Nickel-chromium alloy sputtering target materials and hot isostatic pressing preparation method thereof

Abstract

The invention relates to a nickel-chromium alloy sputtering target materials and a hot isostatic pressing preparation method thereof. The hot isostatic pressing preparation method comprises the following steps: firstly, preparing nickel-chromium alloy powder of which Cr content is 30 percent by weight to 80 percent by weight, and filling a mould with the nickel-chromium alloy powder and sealing a mouth of the mould; then sequentially performing degassing treatment, hot isostatic pressing treatment and machining to obtain the nickel-chromium alloy sputtering target materials. According to the hot isostatic pressing preparation method disclosed by the invention, by adopting a hot isostatic pressing technology, the nickel-chromium alloy sputtering target materials with compactness being more than or equal to 99 percent, fine and small crystal grain sizes, uniform internal structure and high chromium content, can be prepared, and the phenomenon that the magnetic flux of the nickel-chromium alloy sputtering target materials is more than or equal to 99 percent also can be ensured, and therefore, the nickel-chromium alloy sputtering target materials meet the sputtering requirement in high-precision end industries such as semiconductors.

Description

technical field [0001] The invention relates to the technical field of metal materials, in particular to a nickel-chromium alloy sputtering target material and a preparation method thereof by hot isostatic pressing. Background technique [0002] Magnetron sputtering is one of the main technologies for preparing thin film materials. The ions generated by the ion source are accelerated and gathered in a vacuum to form a high-speed energy ion beam, which bombards the solid surface, and the kinetic energy exchange occurs between the ions and the solid surface atoms. , so that the atoms on the solid surface leave the solid and deposit on the surface of the substrate to form a thin film with a thickness of nanometer or micrometer. Among them, the bombarded solid is the raw material for preparing magnetron sputtering deposited films, generally called sputtering targets, which are concentrated in information storage, integrated circuits, displays, automotive rearview mirrors and oth...

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Problems solved by technology

Although the preparation method has the advantages of simple process, convenient operation, and wide range of alloy components, it is suitable for large-scale industrial production, but the nickel-chromium alloy sputtering target obtained by spraying nickel-chromium powder has a high gas content, which cannot meet high-precision sputtering targets at all. Quality requirements of end industries

[0009] However, compared with conventional low chromium content (Cr content≤20wt%) nickel-chromium alloys, high chromium content (Cr content is 30-80wt%) nickel-chromium alloys have lower plastic deformation ability due to the increased Cr content. Poor, forging and rolling are easy to crack, and it is impossible to use conventional smelting, casting, heating and plastic deformation processing to produce and prepare

However, if powder metallurgy is used for production and preparation, it is necessary to use a mixed powder of nickel powder and chromium powder. Since nickel is magnetic, once it cannot be completely alloyed during sintering, it will seriously affect the magnetic flux of the nickel-chromium alloy, making the prepared The high chromium content (Cr content is 30-80wt%) nickel-chromium alloy sputtering target does not meet the sputtering requirements

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