrasonic, control the temperature of the plating solution to 25°C. Then access the rectifier, with 3A / dm 2 Electroplating at current density for 20min.

[0082] 4) Coating post-treatment. Take out the coating and the substrate, rinse repeatedly with pure ...

Embodiment 3

[0085] The difference from Example 1 is that in Step 3, 300 rpm mechanical agitation was not applied, but a 2 L / min circulating spray flow was used instead. The structure of the coating, the ratio of nano-twinned columnar crystals and nano-twinned equiaxed crystals are similar to those in Example 1.

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Abstract

The invention discloses a nano-twinned copper film material, a preparation method and application thereof. The copper film material includes a nano-twinned hierarchical structure, and the thickness of the hierarchical structure in the copper film accounts for ≥90%; the hierarchical structure is composed of nano-twinned columnar crystals and nano-twinned equiaxed crystals , the thickness ratio of the nano-twinned equiaxed crystals in the hierarchical structure is greater than the thickness ratio of the nano-twinned columnar crystals in the hierarchical structure, and the direction of the nano-twinned equiaxed twin wafer layer is random distributed. The nano-twinned copper thin film material provided by the invention has excellent strength and ductility, as well as mechanical isotropy, and can meet the requirements of copper interconnection materials for mechanical service performance.

Description

technical field [0001] The invention relates to the technical field of nano-structured metal materials, in particular to a nano-twinned copper film material and its preparation method and application. Background technique [0002] Metal copper is widely used in many fields such as electronics, machinery manufacturing, metallurgy and chemical industry. Specifically, in the field of contemporary advanced integrated circuit packaging and printed circuit board manufacturing, copper has become an irreplaceable electronic interconnection material due to its excellent electrical conductivity, thermal conductivity, and electromigration resistance. In the most mature patterned copper interconnect material filling process, the absolute proportion of copper interconnects needs to be prepared by electroplating. [0003] Generally, the elongation at break of electroplated copper is high (>10%) but the tensile strength is insufficient (<300MPa). With the development of the chip pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38C25D5/20C25D21/10H01L23/532H05K1/09B82Y30/00B82Y40/00
CPCC25D3/38C25D5/20C25D21/10H01L23/53228H05K1/09B82Y30/00B82Y40/00
Inventor 刘志权李哲黄静高丽茵孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI