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Low-temperature curing conductive adhesive and preparation method thereof

A conductive adhesive and low-temperature technology, applied in the field of conductive adhesive, can solve the problems that cannot meet the needs of high-tech development, brittleness and low thermal conductivity, and cannot meet the needs of microelectronics and semiconductor packaging. and the effect of ability

Pending Publication Date: 2021-06-15
SHENZHEN FITECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it uses a tin-bismuth eutectic alloy, so its solidus temperature is above the eutectic temperature of the tin-bismuth eutectic alloy at 138°C, which cannot meet the requirements of microelectronics and semiconductor packaging, especially the low requirements of the Internet of Things (Iot). -K components require low-temperature and low-load packaging
At the same time, the brittleness and low thermal conductivity brought by a large amount of Bi elements cannot meet the needs of high-tech development.

Method used

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  • Low-temperature curing conductive adhesive and preparation method thereof
  • Low-temperature curing conductive adhesive and preparation method thereof
  • Low-temperature curing conductive adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1～4

[0050] Embodiment 1~4, a kind of low-temperature curing conductive adhesive

[0051]

[0052]

Embodiment 1

[0053] Embodiment 1 The preparation method of low-temperature curing conductive adhesive comprises the following steps:

[0054] S1) Put the solvent, thermosetting resin, corrosion inhibitor, and thixotropic agent into an 80°C reactor in turn and stir for 60 minutes until all the solid particles are dissolved and appear clear and transparent, then add liquid metal and micro-nano reinforced particles to mechanically disperse at high speed, and The temperature is 100m / s, the dispersion time is 60min, the liquid metal is dispersed into liquid metal conductive particles, and then the material in the reactor is transferred to the cooling container, sealed, and naturally cooled to room temperature;

[0055] S2) Add curing agent and defoamer to the material in step S1 and disperse mechanically at a high speed with a line speed of 100m / s and a dispersion time of 60min until the diameter of the droplet is less than 15μm.

Embodiment 2

[0056] Embodiment 2 The preparation method of low-temperature curing conductive adhesive comprises the following steps:

[0057] S1) Put the solvent, thermosetting resin, organic acid activator, corrosion inhibitor, and thixotropic agent into a 90°C reaction kettle and stir for 60 minutes until the solid particles are completely dissolved and appear clear and transparent, then add liquid metal and micro-nano reinforced particle machinery High-speed dispersion, the speed is 100m / s, and the dispersion time is 80min. The liquid metal is dispersed into liquid metal conductive particles, and then the material in the reactor is transferred to the cooling container, sealed, and naturally cooled to room temperature;

[0058] S2) Add curing agent and defoamer to the material in step S1 and disperse mechanically at a high speed at a speed of 100m / s and a dispersion time of 80min until the diameter of the droplet is less than 15μm.

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Abstract

The invention belongs to the technical field of conductive adhesives, and particularly relates to a low-temperature curing conductive adhesive and a preparation method thereof. The low-temperature curing conductive adhesive is prepared from, by mass, 0.1-88% of liquid metal conductive particles; 4-90% of thermosetting resin; 0-8% of an organic acid activator; 0.3-5% of a corrosion inhibitor; 0.3-5% of a thixotropic agent; 0-10% of a solvent; 0.2-10% of a curing agent; 0.1-0.3% of a defoaming agent; and 0-2% of micro-nano reinforced particles. The conductive particles in the obtained conductive adhesive are small in particle size, the curing temperature of the conductive adhesive is low, the curing time is short, the printing life of the steel screen dot adhesive is long, the shear strength of a welding spot is high, the heat conductivity coefficient is high, and the use performance is good.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesives, and in particular relates to a low-temperature curing conductive adhesive and a preparation method thereof. Background technique [0002] With the development of microelectronics and semiconductor packaging technology towards thinner and smaller miniaturization, the outer pin spacing of electronic components is becoming more and more dense, and because Moore's law of semiconductors is going to the limit, in the post-Moore era, semiconductor packaging is also moving towards Development in the direction of heterogeneity, three-dimensional and integrated packaging. In microelectronics and semiconductor packaging technology, adhesive materials play a very important role. At present, the most commonly used adhesive material is soldering based on tin-based solder. However, with the vigorous development of flexible electronic devices and equipment, The high elastic modulus and extremely sm...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J183/04C09J133/04C09J9/02
CPCC08K2003/0837C08K2003/0893C08K2201/001C09J9/02C09J133/04C09J163/00C09J183/04C08K3/08
Inventor 徐朴王思远刘硕
Owner SHENZHEN FITECH