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LED packaging material and preparation method thereof

A technology of LED encapsulation and modification, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of shortening the service life of LED devices, large internal stress of curing, poor heat resistance, etc., and achieve excellent light transmittance and high temperature resistance The effect of high stability and excellent performance

Active Publication Date: 2021-06-18
HANGZHOU ANYU TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the defects of epoxy itself such as hygroscopicity, easy aging, poor heat resistance, easy discoloration under high temperature and short-wave light, and large internal stress of curing are exposed, which greatly affects and shortens the service life of LED devices.

Method used

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  • LED packaging material and preparation method thereof
  • LED packaging material and preparation method thereof
  • LED packaging material and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0038] A preparation method of an LED packaging material, comprising the following steps:

[0039] S1: in parts by weight, add 6 parts by weight of graphene oxide to 550 parts by weight of deionized water, then add 300 parts by weight of absolute ethanol, ultrasonically disperse 30 min under 250W power, then add 3 parts by weight of modified silane coupling Combine agent, continue to ultrasonically disperse for 1h, and centrifuge at 3500r / min for 10min to obtain a precipitate, which is washed 3 times with deionized water;

[0040] S2: Mix the above-mentioned sediment deionized water at a weight ratio of 1:20, ultrasonically disperse it at 200W for 50min, then add 15 parts by weight of hydrazine hydrate, ultrasonicate at 60°C for 4h, centrifuge, wash, and dry to obtain a modified Graphene oxide;

[0041] S3: successively add 75 parts by weight of tetrahydrofuran, 6 parts by weight of polymethylphenylsiloxane, 1.7 parts by weight of tartaric acid and 3.2 parts by weight of the ...

Embodiment 2

[0044] A preparation method of an LED packaging material, comprising the following steps:

[0045] S1: In parts by weight, 8 parts by weight of graphene oxide were added to 600 parts by weight of deionized water, then added to 400 parts by weight of dehydrated ethanol, ultrasonically dispersed for 45 min at 280W power, and then 4.5 parts by weight of modified silane coupling Combine agent, continue to ultrasonically disperse for 1.5h, and centrifuge at 4500r / min for 5min to obtain a precipitate, which is washed 3 times with deionized water;

[0046] S2: Mix the above-mentioned sediment deionized water at a weight ratio of 1:25, ultrasonically disperse it for 35min at 250W power, then add 20 parts by weight of hydrazine hydrate, ultrasonicate at 70°C for 6h, centrifuge, wash, and dry to obtain a modified solution. Graphene oxide;

[0047] S3: successively add 80 parts by weight of tetrahydrofuran, 7 parts by weight of polymethylphenylsiloxane, 2.5 parts by weight of tartaric a...

Embodiment 3

[0050] A preparation method of an LED packaging material, the other steps are the same as in Example 1, and the difference from Example 1 is:

[0051] S1: In parts by weight, 7 parts by weight of graphene oxide were added to 700 parts by weight of deionized water, then added to 450 parts by weight of dehydrated ethanol, ultrasonically dispersed for 40 min under 250W power, and then 2.5 parts by weight of modified silane coupling Combine agent, continue to ultrasonically disperse for 2h, and centrifuge at 5000r / min for 5min to obtain a precipitate, which is washed 3 times with deionized water;

[0052] S2: Mix the above-mentioned sediment deionized water at a weight ratio of 1:25, ultrasonically disperse it at 200W for 50min, then add 13 parts by weight of hydrazine hydrate, ultrasonicate at 70°C for 5h, centrifuge, wash, and dry to obtain a modified solution. Sexual graphene oxide.

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Abstract

The invention discloses an LED packaging material and a preparation method thereof. The preparation method comprises the following steps: adding graphene oxide into deionized water and absolute ethyl alcohol, dispersing and centrifuging to obtain a precipitate; mixing the precipitate with deionized water, performing ultrasonic dispersion, then adding hydrazine hydrate, and performing ultrasonic treatment, centrifugation, washing and drying to obtain modified graphene oxide; sequentially adding tetrahydrofuran, polymethylphenylsiloxane, tartaric acid and the modified graphene oxide into a flask, putting the mixture into an oil bath pan, heating for reaction, then dropwise adding epoxy resin into the flask, then adding dibutyltin dilaurate and deionized water for reaction, vacuumizing the flask, stirring for reaction, and cooling to obtain a reactant; and adding 3-hydroxyphthalic anhydride into the reactant, uniformly stirring and mixing, adding imidazo dimethyl pyridine, and stirring for reaction to obtain the LED packaging material. The LED packaging material has excellent light transmittance and high temperature resistance and relatively high hardness, compressive strength and refractive index.

Description

technical field [0001] The invention belongs to the technical field of packaging materials, and particularly relates to an LED packaging material and a preparation method thereof. Background technique [0002] LEDs are composed of chips, metal wires, brackets, conductive adhesives, packaging materials, etc. The packaging materials are mainly used to seal and protect the chips from working properly to avoid them being affected by humidity and temperature in the surrounding environment; fix and support wires to prevent The electronic components are damaged by mechanical vibration and impact, resulting in changes in component parameters; reducing the difference in the refractive index between the LED chip and the air to increase the light output and effectively discharge the heat generated inside. Therefore, for the packaging material, it should have excellent sealing, light transmission, adhesion, dielectric properties and mechanical properties. [0003] The currently used pa...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K9/06C08K3/04C08K5/3417C08K13/06H01L33/56
CPCC08K9/06C08K3/042C08K5/3417C08K13/06H01L33/56C08L2203/206C08L2201/08C08L83/04
Inventor 凌建鸿章贤骏宣兆康张发科
Owner HANGZHOU ANYU TECH CO LTD