Directional heat-conducting fin and preparation method thereof, and semiconductor heat dissipation device

Abstract

The invention belongs to the field of heat-conducting fin preparation technologies and semiconductor heat dissipation, and particularly discloses a preparation method of a directional heat-conducting fin, which comprises the following steps: S1, preparing a fluid composition for the heat-conducting fin; S2, placing the fluid composition obtained in the step S1 in an orientation forming device, applying high-speed shearing force of circular motion to the fluid composition layer by layer, orienting the heat-conducting filler in the fluid composition in the shearing direction, forming oriented thin-layer compositions, collecting the thin-layer compositions in a mold layer by layer, forming a continuous multi-layer collection body, S3, carrying out thermocuring on the multi-layer convergence body to obtain an oriented composition block; and S4, slicing the oriented composition block along a direction vertical to the orientation to obtain the oriented heat-conducting sheet. The convergence body prepared by the method is good in orientation, few in defect and high in efficiency, the heat-conducting fin obtained by slicing treatment has high orientation, high heat conductivity and uniformity, and meanwhile, the heat-conducting fin can be well applied to a semiconductor heat dissipation device.

Description

technical field [0001] The invention relates to the preparation technology of a heat conduction sheet and the field of semiconductor heat dissipation, in particular to a preparation method of an oriented heat conduction sheet and a semiconductor heat dissipation device. Background technique [0002] With the development of 5G technology, the power density of chips continues to increase, which puts forward higher requirements for the heat dissipation of chips. In heat dissipation components, thermally conductive silicone gaskets are usually used to reduce the interface thermal resistance between the chip and the heat sink and improve heat dissipation efficiency. [0003] At present, conventional thermally conductive silica gel gaskets are realized by filling isotropic spherical thermally conductive fillers (aluminum oxide, aluminum nitride, zinc oxide, etc.) in the silica gel matrix. Due to the low intrinsic thermal conductivity of spherical ceramic fillers, the gasket It is...

AI Technical Summary

Problems solved by technology

Baolima Technology Co., Ltd. published the patent CN100548099C, which uses a superconducting magnetic field and applies a certain frequency of vibration to make the carbon fiber with a high filling amount oriented along the direction of the magnetic field in the high-viscosity composition. Since the densities of the added alumina and carbon fiber fillers are respectively 3.8 times and 2 times the density of the silicone resin matrix, after the vibration is applied, it will cause the filler to settle, causing the overall composition to be uneven, and ultimately affect the uniformity of thermal conductivity

In addition, the high price and operating costs of superconducting magnets increase the cost

Dexerials Co., Ltd. announced CN107004651A, CN108463882A and CN109891577A. This method is to use the extrusion method to orient the carbon fiber along the extrusion method. We have found through our experiments that in order to prepare a high thermal conductivity sheet, when the mass ratio of the filled carbon fiber to the resin When it is greater than 1.3, the viscosity of the composition is large, the fluidity becomes poor, and it is difficult to extrude and process

In addition, when molding in a hollow mold, gaps are easily formed between adjacent extruded bodies due to poor fluidity, so the extrusion method is not suitable for the orientation of high-filling compositions

Published patent CN110734562A adopts annular groove to do circular motion, and the fiber in the composition in the groove is oriented along the direction of rotation, and there are following two disadvantages in this method: 1. the size of the obtained annular cured product is limited by the size of the annular groove, so , the width of the heat conduction sheet obtained by slicing the annular cured product along the radial direction is also limited by the width of the annular groove, and it is impossible to obtain a heat conduction sheet with a larger width; 2. When the width of the annular groove becomes larger, only the The composition on both sides of the tank wall is oriented, but the inside of the composition cannot receive the frictional force between the tank wall and the composition, which will cause insufficient orientation of the composition. This shortcoming is especially reflected in high-viscosity compositions, resulting in the inability to obtain High orientation, high thermal conductivity thermal conductive sheet

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