Self-repairing flexible strain sensor based on electrospun fibers and preparation method thereof

A strain sensor and electrospun fiber technology, applied in the field of sensors, can solve the problems of low sensitivity of flexible strain sensors, lack of additional functions, complex production process, etc., achieve good self-healing performance and compression resistance, improve repeatability, production simple craftsmanship

Inactive Publication Date: 2021-07-16
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The invention provides a self-healing flexible strain sensor based on electrospun fibers and its preparation method. The content of the invention mainly combines the electrospinning process, self-healing materials and strain sensors to upgrade and optimize the flexible sensor, and its purpose is to solve The existing flexible strain sensor has the problems of low sensitivity, small detection range, complicated production process and lack of additional functions

Method used

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  • Self-repairing flexible strain sensor based on electrospun fibers and preparation method thereof
  • Self-repairing flexible strain sensor based on electrospun fibers and preparation method thereof
  • Self-repairing flexible strain sensor based on electrospun fibers and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] 1. Place the 10 g of diamino-encapsulated polydimethylsiloxane in 100 ml of chloroform solution to form a polydimethylsiloxane solution with a mass fraction of 10%, and stir for 1 hour while keeping the temperature at 0°; Then add 0.27g isophorone diisocyanate and 0.2g 4'-methylene bis(phenyl isocyanate) dropwise and stir for 1 hour; add 10ml methanol after fully reacting to remove excess isophorone diisocyanate, and let it stand for 4 Hours until a white precipitate occurs; chloroform is evaporated above 80° to obtain a viscous solution of self-healing polydimethylsiloxane.

[0048] 2. Add the self-healing polydimethylsiloxane viscous solution dropwise onto the silicon substrate, and heat it to 80°C for two hours to cure;

[0049] 3. Dissolve 8g of polyvinyl alcohol 1788 in deionized water and configure a polyvinyl alcohol aqueous solution with a mass fraction of 10%. Stir and heat in a 70° water bath for more than 8 hours until the solution is clear and transparent; ...

Embodiment 2

[0055] 1. Place the 13 g of diamino-encapsulated polydimethylsiloxane in 150 ml of chloroform solution to form a polydimethylsiloxane solution with a mass fraction of 13%, and stir for 1.5 hours, keeping the temperature at 2°; Add 0.31g of isophorone diisocyanate and 0.22g of 4'-methylene bis(phenyl isocyanate) dropwise and stir for 1.5 hours; add 15ml of methanol after fully reacting to remove excess isophorone diisocyanate, and let stand for 4 Hours until a white precipitate occurs; chloroform is evaporated above 80° to obtain a viscous solution of self-healing polydimethylsiloxane.

[0056] 2. Add the self-healing polydimethylsiloxane viscous solution dropwise onto the silicon substrate, and heat it to 60°C for two hours before curing;

[0057] 3. Dissolve 10g of polyvinyl alcohol 1788 in deionized water to configure a polyvinyl alcohol aqueous solution with a mass fraction of 13%, stir and heat in an 80° water bath for more than 8 hours until the solution is clear and tran...

Embodiment 3

[0063] 1. Put the 15 g of diamino-encapsulated polydimethylsiloxane in 150 ml of chloroform solution to form a polydimethylsiloxane solution with a mass fraction of 15%, and stir for 2 hours while maintaining the temperature at 5°; Add 0.35g of isophorone diisocyanate and 0.25g of 4'-methylene bis(phenyl isocyanate) dropwise and stir for 2 hours; add 20ml of methanol after fully reacting to remove excess isophorone diisocyanate, and let stand for 6 Hours until a white precipitate occurs; chloroform is evaporated above 80° to obtain a viscous solution of self-healing polydimethylsiloxane.

[0064] 2. Add the self-healing polydimethylsiloxane viscous solution dropwise onto the silicon substrate, and heat it to 80°C for two hours to cure;

[0065] 3. Dissolve 15g of polyvinyl alcohol 1788 in deionized water to configure a polyvinyl alcohol aqueous solution with a mass fraction of 15%. Stir and heat in a 90° water bath for more than 8 hours until the solution is clear and transpar...

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Abstract

The invention belongs to the technical field of sensors, and relates to a self-repairing flexible strain sensor based on electrospun fibers and a preparation method thereof. The self-repairing flexible strain sensor comprises a self-repairing polydimethylsiloxane substrate, a silver nanowire network conductive sensitive layer, a wire and a self-repairing polydimethylsiloxane packaging layer. The flexible strain sensor is prepared layer by layer, the production process is simple, the silver nanowire conductive network is prepared by adopting an electrostatic spinning method, the specific surface area is large, the three-dimensional space structure is adopted, the porosity is low, the continuity is good, and the prepared sensor has the characteristics of very high tensile property and sensitivity, simple structure and bending property, is convenient to carry, and is good in the self-repairing performance and the pressure resistance, and the coating can adapt to various working environments.

Description

technical field [0001] The invention belongs to the technical field of sensors, and relates to a self-repairing flexible strain sensor based on electrospun fibers and a preparation method thereof. Background technique [0002] Flexible electronics refers to the emerging electronic technology that integrates inorganic / organic electronic components on flexible / extensible plastic or thin metal substrates, and is one of the research hotspots in academia and industry in recent years. As the core of flexible electronic devices, flexible strain sensors have the advantages of good flexibility, light weight, and recoverable deformation compared with rigid and brittle metal or inorganic semiconductor sensors, and are more suitable for flexible electronic products. Applied to scenarios such as electronic skin, wearable devices, health monitoring, biomedicine, intelligent robots, and human-computer interaction. [0003] The flexible strain sensor is a conductive polymer composite mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B7/16
CPCG01B7/16
Inventor 江诚鸣曹泽宋金会
Owner DALIAN UNIV OF TECH
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