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Graphite-silicone rubber composite material and preparation method thereof

A composite material and silicone rubber technology, applied in chemical instruments and methods, lamination devices, lamination auxiliary operations, etc., can solve the impact of thermal conductivity and performance, metal does not have softness and compressibility, low thermal conductivity, etc. question

Inactive Publication Date: 2021-07-23
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the easy oxidation of metals, its thermal conductivity and performance have been greatly affected.
And metal does not have good flexibility and compressibility, and the thermal conductivity is lower than some specific non-metallic materials, such as graphite, graphene, carbon fiber, etc.

Method used

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  • Graphite-silicone rubber composite material and preparation method thereof
  • Graphite-silicone rubber composite material and preparation method thereof

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Embodiment Construction

[0035] Below in conjunction with specific embodiment above-mentioned scheme is described further, preferred embodiment of the present invention is described in detail as follows:

[0036] In the present embodiment, a preparation method of graphite-silicone rubber composite material is provided, comprising the steps of:

[0037] a. Use graphite paper with a purity greater than 99.99% and a thickness of 0.2-0.5mm as the base material.

[0038] b. Place the substrate in alkaline degreasing water at 55°C for ultrasonic vibration for more than 30 minutes, and rinse and clean it with distilled water several times after completion;

[0039] c. Use absolute ethanol as a solvent to prepare a KH-550 solution with a mass fraction of 5-10% for surface modification of the substrate;

[0040] d. Soak the rinsed graphite paper in the KH-550 solution in step c for more than 60 minutes, then take it out, and dry it in a hot air box above 80°C for more than 60 minutes;

[0041] E. place a lay...

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Abstract

The invention relates to a graphite-silicone rubber composite material and a preparation method thereof. The preparation method comprises the following steps: selecting graphite paper as a matrix; placing the substrate in alkaline oil removal water at 55-75 DEG C for ultrasonic oscillation, and using distilled water for cleaning after ultrasonic oscillation is completed; preparing a KH-550 solution with the mass fraction concentration of 5-20% by using absolute ethyl alcohol or acetone as a solvent; putting the cleaned graphite paper into a prepared KH-550 solution to be soaked, and then taking the graphite paper out and drying; placing a layer of spread graphite paper; spraying a layer of methyl vinyl silicone rubber with uniform thickness on the upper surface of the graphite paper by using a spraying machine; placing a layer of spread graphite paper on the upper surface of the methyl vinyl silicone rubber; repeating the steps; applying continuous constant pressure, and completely curing the material after preset time; and shearing along a direction perpendicular to the spreading direction of the graphite paper to obtain the formed graphite-silicone rubber composite material. According to the method, the graphite-silicone rubber composite material with uniform thickness and high bonding strength can be obtained.

Description

technical field [0001] The invention relates to the field of graphite-based composite materials, in particular to a graphite-silicone rubber composite material and a preparation method thereof. Background technique [0002] With the trend of miniaturization of modern electronic products, it has become a research topic for many researchers to explore materials and devices that meet special needs and to study their preparation process, control conditions and related properties. In order to meet market demand, generally speaking, as the size of electronic devices becomes smaller and smaller, more and more heat is generated, and the heating phenomenon during use is also becoming more and more serious. Therefore, in the field of microelectronic packaging, a composite material with high thermal conductivity and certain flexibility and compressibility is required. [0003] Commonly used metals are favored due to their good thermal conductivity and plasticity. However, due to the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B7/12B32B37/10B32B37/12B32B38/16B32B38/08B32B38/00D21H27/30
CPCB32B9/007B32B9/04B32B7/12B32B37/10B32B37/1284B32B38/162B32B38/164B32B38/08B32B38/0004D21H27/30B32B2307/302B32B2307/718
Inventor 汪恒青朱玉斌陈捷陈晨黄泽军
Owner SHANGHAI UNIV
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