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Data measurement method for polycrystalline silicon layer in TOPCon passivation contact structure

A technology of polysilicon layer and contact structure, applied in the direction of measuring devices, measuring electrical variables, and electrochemical variables of materials, etc., can solve the problems of inaccurate measurement results, high price of testing equipment, and difficulty in obtaining relevant data, and achieve low cost and overcome The influence of the polysilicon layer thickness and the position measurement of the tunnel oxide layer, and the effect of accurate results

Active Publication Date: 2021-08-10
TAIZHOU ZHONGLAI PHOTOELECTRIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in the process of actually measuring these data, for example, when it is necessary to measure the square resistance of the doped polysilicon layer, since the carriers can pass through the tunnel oxide layer without hindrance, the measurement results obtained are often the difference between the polysilicon layer and the crystal. The square resistance of the parallel connection of the silicon substrate, the measurement result is not accurate; Optical film thickness on the polished plane); for another example, when it is necessary to know the specific position of the tunnel oxide layer in the TOPCon passivation contact structure, although secondary ion mass spectrometry (SIMS) can perform micro-region composition imaging and depth analysis to The curve of doping concentration changing with depth is obtained, but SIMS still requires polysilicon film to be prepared on a polished plane, so it is difficult to obtain relevant data on the suede surface, and SIMS testing equipment is expensive and expensive to test, which cannot meet the needs of solar cell manufacturers. Very frequent testing requirements

Method used

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  • Data measurement method for polycrystalline silicon layer in TOPCon passivation contact structure
  • Data measurement method for polycrystalline silicon layer in TOPCon passivation contact structure
  • Data measurement method for polycrystalline silicon layer in TOPCon passivation contact structure

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] a. The TOPCon passivation contact structure is grown on a crystalline silicon substrate with flat surface morphology:

[0043] Take 20 pieces of N-type crystal silicon wafers with a resistivity of 0.3-2.1Ω·cm and a thickness of 150-200μm (for example, 150-160μm) and divide them into two groups at random, marked as used products and test products, with 10 crystals in each group Silicon wafers; arrange the used and measured products adjacent to each other and insert them into the same wet flower basket; then immerse the wet flower basket in sodium hydroxide (NaOH) solution for damage removal and polishing, or use nitric acid / hydrofluoric acid (HNO 3 / HF) mixed solution for double-sided etching to complete the preparation of N-type crystalline silicon substrate 1 . Then, the test object is placed on the same area on the horizontal support plate, and a thick aluminum oxide dielectric layer 21 is deposited using a plate-type atomic layer deposition device (ALD). The thicknes...

Embodiment 2

[0049] a.TOPCon passivated contact structure grown on a crystalline silicon substrate with uneven surface topography:

[0050] Take 20 pieces of N-type crystal silicon wafers with a resistivity of 0.3-2.1Ω·cm and a thickness of 150-200μm (for example, 150-160μm) and divide them into two groups at random, marked as used products and test products, with 10 crystals in each group Silicon wafer; Arrange the used product and the measured product next to each other and insert them into the same wet flower basket; then immerse the wet flower basket in sodium hydroxide (NaOH) solution to remove the damaged layer, and then immerse the wet flower basket in potassium hydroxide / texturing Double-sided texturing is carried out in the mixed solution of additives to complete the preparation of N-type crystalline silicon substrate 1 . Then, the test article was placed on the same area on the horizontal support plate, transported into the plate plasma chemical vapor deposition equipment (PECVD)...

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Abstract

A data measurement method for a polycrystalline silicon layer in a TOPCon passivation contact structure comprises the following steps that S1, a use product and a measurement product with the TOPCon passivation contact structure are prepared under the same process condition, a dielectric layer is additionally arranged on the measurement product, the use product comprises a tunneling oxide layer and a polycrystalline silicon layer which are sequentially located on a crystalline silicon substrate from inside to outside, the measurement product comprises a dielectric layer, a tunneling oxide layer and a polycrystalline silicon layer which are sequentially located on a crystalline silicon substrate from inside to outside, and the tunneling oxide layer and the polycrystalline silicon layer in the using product are consistent with the tunneling oxide layer and the polycrystalline silicon layer in the measuring product respectively; and S2, data measurement is performed on the determination product and / or the use product, and / or comparative analysis is performed on a data determination result to obtain a final determination conclusion. Compared with the prior art, according to the technical scheme provided by the invention, the method has the advantages that the method is not influenced by the surface morphology of the crystalline silicon substrate, and the measurement result is accurate, convenient and fast.

Description

technical field [0001] The present application relates to the field of crystalline silicon solar cells, in particular to a method for measuring data of a polysilicon layer in a TOPCon passivation contact structure. Background technique [0002] In the field of crystalline silicon solar cells, the surface passivation structure has always been the top priority of design and optimization in the industry. In 2019, the Institute for Solar Energy Systems Hamelin (ISFH), Germany, based on the theory of carrier selectivity, made a detailed analysis of the theoretical efficiency limits of solar cells with different structures, and pointed out that the theoretical efficiency limits of solar cells using "passivated contact structures" As high as 28.7%, in 2020, the Fraunhofer Institute for Solar Energy Systems (Fraunhofer ISE) in Germany reported a TOPCon passivated contact structure solar cell with a conversion efficiency of 26.0%. [0003] Because the TOPCon passivation contact stru...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66G01N27/27G01R27/02
CPCH01L22/12H01L22/14G01R27/02G01N27/27
Inventor 杜哲仁黄策包杰陈嘉季根华陈程林建伟
Owner TAIZHOU ZHONGLAI PHOTOELECTRIC TECH CO LTD