High-resilience ultraviolet light and moisture dual-curing hot melt adhesive and preparation method thereof

A dual-curing and ultraviolet light technology, applied in the field of polyurethane hot melt adhesives, can solve the problems that the screen cannot be reworked, the edge banding tape cannot be reworked, and the curing time is long, etc., achieving reworkability, less cleaning, and simple preparation methods.

Pending Publication Date: 2021-09-03
SUZHOU ENBRIGHTECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. Poor cushioning when bonding large screens, no impact resistance, oppressive light leakage;
[0004] 2. The bonded screen cannot be reworked or repaired; and when the yield rate is low, there will be

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Preparation method of high rebound ultraviolet light and moisture dual curing heat melt glue, including the steps of:

[0035]According to the weight of the weight, 20-60 parts of the terminally hydroxyl group, 5-30 parts of polyester polyol, and 20-50 parts of polyether polyol at 100-500 rpm at a vacuum conditions of 100-500 rpm, deposited at speeds of 100-500 rpm. 1-3h, then cooled to 70-90 ° C, 1-10 parts of the three-dimensional small molecular polyol, stir evenly after mixing all polyisocyanates, one-third to sixth, reaction 1-6 hours, add 1 -30 servant-free or amino-active monomers, 1-5 servants, 0.2-2 parts adhesion promoters, 0.2-3 parts of antifoaming agents and 0.1-1 catalysts, and residual polyisocyanate, continue After the reaction is complete, vacuum is deck, then it is discharged.

Example Embodiment

[0036] Example 1

[0037] Preparation method of high rebound ultraviolet light and moisture dual curing heat melt glue, including the steps of:

[0038] (1) According to the weight of the weight, 30 parts of 2000 molecular weight dikanol ester polyol, 50 parts of 2000 molecular weight polyoxylated propylene diol, 50 parts of 4000 molecular weight hydroxybutyla rubber, add 500 ml of four In the flask, it was vacuum dehydrated for 2 h at 130 ° C, stirring the rotational speed of 300 rpm, absolute pressure at 50-80 Pa;

[0039] (2) Cooling to 80 ° C, 3 parts of nitrogen is released, 3 parts of trihymethylpropane, stirred and uniform, 30 parts of 4,4'-diphenyl methane diisocyanate (MDI), nitrogen protection conditions, stir Rotate 300 rpm, reaction 2H;

[0040] (3) Nitrogen protection and stirring conditions, TPGDA 20 parts, 651 photoinitiators, 2 parts of 651 photoinitiators, and 0.5 parts of JSC-1120 antifoam, catalyst, Dikuttinikinikinikinikikikikikikikikikinikikinikin, JSC-1120 de...

Example Embodiment

[0041] Example 2

[0042] Preparation method of high rebound ultraviolet light and moisture dual curing heat melt glue, including the steps of:

[0043] (1) According to the weight of the weight, 30 parts of 3000 molecular weight sebacylene glycol ester polyols, 20 parts of 3000 molecular weight polyoxypropylene diol, 20 parts of 2000 molecular weight hydroxypropranium rubber, add 500 ml of four In the flask, it was vacuum dehydrated for 2 h at 130 ° C, stirring the rotational speed of 300 rpm, absolute pressure at 50-80 Pa;

[0044] (2) Cooling to 70 ° C, passing into nitrogen to relieve vacuum, adding propanol, adding 4,4'-diphenyl methane diisocyanate (MDI) 26 parts, nitrogen protection conditions, stirring at a mixture of 300 rpm under nitrogen protection conditions. , Reaction 2h;

[0045] (3) Nitrogen protection and stirring conditions, TPGDA20 servings were added to the four flasks, 2 parts of 651 photoinitiators, attachment accelerator A1120 0.5 parts, JSC-1120 defoaming a...

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PUM

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Abstract

The invention discloses a high-resilience ultraviolet light and moisture dual-curing hot melt adhesive and a preparation method thereof. The hot melt adhesive comprises hydroxyl-terminated rubber, polyester polyol, polyether polyol, a hydroxyl-free or amino-free UV active monomer, polyisocyanate, trifunctional micromolecular polyol, a photoinitiator, a defoaming agent, an adhesion promoter and a catalyst. The elasticity and flexibility of a hot melt adhesive product are improved by adding the hydroxyl-terminated rubber; the hydroxyl-free or amino-free UV active monomer does not participate in polymerization reaction in the early stage, so that the final product becomes viscoelastic after being irradiated by UV light, and the cleaning of excessive glue is reduced; the polyisocyanate is added in batches, so that the molecular weight of the polymer can be increased, the initial bonding strength is quickly improved within the same curing time, the positioning time is shortened, and the production efficiency is improved; the initial adhesion after dispensing is improved, the buffer resistance of large screen frame adhesion is improved, the reworkability of screen frame adhesion is achieved, and the hot melt adhesive can replace traditional screen sealing adhesive tapes, and realizes narrow frame dispensing.

Description

technical field [0001] The invention belongs to the technical field of polyurethane hot-melt adhesives, and in particular relates to a high-resilience ultraviolet light and moisture dual-curing hot-melt adhesive and a preparation method thereof. Background technique [0002] With the development of the consumer electronics industry, the automation and narrow-frame screen bonding technology that replaces traditional edge-banding tapes has gradually become a development trend, which puts forward new requirements for the development of corresponding adhesives. At present, the bonding of large screens on the market basically adopts the dual curing principle of ultraviolet light and moisture to make PUR glue. Shorten curing time and enhance adhesion. However, the glue on the market still has the following problems to be solved urgently: [0003] 1. Poor cushioning when bonding large screens, no impact resistance, oppressive light leakage; [0004] 2. The bonded screen cannot b...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J4/06
CPCC09J4/06
Inventor 李恒王泽勇
Owner SUZHOU ENBRIGHTECH
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