Cutting fluid for cutting large-size silicon wafer by diamond wire and preparation process of cutting fluid

Abstract

The invention relates to the technical field of cutting fluids, and discloses a cutting fluid for cutting a large-size silicon wafer by a diamond wire and a preparation process of the cutting fluid. The cutting fluid comprises the following components in parts by mass: a defoaming agent, a wetting agent and a lubricating agent are compounded, so that the lubricity and seepage force of the cutting fluid are improved, and the cutting fluid can permeate into a space between a wire net of a diamond wire and a silicon wafer or a space between the wire net and silicon wafer scraps so as to form a layer of lubricating film, so that damage, stress and micro cracks caused by cutting are reduced. Meanwhile, the surface of a large-size silicon wafer which is being cut can be rapidly cooled, micro powder generated in the cutting process can be effectively dispersed into a mixed solution composed of water, a lubricating agent and a wetting agent, and the situation that silicon powder is gathered on the cutting local part, and consequently cutting of the silicon wafer is affected or damaged is avoided.

Description

technical field [0001] The invention relates to the field of cutting fluid technology, in particular to a cutting fluid for diamond wire cutting large-size silicon wafers and a preparation process thereof. Background technique [0002] The existing domestic diamond wire cutting fluid is mainly divided into three types [0003] A, one is the cutting fluid of polyethylene glycol system, as disclosed in patent application CN 102352278A, it is mainly based on polyethylene glycol, adding a certain proportion of antirust agent, emulsifier and defoamer, this cooling The advantage of the liquid is that the cooling effect is better, and it has a certain suspension and chelation effect on impurities such as silicon powder. The disadvantage is that the cost is high and there is a certain degree of environmental pollution. [0004] B, one is a small molecule alcohol, ether, phenol mixed cutting fluid, as disclosed in patent application CN 102433190 A, it mainly uses propylene glycol as...

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Problems solved by technology

[0007] The technical problem to be solved by the present invention is: the existing cutting fluid cannot effectively disperse the silicon powder produced during the cutting process of large-size silicon wafers, resulting in low cutting efficiency and increased abnormality rate and contamination rate

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