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High-stability environment-friendly soldering paste and preparation method thereof

A high stability, solder paste technology, applied in the direction of welding equipment, welding medium, manufacturing tools, etc., can solve the problems of poor welding quality, affecting stability, tin is easy to be oxidized, etc., to promote flow and spreading, and improve stability , the effect of slowing down the rate of oxidation

Active Publication Date: 2021-06-18
SHENZHEN BANGDA TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, although the commercially available solder paste has good soldering performance, it contains a certain amount of halogen elements, which will not only cause certain pollution to the environment during the soldering process, but also cause a certain degree of pollution to the products that need to be soldered. ground damage
Furthermore, the tin in the solder is easily oxidized, which not only affects its stability, but also adversely affects the quality of soldering.

Method used

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  • High-stability environment-friendly soldering paste and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0037] A high-stability environment-friendly solder paste prepared by mixing modified nano-alloy solder and solder paste at a weight ratio of 88.5:11.5;

[0038] Wherein, the flux paste consists of the following raw materials in parts by weight:

[0039] 75 parts rosin, 50 parts solvent, 4 parts glyceryl stearate, 6 parts triethanolamine succinate, 7 parts methyl benzotriazole, 6 parts hydrogenated castor oil, 3 parts activator and 8 parts surfactant agent.

[0040] The preparation technology of modified nano-alloy solder comprises the following steps:

[0041] 1. Pretreatment of nano-alloy solder;

[0042] Weigh an appropriate amount of nano-alloy solder, and put the weighed nano-alloy solder into a 65% ethanol solution at a solid-to-liquid ratio of 0.2 g / mL, and then add an appropriate amount of modifier to the resulting mixed component , after ultrasonic dispersion for 10 minutes, the temperature of the resulting mixture was raised to 50°C, and kept under the protection ...

Embodiment 2

[0060] A high-stability environment-friendly solder paste prepared by mixing modified nano-alloy solder and solder paste at a weight ratio of 89:11;

[0061] Wherein, the flux paste consists of the following raw materials in parts by weight:

[0062] 80 parts rosin, 55 parts solvent, 5 parts glyceryl stearate, 7 parts triethanolamine succinate, 10 parts methyl benzotriazole, 8 parts hydrogenated castor oil, 4 parts activator and 12 parts surfactant agent.

[0063] The preparation technology of modified nano-alloy solder comprises the following steps:

[0064] 1. Pretreatment of nano-alloy solder;

[0065] Weigh an appropriate amount of nano-alloy solder, and put the weighed nano-alloy solder into a 70% ethanol solution at a solid-to-liquid ratio of 0.25g / mL, and then add an appropriate amount of modifier to the resulting mixed component , after ultrasonic dispersion for 15 minutes, the temperature of the resulting mixture was raised to 55°C, and kept under the protection of...

Embodiment 3

[0083] A high-stability environment-friendly solder paste prepared by mixing modified nano-alloy solder and solder paste at a weight ratio of 90:10;

[0084] Wherein, the flux paste consists of the following raw materials in parts by weight:

[0085] 85 parts rosin, 60 parts solvent, 6 parts glyceryl stearate, 8 parts triethanolamine succinate, 11 parts methyl benzotriazole, 10 parts hydrogenated castor oil, 5 parts activator and 15 parts surface active agent.

[0086] The preparation technology of modified nano-alloy solder comprises the following steps:

[0087] 1. Pretreatment of nano-alloy solder;

[0088] Weigh an appropriate amount of nano-alloy solder, and put the weighed nano-alloy solder into a 70% ethanol solution at a solid-to-liquid ratio of 0.35 g / mL, and then add an appropriate amount of modifier to the resulting mixed component , after ultrasonic dispersion for 15 minutes, the temperature of the resulting mixture was raised to 55°C, and kept under the protect...

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Abstract

The invention relates to the technical field of soldering paste preparation, in particular to high-stability environment-friendly soldering paste and a preparation method thereof. The soldering paste is prepared by mixing modified nano-alloy solder and flux paste according to the weight ratio of (88.5-91):(9-11.5), wherein the paste flux is prepared from the following raw materials in parts by weight: 75 to 90 parts of rosin, 50 to 65 parts of a solvent, 4 to 8 parts of glyceryl stearate, 6 to 10 parts of triethanolamine succinate, 7 to 13 parts of methylbenzotriazole, 6 to 15 parts of hydrogenated castor oil, 3 to 6 parts of an activating agent and 8 to 20 parts of a surface active agent; According to the prepared soldering paste, the probability of generating bubbles, pseudo soldering, continuous soldering and other problems in the soldering process can be reduced; the oxidation rate of metal raw materials in the nano-alloy solder can be effectively slowed down, and the stability of the nano-alloy solder is improved; and the welding quality is ensured. In addition, the prepared soldering paste does not contain halogen elements, does not pollute the environment, and is relatively environment-friendly.

Description

technical field [0001] The invention relates to the technical field of solder paste preparation, in particular to a high-stability environment-friendly solder paste and a preparation method thereof. Background technique [0002] Solder paste is also called solder paste, the English name is solderpaste, gray paste. Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. [0003] In the 1970s, surface mount technology (Surface Mount Technology, referred to as SMT) refers to printing and coating solder paste on the pads of printed circuit boards, and accurately attaching surface mount components to the solder paste coated On the pad, the circuit board is heated according to a specific reflow temperature curve to melt the solder paste, and...

Claims

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Application Information

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IPC IPC(8): B23K35/14B23K35/40
CPCB23K35/025B23K35/40
Inventor 梁凯梁丹梁国辉
Owner SHENZHEN BANGDA TECH CO LTD