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Polycrystalline silicon thin film containing silicon-oxygen nanocrystalline layer and preparation method and application of polycrystalline silicon thin film

A polycrystalline silicon thin film and nanocrystalline layer technology, applied in the field of solar cells, can solve the problems of passivation quality degradation, large recombination current, etc., and achieve the effects of slowing diffusion, reducing recombination current, and improving passivation performance

Active Publication Date: 2021-08-27
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] (2) During the sintering process, the aluminum paste will corrode downward, and the thickness of the polysilicon layer is usually tens to hundreds of nanometers. The aluminum paste is very easy to pass through the polysilicon and directly contact the crystalline silicon. As mentioned above, the metal and the crystalline silicon directly contact each other. The contact will form a high density of defect states, resulting in a very large recombination current, which seriously degrades the passivation quality

Method used

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  • Polycrystalline silicon thin film containing silicon-oxygen nanocrystalline layer and preparation method and application of polycrystalline silicon thin film
  • Polycrystalline silicon thin film containing silicon-oxygen nanocrystalline layer and preparation method and application of polycrystalline silicon thin film
  • Polycrystalline silicon thin film containing silicon-oxygen nanocrystalline layer and preparation method and application of polycrystalline silicon thin film

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Embodiment 1

[0051] Such as figure 1 As shown, this embodiment provides a polysilicon thin film containing a silicon-oxygen nanocrystalline layer, including a tunneling layer on the back of the substrate 1, a doped polysilicon layer 3 on the back of the tunneling layer, and a doped polysilicon layer 3 on the back of the tunneling layer. The sintered electrode 5 on the back side also includes a first silicon-oxygen nanocrystal layer 4 between the doped polysilicon layer 3 and the sintered electrode 5, the first silicon-oxygen nanocrystal layer 4 is used to suppress the metal of the sintered electrode 5 diffusion.

[0052] Further, the doped oxygen content of the first silicon-oxygen nanocrystal layer 4 ranges from 5at% to 50at%; and / or, the first silicon-oxygen nanocrystal layer 4 has an electrically active impurity doping concentration in the range of 1E18-1E21cm -3 and / or, the thickness of the first silicon-oxygen nanocrystal layer 4 is 2-100 nm; and / or, the crystallization rate of the s...

Embodiment 2

[0068] Such as figure 2 As shown, this embodiment provides a preparation method for preparing the structure of the polysilicon thin film containing the silicon oxygen nanocrystalline layer in Example 1. On the back of the substrate 1, the tunneling layer, the doped polysilicon precursor, and the first silicon Oxygen nanocrystal precursor, metal paste;

[0069] Finally, high-temperature annealing is performed, and the doped polysilicon precursor and the first silicon-oxygen nanocrystal precursor are correspondingly formed into a doped polysilicon layer 3 and a first silicon-oxygen nanocrystal layer 4 to obtain a sample a.

[0070] Further, the specific preparation method of this embodiment is as follows: p-type silicon wafer substrate 1, cleaning, double-sided alkali polishing, using PECVD in-situ oxidation method to prepare ultra-thin silicon oxide layer 2a on the front and back sides of the silicon wafer, using PECVD method on the A 40nm boron-doped amorphous silicon film i...

Embodiment 3

[0075] Such as Figure 4 As shown, this embodiment is different from Embodiment 1 in that this embodiment also includes a first polysilicon layer 6, and the first polysilicon layer 6 is located between the first silicon-oxygen nanocrystal layer 4 and the between the sintered electrodes 5 .

[0076] Further, the first polysilicon layer 6 is deposited on the surface of the first silicon-oxygen nanocrystalline layer 4 , and the sintered electrode 5 is screen-printed on the surface of the first polysilicon layer 6 .

[0077] Furthermore, the first polycrystalline silicon layer 6 , the first silicon-oxygen nanocrystalline layer 4 and the doped polycrystalline silicon layer 3 are deposited together, and then annealed together to form their respective structures.

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Abstract

The invention discloses a polycrystalline silicon thin film containing a silicon-oxygen nanocrystalline layer, which comprises a tunneling layer positioned on the back surface of a substrate, a doped polycrystalline silicon layer positioned on the back surface of the tunneling layer, a sintered electrode positioned on the back surface of the doped polycrystalline silicon layer, and a first silicon-oxygen nanocrystalline layer positioned between the doped polycrystalline silicon layer and the sintered electrode. According to the polycrystalline silicon thin film containing the silicon-oxygen nanocrystalline layer, the doped silicon-oxygen nanocrystalline layer is added to serve as a barrier layer for diffusion of electrode metal, the polycrystalline silicon layer is prevented from being burnt through in the sintering process of metal slurry to make direct contact with crystalline silicon, and diffusion of the electrode metal to a substrate is blocked; the invention further provides a preparation method and application of the polycrystalline silicon thin film containing the silicon-oxygen nanocrystalline layer, an annealing crystallization process in preparation of a tunneling layer and a doped polycrystalline silicon layer and a high-temperature sintering process in preparation of a sintered electrode are combined into a whole, and the cost is reduced; and the polycrystalline silicon thin film containing the silicon-oxygen nanocrystalline layer is applied to a solar cell, and the cell efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of solar cells, more specifically, to a polysilicon film containing a silicon-oxygen nanocrystal layer, a preparation method and application thereof. Background technique [0002] With mature technology and low cost, crystalline silicon solar cells still occupy more than 95% of the photovoltaic market. A finished solar cell must have metal electrodes to collect carriers. However, the direct contact between metal and crystalline silicon will cause a higher density of defect states, and the recombination current is very large, which limits the efficiency of the cell. PERC cells reduce the contact area between metal and crystalline silicon to reduce the existence of defect states through the dielectric film + opening method; the passivation contact technology in recent years completely avoids the problem of contact between metal electrodes and crystalline silicon. For example, TOPCon technology, through ultra-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0368H01L31/068H01L31/18
CPCH01L31/03682H01L31/068H01L31/1804H01L31/1864H01L31/1868Y02P70/50Y02E10/547Y02E10/546
Inventor 曾俞衡刘尊珂叶继春廖明墩闫宝杰刘伟
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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