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Method for preparing high-bonding-strength carbide coating on diamond surface by using thermal plasma

A thermal plasma, bonding strength technology, applied in metal material coating process, coating, melting spray plating, etc., can solve the problems of low bonding strength, difficult thickness, uneven and dense carbide coating, etc., to achieve airflow velocity Low, small gradient, single and pure effect

Active Publication Date: 2021-06-18
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of non-uniform and dense carbide coating, difficult to control thickness and low bonding strength in the carbide coating prepared on the surface of diamond by the existing method, and propose a method of using thermal plasma to prepare high bonding coating on the surface of diamond. Method of Strength Carbide Coating

Method used

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  • Method for preparing high-bonding-strength carbide coating on diamond surface by using thermal plasma
  • Method for preparing high-bonding-strength carbide coating on diamond surface by using thermal plasma
  • Method for preparing high-bonding-strength carbide coating on diamond surface by using thermal plasma

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specific Embodiment approach 1

[0030] Specific embodiment one: the method of this embodiment utilizes thermal plasma to prepare carbide coating with high binding strength on the diamond surface according to the following steps:

[0031] 1. Weighing:

[0032] Weigh a certain quality of diamond powder with a metal coating;

[0033] The metal coating described in step 1 is a kind of in W, Ti, Cr, Mo;

[0034] Second, cleaning and drying:

[0035] The diamond powder is placed in deionized water, ultrasonically cleaned by an ultrasonic machine, and then dried in a vacuum drying oven;

[0036] Among them, the purpose of ultrasonic cleaning is to fully clean the diamond surface, remove the oil stain on the diamond surface and the impurities adsorbed in the air; the purpose of vacuum drying is to remove the oxygen and water vapor adsorbed on the diamond surface, and avoid side reactions to generate impurities during subsequent processing;

[0037] 3. The diamond powder obtained in step 2 is delivered to a therma...

specific Embodiment approach 2

[0051] Embodiment 2: This embodiment is different from Embodiment 1 in that: the thickness of the metal coating in Step 1 is 50-300 nm.

specific Embodiment approach 3

[0052] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that: the particle size of the diamond powder in step 1 is 100-500 μm.

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Abstract

The invention relates to a method for preparing a coating on a diamond surface, in particular to a method for preparing a high-bonding-strength carbide coating on the diamond surface by using thermal plasma, and aims at solving the problems that a carbide coating prepared on the diamond surface through an existing method is not uniform and compact, difficult in thickness control and low in bonding strength. The method comprises the following steps: weighing a certain mass of diamond powder with a metal coating, cleaning and drying the diamond powder, and conveying the diamond powder into a thermal plasma reactor for thermal plasma treatment. According to the method, the compact carbide coating can be generated on the diamond surface by using the hot plasma as a high-temperature heat source, the graphitization tendency of the diamond surface layer is inhibited, the coating coverage rate is greater than 95%, and the thickness of the carbide coating can be controlled by controlling the thickness of the metal coating. The method is suitable for preparing the carbide coating on the diamond surface.

Description

technical field [0001] The invention relates to a method for preparing a coating on a diamond surface. Background technique [0002] Diamond has excellent comprehensive thermophysical properties, its thermal conductivity is 700-2200W / (m K) at room temperature, and its thermal expansion coefficient is 0.8×10 -6 / K, usually as a very ideal reinforcing phase, is combined with copper, aluminum and other high thermal conductivity substrates to form a new type of electronic packaging composite material. but. The wettability between diamond and metal substrates such as copper and aluminum is very poor, and a tight interface bond cannot be formed, and it is easy to debond. In addition, during the preparation of composite materials, diamond is prone to interfacial reaction with aluminum to form easily hydrolyzed Al 4 C 3 phase, thus adversely affecting the comprehensive performance of composite materials. At present, diamond surface coating treatment is the most effective method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/10C23C4/134
CPCC23C4/10C23C4/134
Inventor 杨文澍李会武高辉陈国钦修子扬周畅芶华松姜龙涛康鹏超乔菁
Owner HARBIN INST OF TECH
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