High-resilience ultraviolet light and moisture dual-curing hot melt adhesive and preparation method thereof
A dual-curing and ultraviolet light technology, applied in the field of polyurethane hot melt adhesives, can solve the problems that the screen cannot be reworked, the edge banding tape cannot be reworked, and the curing time is long, etc., achieving reworkability, less cleaning, and simple preparation methods.
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[0034] A method for preparing a high-resilience ultraviolet light and moisture dual-curing hot-melt adhesive, comprising the following steps:
[0035]In terms of parts by weight, 20-60 parts of rubber containing terminal hydroxyl groups, 5-30 parts of polyester polyol and 20-50 parts of polyether polyol are stirred and dehydrated at a speed of 100-500 rpm under a vacuum condition of 100-130 °C 1-3h, then lower the temperature to 70-90°C, add 1-10 parts of trifunctional small molecule polyols, stir evenly, add one-third to five-sixths of the total polyisocyanate, after reacting for 1-6h, add 1 -30 parts of UV active monomer without hydroxyl or amino groups, 1-5 parts of photoinitiator, 0.2-2 parts of adhesion promoter, 0.2-3 parts of defoamer and 0.1-1 part of catalyst and remaining polyisocyanate, continue After the reaction is complete, vacuum defoaming, and then discharge.
Embodiment 1
[0037] A method for preparing a high-resilience ultraviolet light and moisture dual-curing hot-melt adhesive, comprising the following steps:
[0038] (1) In parts by weight, weigh 30 parts of 2000 molecular weight butylene glycol adipate polyol, 50 parts of 2000 molecular weight polyoxypropylene diol, 50 parts of 4000 molecular weight terminal hydroxybutyl rubber, add 500ml four-port in a flask, and vacuum dehydrated at 130°C for 2 hours, with a stirring speed of 300rpm and an absolute pressure of 50-80Pa;
[0039] (2) Cool down to 80°C, blow in nitrogen to release the vacuum, add 3 parts of trimethylolpropane, stir evenly, add 30 parts of 4,4'-diphenylmethane diisocyanate (MDI), and stir under nitrogen protection Speed 300rpm, reaction 2h;
[0040] (3) Under nitrogen protection and stirring conditions, continue to add 20 parts of TPGDA, 2 parts of 651 photoinitiator, 0.5 part of adhesion promoter KH560, 0.5 part of JSC-1120 defoamer, and catalyst dibutyltin dilaurate into...
Embodiment 2
[0042] A method for preparing a high-resilience ultraviolet light and moisture dual-curing hot-melt adhesive, comprising the following steps:
[0043] (1) In parts by weight, weigh 30 parts of 3000 molecular weight butylene glycol sebacate polyol, 20 parts of 3000 molecular weight polyoxypropylene diol, 20 parts of 2000 molecular weight terminal hydroxy butyl rubber, add 500ml four-port in a flask, and vacuum dehydrated at 130°C for 2 hours, with a stirring speed of 300rpm and an absolute pressure of 50-80Pa;
[0044] (2) Cool down to 70°C, blow in nitrogen to release the vacuum, add 2.5 parts of glycerol, stir evenly, add 26 parts of 4,4'-diphenylmethane diisocyanate (MDI), under the condition of nitrogen protection, the stirring speed is 300rpm , reaction 2h;
[0045] (3) Under nitrogen protection and stirring conditions, continue to add 20 parts of TPGDA, 2 parts of 651 photoinitiator, 0.5 part of adhesion promoter A1120, 0.2 part of JSC-1120 defoamer, catalyst dibutyltin ...
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