Polyimide film, and preparation method and application thereof

A polyimide film and polyimide technology, applied in the field of polymer materials, can solve the problems of high cost, reduce the degree of golden yellow on the surface, and reduce the formation of charge transfer complexes, so as to improve heat resistance and reduce Electron cloud density, effect of increasing thermal decomposition temperature

Active Publication Date: 2021-06-11
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The traditional transparent polyimide film adjusts the ratio of diamine or dianhydride during the preparation process, and introduces an appropriate amount of fluorine-containing monomer into the synthesis system, which effectively reduces the formation of its charge transfer complex, and then It reduces the degree of golden yellow on the surface, but the cost is high and most of the monomers have been applied for protection by foreign companies

Method used

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  • Polyimide film, and preparation method and application thereof
  • Polyimide film, and preparation method and application thereof
  • Polyimide film, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] 274.79925g of DMSO was added to the three-necked flask, and 15.9255g of bis(4-aminocyclohexyl)ether and 16.9740g of 2,2-bis(4-aminophenyl)propane were quickly added to the above-mentioned three-necked flask in an argon atmosphere. 75°C, keep stirring at a rate of 300r / min, slowly add 58.8480g of 3,4,9,10-perylenetetracarboxylic dianhydride within 15 minutes after fully dissolving, then keep stirring for 48 hours to obtain a homogeneous transparent colorless viscous polyamide Acid colloid; take out the colloid and pour it on a clean glass plate, spread it evenly, and then go through the treatment of 80°C for 25min, 200°C for 25min, and 300°C for 25min in the oven; after it is completely cooled, lift it up, and you can get high transparency and durability. High temperature polyimide film. The polyimide repeating structural unit in the polyimide film is:

[0062] The infrared spectrogram of the polyimide film prepared in this embodiment is shown in figure 1 .

Embodiment 2

[0064] Add 278.697g of polar aprotic organic solvent DMAC into the three-necked flask, quickly add 31.6400g of 1,5-naphthalene diamine into the above-mentioned three-necked flask in an argon atmosphere, keep stirring at 40°C at a speed of 300r / min, and fully dissolve Slowly add 27.6290 g of 1,4,5,8-decalintetracarboxylic anhydride and 2.0178 g of 5-[2-(1,3-dioxoisobenzofuran-5-yl)prop-2- base] isobenzofuran-1,3-dione, and then continue to stir for 12 hours to obtain a homogeneous transparent colorless viscous polyamic acid colloid; take out the colloid and pour it on a smooth glass plate, coat it evenly, and pass it in the oven for 10 minutes 90°C for 15 minutes, 260°C for 15 minutes, and 360°C for 15 minutes; uncover it after it is completely cooled, and you can get a highly transparent and high-temperature resistant polyimide film. The polyimide repeating structural unit in the polyimide film is:

[0065]

Embodiment 3

[0067] Add 175.8582g of polar aprotic organic solvent DMAC into the three-necked flask, quickly add 24.9912g of 1,5-anthracenediamine into the above-mentioned three-necked flask in an argon atmosphere, and stir continuously at 300r / min at 40°C to fully dissolve Then slowly add 13.4502g 1,2,4,5-cyclohexanetetracarboxylic dianhydride and 20.1780g 5-[2-(1,3-dioxoisobenzofuran-5-yl)propane within 10 minutes -2-yl] isobenzofuran-1,3-dione, followed by continuous stirring for 12 hours to obtain a homogeneous transparent colorless viscous polyamic acid colloid; take out the colloid and pour it on a clean glass plate, coat it evenly, and put it in the oven After 10min of 90°C, 15min of 260°C, and 15min of 360°C in sequence; after complete cooling, the polyimide film with high transparency and high temperature resistance can be obtained. The polyimide repeating structural unit in the polyimide film is:

[0068]

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Abstract

The invention discloses a polyimide film, and a preparation method and application thereof, and relates to the technical field of polymer materials, the polyimide film comprises a diamine structural unit and a dianhydride structural unit, the diamine structural unit and the dianhydride structural unit are combined by the following two: a multi-benzene ring type diamine monomer and an aliphatic and non-coplanar dianhydride monomer; or aliphatic and non-coplanar diamine monomers and multi-benzene ring type dianhydride monomers. According to the polyimide film, due to the introduction of the multi-benzene-ring type monomer, the heat resistance of polyimide is effectively improved in the preparation process, and the thermal decomposition temperature of the polyimide is further increased; and meanwhile, aliphatic groups and non-coplanar groups are introduced, so that a high-temperature-resistant polyimide product with high light transmittance is obtained while other properties are not changed, and the polyimide product can be applied to a substrate and a cover plate part of a flexible display screen.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyimide film, a preparation method and an application thereof. Background technique [0002] Polyimide refers to a high molecular polymer material containing imide rings (-CO-N-CO-) on the main chain. Because of its excellent insulation properties at high and low temperatures, it is widely used in technical fields such as aviation, aerospace and microelectronics. With the rapid development of the flexible display industry in recent years, polyimide materials with excellent performance have the characteristics of not being affected by high temperature under the premise of maintaining a colorless and transparent appearance with high transmittance, so the heat dissipation of polyimide films is improved. Decomposition temperature to adapt to the high temperature effects of evaporation and other processes in the screen manufacturing process is a major problem facing the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08H01L23/29H01L51/00H01L51/52C08G73/10C08J5/18
CPCC08J5/18C08G73/1082C08G73/1042C08G73/1007H01L23/293C08J2379/08H10K77/111H10K50/841Y02E10/549
Inventor 简凌锋翁梦蔓梁俊锴刘靖刘屹东闵永刚
Owner GUANGDONG UNIV OF TECH
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