Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which is applied to printed circuit parts, conductive pattern formation, etc., can solve the problems that hard printed circuit boards cannot be used, and achieve the effects of environmentally friendly manufacturing methods, high production efficiency, and excellent electrical performance

Pending Publication Date: 2021-07-30
JIANGMEN DENGZHONGTAI ENG PLASTICS CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the communication industry, the current industry mainly adopts the production of liquid crystal polyester film first, which can only be used for the production of flexible circuit boards (FPC, Flexible Printed Circuit), and cannot be used for the production of hard printed circuit boards (PCB, Printed Circuit Board).

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0063] Embodiment 1: Preparation of three-dimensional circuit board

[0064] (1) Making modified conductive liquid crystal polymer resin

[0065] The conductive liquid crystal polymer resin of the present embodiment comprises the following components by mass percentage: 30% liquid crystal resin (LCPA3000 resin produced by Jiangmen Dezhongtai Engineering Plastic Technology Co., Ltd., melting point 300° C., dielectric constant (DK) 2.8, dielectric constant Loss (DF) 0.0016), 69% mixed conductive filler, 1% silane coupling agent; wherein mixed conductive filler is 5% conductive carbon black, 30% carbon nanotube and 34% carbon fiber powder.

[0066] The preparation process specifically includes: adding the above-mentioned mixed conductive filler into the high mixer, increasing the temperature of the mixed conductive filler by 100°C, then adding a silane coupling agent to pretreat the mixed conductive filler, the reaction time is 1h, and taking it out for use; A3000 LCP resin is f...

Embodiment 2

[0070] Embodiment 2: prepare circuit board

[0071] Compared with Example 1, in the modified conductive liquid crystal polymer resin, the mass percentages of liquid crystal resin and conductive filler are respectively 70% and 29%, wherein the conductive filler is carbon nanotube. Other technical features are the same as those in Embodiment 1, and will not be repeated here.

[0072] The plated metal conductive layer of the circuit board obtained in Example 2 was subjected to an electroplating adhesion test, and its peel strength with the surface of the conductive resin pattern layer of the electroplated coating layer was 9N.

Embodiment 3

[0073] Embodiment 3: prepare circuit board

[0074] Compared with Example 1, in the modified conductive liquid crystal polymer resin, the mass percentages of liquid crystal resin and conductive filler are respectively 50% and 49%, wherein the conductive filler is conductive carbon black. Other technical features are the same as those in Embodiment 1, and will not be repeated here.

[0075] The plated metal conductive layer of the circuit board obtained in Example 3 was subjected to an electroplating adhesion test, and the peel strength between the plated metal conductive layer and the surface of the conductive resin pattern layer of the electroplated coating layer was 7N.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
thicknessaaaaaaaaaa
electrical resistivityaaaaaaaaaa
Login to View More

Abstract

The invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises a non-conductive resin substrate, a conductive resin pattern layer attached to the non-conductive resin substrate and a metal conductive layer attached to the conductive resin pattern layer, wherein the conductive resin pattern layer is formed by conductive resin directly through a forming process according to a circuit design pattern. The manufacturing method is not affected by the substrate structure, can be used for manufacturing the three-dimensional circuit board, and compared with an existing three-dimensional circuit board manufacturing method, the production efficiency can be effectively improved, the manufacturing cost can be reduced, mass production can be achieved, and the manufactured circuit board is excellent in electrical performance such as signal receiving and transmission efficiency, dielectric constant and dielectric loss.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board with excellent electrical performance and suitable for three-dimensional products and a manufacturing method thereof. Background technique [0002] With the development trend of miniaturization and multi-functionalization of electronic equipment, not only the high-frequency and high-speed performance requirements of copper-clad circuit boards are getting higher and higher, but also copper-clad circuit boards are required to achieve compact installation effects. Therefore, circuit boards are required to be non-flat The circuit board is a three-dimensional circuit board. In the industry, three-dimensional molded interconnect devices (three dimensional molded interconnect devices, 3D-MID) refer to the use of molded parts with mechanical functions as substrates, by directly arranging electronic circuits on the surface of parts, and connecting discrete...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/10H05K1/02
CPCH05K3/10H05K1/02
Inventor 梁永华郑红专金良文
Owner JIANGMEN DENGZHONGTAI ENG PLASTICS CO LTD