Data measurement method for polycrystalline silicon layer in TOPCon passivation contact structure
A technology of polysilicon layer and contact structure, applied in the direction of measuring devices, measuring electrical variables, and electrochemical variables of materials, etc., can solve the problems of inaccurate measurement results, high price of testing equipment, and difficulty in obtaining relevant data, and achieve low cost and overcome The influence of the polysilicon layer thickness and the position measurement of the tunnel oxide layer, and the effect of accurate results
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Embodiment 1
[0042] a. The TOPCon passivation contact structure is grown on a crystalline silicon substrate with flat surface morphology:
[0043] Take 20 pieces of N-type crystal silicon wafers with a resistivity of 0.3-2.1Ω·cm and a thickness of 150-200μm (for example, 150-160μm) and divide them into two groups at random, marked as used products and test products, with 10 crystals in each group Silicon wafers; arrange the used and measured products adjacent to each other and insert them into the same wet flower basket; then immerse the wet flower basket in sodium hydroxide (NaOH) solution for damage removal and polishing, or use nitric acid / hydrofluoric acid (HNO 3 / HF) mixed solution for double-sided etching to complete the preparation of N-type crystalline silicon substrate 1 . Then, the test object is placed on the same area on the horizontal support plate, and a thick aluminum oxide dielectric layer 21 is deposited using a plate-type atomic layer deposition device (ALD). The thicknes...
Embodiment 2
[0049] a.TOPCon passivated contact structure grown on a crystalline silicon substrate with uneven surface topography:
[0050] Take 20 pieces of N-type crystal silicon wafers with a resistivity of 0.3-2.1Ω·cm and a thickness of 150-200μm (for example, 150-160μm) and divide them into two groups at random, marked as used products and test products, with 10 crystals in each group Silicon wafer; Arrange the used product and the measured product next to each other and insert them into the same wet flower basket; then immerse the wet flower basket in sodium hydroxide (NaOH) solution to remove the damaged layer, and then immerse the wet flower basket in potassium hydroxide / texturing Double-sided texturing is carried out in the mixed solution of additives to complete the preparation of N-type crystalline silicon substrate 1 . Then, the test article was placed on the same area on the horizontal support plate, transported into the plate plasma chemical vapor deposition equipment (PECVD)...
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