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Tin soldering paste, preparation method of tin soldering paste and welding method

A solder paste and solder paste technology, applied in welding equipment, welding media, welding/cutting media/materials, etc., can solve the problems of a large number of holes in solder joints, easy agglomeration of tin powder, and inability to withstand high temperature, and reduce the porosity, Ensure the welding quality and the effect of good electrical conductivity

Active Publication Date: 2021-06-04
厦门市及时雨焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the problem of a large number of soldering holes in the existing solder paste, and provide a solder paste and its preparation method. The solder paste can effectively reduce the soldering holes, improve the conductivity of the solder joints, and ensure the welding quality.
In order to solve the problem caused by the easy agglomeration of tin powder, in the prior art, components that play a dispersing role are usually introduced into the paste. However, these components are not resistant to high temperatures and release gas during the soldering process, causing solder joints to appear. lots of holes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033]A solder paste is composed of the following components in terms of weight percentage: 90% tin powder and 10% solder paste, wherein the tin powder is tin element or tin alloy wrapped with an oxide film, and the solder paste is measured in weight percentage Composed of the following components: rosin 40%, polyamide wax 10%, rosin ester 10%, dibasic acid is methyl succinic acid 6%, organic amine is n-trioctylamine 2%, solvent is ethylene glycol dimethyl ether 22%, Glycerol 10%.

[0034] Prepare the above solder paste as follows:

[0035] Weigh each raw material according to weight percentage, add rosin, film-forming agent, dibasic acid and thixotropic agent into the solvent and mix evenly, after obtaining the paste, add organic amine to neutralize the dibasic acid to obtain pH=7.0±0.5 paste; finally add tin powder and stir evenly to obtain solder paste.

[0036] Apply the above solder paste to the mobile phone circuit board products with a minimum BGA ball diameter of 0.2...

Embodiment 2

[0040] A solder paste is composed of the following components in terms of weight percentage: 90% tin powder and 10% solder paste, wherein the tin powder is tin element or tin alloy wrapped with an oxide film, and the solder paste is measured in weight percentage Composed of the following components: rosin 40%, polyamide wax 10%, rosin ester 10%, dibasic acid is dichloroacetic acid 5%, organic amine is morpholine or piperidine 3.5%, solvent is ethylene glycol monobutyl ether 31.5%,

[0041] Prepare the above solder paste as follows:

[0042] Weigh each raw material according to weight percentage, add rosin, film-forming agent, dibasic acid and thixotropic agent into the solvent and mix evenly, after obtaining the paste, add organic amine to neutralize the dibasic acid to obtain pH=7.0±0.5 paste; finally add tin powder and stir evenly to obtain solder paste.

[0043] Apply the above solder paste to the mobile phone circuit board product with a minimum BGA ball diameter of 0.2m...

Embodiment 3

[0047] A solder paste is composed of the following components in terms of weight percentage: 90% tin powder and 10% solder paste, wherein the tin powder is tin element or tin alloy wrapped with an oxide film, and the solder paste is measured in weight percentage Composed of the following components: rosin 40%, polyamide wax 10%, rosin ester 10%, dibasic acid is methylmalonic acid 6%, organic amine is dimethyl dodecylamine 3%, solvent is ethylene glycol Monobutyl ether 20%, ethylene glycol 9%.

[0048] Prepare the above solder paste as follows:

[0049] Weigh each raw material according to weight percentage, add rosin, film-forming agent, dibasic acid and thixotropic agent into the solvent and mix evenly, after obtaining the paste, add organic amine to neutralize the dibasic acid to obtain pH=7.0±0.5 paste; finally add tin powder and stir evenly to obtain solder paste.

[0050] Apply the above solder paste to the mobile phone circuit board product with a minimum BGA ball diam...

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PUM

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Abstract

The invention relates to tin soldering paste, a preparation method of the tin soldering paste and a welding method. The tin soldering paste is prepared from, by weight, 85%-95% of tin powder and 5%-15% of soldering paste; the tin powder is a tin elementary substance or tin alloy coated with an oxidation film; and the soldering paste is prepared from the components including, by weight, 35%-45% of rosin, 6%-10% of a thixotropic agent, 8%-12% of a film-forming agent, 1%-6% of binary acid, 1%-6% of organic amine and the balance of a solvent. The tin powder in the tin soldering paste is evenly dispersed, the oxidation film is removed before welding, agglomeration is avoided during welding, the condition that a large number of holes are generated in the welding process is effectively prevented, the welding effect is good, welding spots have good conductivity, and the tin soldering paste is applicable to connection of electronic workpieces.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a solder paste, a preparation method and a welding method thereof. Background technique [0002] Welding, also known as welding, is a manufacturing process and technique that uses heat, high temperature, or pressure to join metal or other thermoplastic materials such as plastics. Soldering is a welding method that uses a low-melting-point tin-based alloy as a metal solder to heat and melt, then infiltrates and fills the gap at the joint of the metal parts. Since the welding part plays the role of connection, for workpieces that require electrical conductivity, the conductivity of the solder joint should ideally be consistent with that of the connected workpiece. Therefore, the selection of welding materials is very critical. [0003] Patent application CN111299896A discloses a solder paste and its preparation method, which relates to the technical field of soldering ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40B23K35/36B23K3/047
CPCB23K35/262B23K35/40B23K35/36B23K3/0478
Inventor 郑序漳刘庆德章远玲
Owner 厦门市及时雨焊料有限公司