Composition for forming anti-PID packaging adhesive film, anti-PID packaging adhesive film and solar module

A technology for solar modules and encapsulation films, applied in the field of solar cells, can solve problems such as the inability to completely solve the problem of anti-PID of double-sided cell modules, and achieve the effects of improving uniformity and performance stability, increasing barrier performance and enhancing barrier effect.

Pending Publication Date: 2021-05-21
HANGZHOU FIRST APPLIED MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The main purpose of the present invention is to provide a kind of composition for forming anti-PID encapsulation adhesive film, anti-PID encapsulation adhesive film and solar module, to solve the double-sided battery module that the existing anti-PID EVA encapsulation film cannot completely solve Anti-PID problem

Method used

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  • Composition for forming anti-PID packaging adhesive film, anti-PID packaging adhesive film and solar module

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preparation example Construction

[0027] The above-mentioned encapsulating adhesive film can be prepared by methods commonly used in the art. Another aspect of the present application also provides a preferred method for preparing an encapsulating adhesive film, which includes: using the above-mentioned composition for forming an anti-PID encapsulating adhesive film as a raw material, through melt extrusion and calendering, to obtain the required encapsulating adhesive membrane.

[0028] Another aspect of the present application also provides an anti-PID packaging adhesive film, which is prepared by using the above-mentioned composition as a raw material.

[0029] In the above composition for forming an anti-PID encapsulation film, the addition of a metal ion trapping agent can trap metal cations, thereby reducing the concentration of free metal ions; while the addition of an organic co-crosslinking agent can increase the crosslinking density of the encapsulation film , increase the barrier performance of the...

Embodiment 1

[0034] A kind of anti-PID photovoltaic encapsulation material, by weight, its main raw material is composed as follows: 100 parts of ethylene-vinyl acetate copolymers (Singapore TPC company, VA mass fraction is 28%), the metal ion trapping agent phosphoric acid of 0.2 mass parts Zirconium (Acros reagent), 1 part organic co-crosslinker ethoxytrimethylolpropane triacrylate (Sartomer Chemical Co. Ltd.), 0.6 part crosslinker tert-butyl peroxide 2-ethylhexyl carbonate ( Arkema Company), 0.5 part of tackifier γ-methacrylic acid acyloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), 0.2 part of hindered amine light stabilizer sebacic acid bis-2, 2,6,6-tetramethylpiperidinol ester (Tianjin Lianlong Co., Ltd.). The above raw materials are pre-mixed, melt-extruded, cast into a film, cooled, cut and rolled to prepare a photovoltaic encapsulation film E-1 that is resistant to the PID phenomenon of the module.

Embodiment 2

[0036] A kind of anti-PID photovoltaic encapsulation material, by weight, its main raw material is composed as follows: 100 parts of ethylene-vinyl acetate copolymers (Singapore TPC company, VA mass fraction is 28%), the metal ion trapping agent phosphoric acid of 0.2 mass parts Zirconium (Acros reagent), 0.1 part of organic co-crosslinker N,N'-methylenebisacrylamide (Bainwei Chemical Co., Ltd.), 0.6 part of crosslinker tert-butyl peroxide 2-ethylhexyl carbonate (Acros Ma company), 0.5 parts of tackifier γ-methacrylic acid acyloxypropyl trimethoxysilane (Hubei Jingzhou Jianghan Fine Chemical Co., Ltd.), 0.2 parts of hindered amine light stabilizer sebacic acid bis-2,2, 6,6-tetramethylpiperidinol ester (Tianjin Lianlong Co., Ltd.). The above raw materials are pre-mixed, melt-extruded, cast into a film, cooled, slitting and winding to prepare a photovoltaic encapsulation film E-2 that is resistant to the PID phenomenon of modules.

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Abstract

The invention provides a composition for forming an anti-PID packaging adhesive film, the anti-PID packaging adhesive film and a solar module. The composition comprises the following components in parts by weight: 100 parts of matrix resin, 0.01-5 parts of a metal ion trapping agent and 0.01-5 parts of an organic co-crosslinking agent. The metal ion trapping agent is added, so that metal cations can be captured, and the concentration of free metal ions is reduced; by adding the organic co-crosslinking agent, the crosslinking density of the packaging adhesive film can be improved, the barrier effect of the packaging adhesive film on metal ions is enhanced, and the migration speed of the metal ions to the surface of a battery piece is reduced. The two components are added into the matrix resin, and the dosages of the three components are limited in the range, so that on one hand, the PID phenomenon in the photovoltaic module can be effectively reduced through the synergistic effect of the metal ion trapping agent and the organic co-crosslinking agent, and on the other hand, the compatibility of the three components can be improved; and thus, the uniformity and the performance stability of the formed packaging film are improved.

Description

technical field [0001] The invention relates to the field of solar cells, in particular to a composition for forming an anti-PID encapsulation film, an anti-PID encapsulation film and a solar module. Background technique [0002] Because the current solar cell modules are prone to PID phenomenon (potential-induced decay phenomenon), which leads to module power attenuation, which in turn leads to an increase in the cost of photovoltaic power generation equipment, and ultimately limits the application of photovoltaic power generation technology. In existing solar modules, metal ions are precipitated from the glass or penetrate the encapsulant film from the external environment of the module, migrate to the surface of the cell, and destroy the P-N junction, which is the most important factor leading to the PID phenomenon of photovoltaic modules. Therefore, blocking the migration of metal ions in the encapsulation film and reducing the content of free metal ions in the encapsula...

Claims

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Application Information

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IPC IPC(8): C09J4/06C09J4/02C09J11/04C09J11/06C09J7/30C09J7/10H01L31/048
CPCC09J4/06C09J11/04C09J11/06C09J7/30C09J7/10H01L31/0481Y02E10/50
Inventor 桑燕杜柑宏刘挺汪浩楠
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
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