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A kind of solder paste and its preparation method and welding method

A technology of solder paste and solder paste, applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of a large number of holes in solder joints, easy agglomeration of tin powder, welding holes, etc., to reduce the porosity rate and ensure The effect of welding quality and good conductive effect

Active Publication Date: 2022-07-29
厦门市及时雨焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the problem of a large number of soldering holes in the existing solder paste, and provide a solder paste and its preparation method. The solder paste can effectively reduce the soldering holes, improve the conductivity of the solder joints, and ensure the welding quality.
In order to solve the problem caused by the easy agglomeration of tin powder, in the prior art, components that play a dispersing role are usually introduced into the paste. However, these components are not resistant to high temperatures and release gas during the soldering process, causing solder joints to appear. lots of holes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033]A solder paste is composed of the following components according to weight percentage: 90% of tin powder and 10% of solder paste, wherein the tin powder is tin element or tin alloy wrapped with an oxide film, and the solder paste is according to weight percentage It is composed of the following components: 40% rosin, 10% polyamide wax, 10% rosin ester, 6% methyl succinic acid as dibasic acid, 2% n-trioctylamine as organic amine, and ethylene glycol dimethyl ether as solvent 22%, Glycerol 10%.

[0034] The above-mentioned solder paste is prepared as follows:

[0035] Weigh each raw material according to the weight percentage, add rosin, film-forming agent, dibasic acid and thixotropic agent to the solvent and mix evenly, after obtaining the paste, add organic amine to neutralize the dibasic acid to obtain pH=7.0±0.5 Paste; finally add tin powder and stir evenly to obtain solder paste.

[0036] Apply the above solder paste to the mobile phone circuit board products with ...

Embodiment 2

[0040] A solder paste is composed of the following components according to weight percentage: 90% of tin powder and 10% of solder paste, wherein the tin powder is tin element or tin alloy wrapped with an oxide film, and the solder paste is according to weight percentage It consists of the following components: 40% rosin, 10% polyamide wax, 10% rosin ester, 5% dichloroacetic acid as dibasic acid, 3.5% organic amine as morpholine or piperidine, and ethylene glycol monobutyl ether as solvent 31.5%,

[0041] The above-mentioned solder paste is prepared as follows:

[0042] Weigh each raw material according to the weight percentage, add rosin, film-forming agent, dibasic acid and thixotropic agent to the solvent and mix evenly, after obtaining the paste, add organic amine to neutralize the dibasic acid to obtain pH=7.0±0.5 Paste; finally add tin powder and stir evenly to obtain solder paste.

[0043] Apply the above solder paste to the mobile phone circuit board product with a mi...

Embodiment 3

[0047] A solder paste is composed of the following components according to weight percentage: 90% of tin powder and 10% of solder paste, wherein the tin powder is tin element or tin alloy wrapped with an oxide film, and the solder paste is according to weight percentage It consists of the following components: 40% rosin, 10% polyamide wax, 10% rosin ester, 6% methylmalonic acid as dibasic acid, 3% dimethyldodecylamine as organic amine, and ethylene glycol as solvent Monobutyl ether 20%, ethylene glycol 9%.

[0048] The above-mentioned solder paste is prepared as follows:

[0049] Weigh each raw material according to the weight percentage, add rosin, film-forming agent, dibasic acid and thixotropic agent to the solvent and mix evenly, after obtaining the paste, add organic amine to neutralize the dibasic acid to obtain pH=7.0±0.5 Paste; finally add tin powder and stir evenly to obtain solder paste.

[0050] Apply the above solder paste to the mobile phone circuit board produc...

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PUM

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Abstract

The invention relates to a solder paste and a preparation method and a welding method thereof. The solder paste is composed of 85-95% of tin powder and 5-15% of solder paste according to the weight percentage, wherein the tin powder has an oxidation A film-wrapped tin element or a tin alloy, the solder paste is composed of the following components by weight percentage: 35-45% of rosin, 6-10% of thixotropic agent, 8-12% of film-forming agent, 1-dibasic acid 6%, organic amine 1-6%, and the balance is solvent. The tin powder in the solder paste of the present invention is evenly dispersed, the oxide film is removed before welding, no agglomeration occurs during welding, a large number of holes are effectively avoided during the welding process, the welding effect is good, and the solder joint has good conductivity, and is suitable for use in on the connection of the electronic workpiece.

Description

technical field [0001] The invention relates to the technical field of welding materials, in particular to a solder paste and a preparation method and a welding method thereof. Background technique [0002] Welding, also known as welding, is a manufacturing process and technique for joining metals or other thermoplastic materials such as plastics by means of heat, high temperature, or high pressure. Soldering is a welding method that uses a low-melting tin-based alloy as a metal solder to infiltrate and fill the gap between the metal parts after heating and melting. Since the welding part plays the role of connection, for workpieces with electrical conductivity requirements, the conductivity of the welding point should ideally be consistent with the connecting workpiece. Therefore, the selection of welding materials is very critical. [0003] Patent application CN111299896A discloses a solder paste and a preparation method thereof, and relates to the technical field of sold...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/40B23K35/36B23K3/047
CPCB23K35/262B23K35/40B23K35/36B23K3/0478
Inventor 郑序漳刘庆德章远玲
Owner 厦门市及时雨焊料有限公司