Bisphenol A paraformaldehyde novolac epoxy resin conductive adhesive and preparation method thereof

A technology of phenolic epoxy resin and paraformaldehyde, applied in the direction of online phenolic epoxy resin adhesive, conductive adhesive, etc., can solve the problem of poor resistance stability, limited application range, poor heat resistance of epoxy resin, etc. question

Active Publication Date: 2021-07-30
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, epoxy resin has poor heat resistance, and the conductive adhesive prepared by epoxy resin has poor resistance stability when used at high temperature or for a long time, which limits its application range.

Method used

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  • Bisphenol A paraformaldehyde novolac epoxy resin conductive adhesive and preparation method thereof
  • Bisphenol A paraformaldehyde novolac epoxy resin conductive adhesive and preparation method thereof
  • Bisphenol A paraformaldehyde novolac epoxy resin conductive adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A kind of preparation method of BPA-PA phenolic epoxy resin conductive glue of the present invention specifically comprises the steps:

[0048] Step 1, when equipped with stirrer, reflux condenser, N 2 10 g of homemade BPA-PA phenolic resin, 80 g of epichlorohydrin and 0.5 g of tetrabutylammonium bromide were sequentially added to a protected 250 ml four-necked round bottom flask, stirred and heated to 80° C. for 3 h. Then the temperature was lowered to 60° C., 15 g of 10 wt % sodium hydroxide solution was added dropwise for 1.5 h, and the temperature was raised to 70° C. to react for 1 h to obtain the crude product of BPA-PA novolac epoxy resin.

[0049] Then wash with water to desalt to neutral, remove excess epichlorohydrin by distillation under reduced pressure, then add benzene to dissolve, wash with water 4 times, and finally process under reduced pressure distillation to obtain BPA-PA phenolic ring of light yellow viscous liquid oxygen resin.

[0050] Step 2: D...

Embodiment 2

[0058] A kind of preparation method of BPA-PA phenolic epoxy resin conductive glue of the present invention specifically comprises the steps:

[0059] Step 1, when equipped with stirrer, reflux condenser, N 2 10 g of homemade BPA-PA phenolic resin, 85 g of epichlorohydrin, and 0.3 g of tetrabutylammonium bromide were sequentially added to a protected 250 ml four-neck round bottom flask, stirred and heated to 80° C. for 2 h. Then the temperature was lowered to 60° C., 10 g of 10 wt % sodium hydroxide solution was added dropwise for 1.5 h, and the temperature was raised to 70° C. to react for 1 h to obtain the crude product of BPA-PA novolac epoxy resin.

[0060] Then wash with water to desalinate to neutral, remove excess epichlorohydrin by distillation under reduced pressure, then add benzene to dissolve, wash with water for 3 times, and finally process under reduced pressure distillation to obtain BPA-PA phenolic ring of light yellow viscous liquid oxygen resin.

[0061] St...

Embodiment 3

[0065] A kind of preparation method of BPA-PA phenolic epoxy resin conductive glue of the present invention specifically comprises the steps:

[0066] Step 1, when equipped with stirrer, reflux condenser, N 2 A protected 250ml four-neck round bottom flask was successively added with 10g of self-made BPA-PA phenolic resin, 90g of epichlorohydrin and 0.4g of tetrabutylammonium bromide, stirred and heated to 75°C for 3h. Then the temperature was lowered to 60° C., 15 g of 10 wt % sodium hydroxide solution was added dropwise for 1.5 h, and the temperature was raised to 70° C. to react for 1.5 h to obtain the crude product of BPA-PA novolac epoxy resin.

[0067] Then wash with water to desalt to neutral, remove excess epichlorohydrin by distillation under reduced pressure, then add benzene to dissolve, wash with water 4 times, and finally process under reduced pressure distillation to obtain BPA-PA phenolic ring of light yellow viscous liquid oxygen resin.

[0068] Step 2: Dissol...

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Abstract

The invention relates to a bisphenol A paraformaldehyde novolac epoxy resin conductive adhesive and a preparation method thereof. The method comprises the following steps: step 1, uniformly mixing 20-25 parts by mass of bisphenol A paraformaldehyde novolac epoxy resin, 2-3 parts by mass of 1, 4-butanediol diglycidyl ether, methylhexahydrophthalic anhydride and a curing accelerator to obtain a mixed system; and step 2, adding a dispersing agent and a conductive filler treated by KH560 into the mixed system, then uniform mixing is conducted, wherein the mass ratio of the dispersing agent to the conductive filler treated by KH560 to the 1,4-butanediol diglycidyl ether in the mixed system is (4-5):(50-60):(2-3), and the bisphenol A paraformaldehyde novolac epoxy resin conductive adhesive is obtained. The bisphenol A paraformaldehyde novolac epoxy resin has excellent heat resistance and curing shrinkage rate, the volume resistivity of the conductive adhesive can be reduced, and the conductive adhesive with high thermal stability and excellent conductivity can be obtained.

Description

technical field [0001] The invention belongs to the technical field of conductive adhesive preparation, in particular to a bisphenol A paraformaldehyde novolac epoxy resin conductive adhesive and a preparation method thereof. Background technique [0002] At present, the adhesive used in conductive adhesives is mainly epoxy resin. Epoxy resin has the advantages of various forms, convenient curing, strong adhesion and high chemical stability, and has become an ideal conductive adhesive matrix material. [0003] However, epoxy resin has poor heat resistance, and the conductive adhesive prepared by epoxy resin has poor resistance stability when used at high temperature or for a long time, which limits its application range. Contents of the invention [0004] Aiming at the problems existing in the prior art, the present invention provides a bisphenol A paraformaldehyde novolac epoxy resin conductive adhesive and a preparation method thereof. The bisphenol A paraformaldehyde no...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/04C08G59/42
CPCC09J163/04C09J9/02C08G59/4215C08K2003/0806C08K9/06C08K3/08
Inventor 郭睿李平安赵云飞
Owner SHAANXI UNIV OF SCI & TECH
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