Composite material with low dielectric constant and low dielectric loss and preparation method thereof

Abstract

The invention discloses a composite material with low dielectric constant and low dielectric loss and a preparation method thereof. The composite material comprises thermosetting polyolefin resin, ultra-high molecular weight polyethylene fiber and / or ultra-high molecular weight polyethylene cloth, The thermosetting polyolefin resin and the ultra-high molecular weight polyethylene fiber and / or the ultra-high molecular weight polyethylene cloth are fused to form an interpenetrating network structure. The thermosetting polyolefin resin is compounded with the ultra-high molecular weight polyethylene fiber and / or the ultra-high molecular weight polyethylene cloth through a coupling agent capable of connecting the two phases. The coupling agent can be dissolved in the liquid thermosetting polyolefin resin and participates in reaction when the thermosetting polyolefin resin is cured, and stable chemical bonds are formed at the interface where the thermosetting polyolefin resin is connected with the ultra-high molecular weight polyethylene. The dielectric constant of the prepared low-dielectric-constant low-dielectric-loss composite material is smaller than 2.4 F / m, and the low-dielectric-constant low-dielectric-loss composite material has the outstanding advantages of high strength, light weight, no polarity, low cost and the like and is wide in application range.

Description

technical field [0001] The invention relates to the technical field of low dielectric constant materials, in particular to a composite material with low dielectric constant and low dielectric loss and a preparation method thereof. Background technique [0002] Low dielectric constant materials or low-K materials (low-K materials) are currently a hot topic in the research of the semiconductor industry. By reducing the dielectric constant of the dielectric material used in the integrated circuit, the leakage current of the integrated circuit can be reduced, the capacitive effect between the wires can be reduced, and the heating of the integrated circuit can be reduced. [0003] In recent years, with the increase in speed and frequency of signal transmission and the shortening of transmission distance, circuits and components must be denser. The integration level of integrated circuits has increased rapidly, and the operating frequency range of radio frequency connectors and m...

AI Technical Summary

Problems solved by technology

The dielectric constants of these materials are still too high (all>5F / m), and it is increasingly difficult to meet the requirements of reliability and miniaturization of electronic integrated devices. Therefore, it is imperative to develop materials with lower dielectric constants

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