Single-component low-temperature curing imitation electroplating ink and preparation method thereof

An imitation electroplating, single-component technology, applied in the direction of ink, household utensils, applications, etc., can solve the problems of harsh storage conditions, difficulty in storage, short shelf life of ink, etc., achieve high-temperature calendering and tensile properties, reduce production costs, and store The long-term effect

Pending Publication Date: 2021-09-07
江苏德恒新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing mirror silver paste inks prepared by using ultra-thin electroplating aluminum paste will have a large amount of diffuse reflection after the electroplating surface is formed, which will deteriorate the metal mirror effect, so it can only be used in large quantities for surface processing of small surfaces. Cracking will occur during the later hot pressing forming process, so it can only be used for flat materials
Moreover, the shelf life of the ink is short, and the storage conditions are harsh and difficult to preserve

Method used

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  • Single-component low-temperature curing imitation electroplating ink and preparation method thereof
  • Single-component low-temperature curing imitation electroplating ink and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] A low-temperature curing imitation electroplating ink, including the following components: 15g of multipolymer acrylic resin, 1.5g of high molecular weight phenoxy resin, 30g of spherical silver powder, 38.15ml of propylene glycol phenyl ether, 0.15ml of organic silicon leveling agent, organic 3ml of silicon defoamer, 1.5ml of epoxy coupling agent, 0.5ml of silicone wetting agent, 0.2ml of polyether modified anti-settling agent, 5ml of carboxylate dispersant, and 5ml of low-temperature deblocking isocyanate curing agent.

[0066] The preparation method of the low-temperature curing imitation electroplating ink of the present embodiment is:

[0067] S1. Mix multiple polymerized acrylic resin, high molecular weight phenoxy resin, and propylene glycol phenyl ether, and use a high-speed disperser to disperse and stir at a speed of 1500rpm to completely dissolve the multiple polymerized acrylic resin and phenoxy resin in propylene glycol phenyl ether , the mixture A was obta...

Embodiment 2

[0072] A low-temperature curing imitation electroplating ink, comprising the following components: styrene acrylic resin 15g, high molecular weight phenoxy resin 1.5g, granular silver powder 30g, diethylene glycol butyl ether 38.15ml, silicone leveling agent 0.15g ml, acrylic defoamer 3ml, aminosilane coupling agent 1.5ml, fluorocarbon modified wetting agent 0.5ml, fumed silica anti-sedimentation agent 0.2ml, oleic acid 5ml, low temperature deblocking type isocyanate curing agent 5ml.

[0073] The preparation method of the low-temperature curing imitation electroplating ink of the present embodiment is:

[0074] S1. Mix styrene acrylic resin, high molecular weight phenoxy resin, and diethylene glycol butyl ether, and use a high-speed disperser to disperse and stir at a speed of 1600rpm to completely dissolve polystyrene acrylic resin and phenoxy resin In diethylene glycol butyl ether, mixed solution A was obtained;

[0075] S2. Mix silicone leveling agent, acrylic defoamer, a...

Embodiment 3

[0079] A low-temperature curing imitation electroplating ink, comprising the following components: 15g of butyl methacrylate copolymer, 1.5g of high molecular weight phenoxy resin, 30g of spherical silver powder, 38.15ml of glycerin, 0.15ml of silicone leveling agent, Cellulose acetate defoamer 3ml, epoxy silane coupling agent 1.5ml, silicone modified wetting agent 0.5ml, polyether modified anti-settling agent 0.2ml, carboxylate 5ml, low temperature deblocking type isocyanate curing agent 5ml .

[0080] The preparation method of the low-temperature curing imitation electroplating ink of the present embodiment is:

[0081] S1. Mix butyl methacrylate copolymer, high molecular weight phenoxy resin, and glycerin, and use a high-speed disperser to disperse and stir at a speed of 2000rpm to completely dissolve the butyl methacrylate copolymer and phenoxy resin In glycerin, mixed solution A was obtained;

[0082] S2. Silicone leveling agent, cellulose acetate defoamer, epoxy silane...

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Abstract

The invention relates to the technical field of electroplating ink, and discloses single-component low-temperature curing imitation electroplating ink, wherein a formula of the ink is prepared from the following components: 5-15 parts by weight of acrylic resin, 0.5-1.5 parts by weight of phenoxy resin, 10-40 parts by weight of silver powder of which the particle size D100 is less than or equal to 200 nm, 50-80 parts by volume of a solvent, 0.1-0.3 part by volume of a leveling agent, 1-3 parts by volume of a defoaming agent, 0.25-1.5 parts by volume of a coupling agent, 0.1-0.5 part by volume of a wetting agent, 0.05-0.2 part by volume of an anti-settling agent, 1-5 parts by volume of a dispersant, and 1-5 parts by volume of a curing agent. The slurry ink disclosed by the invention has high temperature resistance and high calendering tensile property, and can be subjected to high-temperature hot-pressing secondary forming after printing curing, and the surface of the slurry ink does not crack and fall off after high-temperature hot-pressing secondary forming. Meanwhile, the prepared ink is good in stability in a normal-temperature state and long in storage period.

Description

technical field [0001] The invention relates to the technical field of electroplating ink, in particular to a single-component low-temperature curing imitation electroplating ink and a preparation method thereof. Background technique [0002] At present, the manufacturing process of the colorful effect of the mobile phone cover plate is relatively complicated. During the manufacturing process, because the surface is brittle after electroplating and cannot be hot-pressed, it is necessary to cut a large piece of PC or PMMA cover plate and perform hot-press forming. Afterwards, mirror effect electroplating can be carried out. With the increasing demand for colorful and high-gloss metal mirror effects for 5G mobile phones, back covers made of PC / PMMA materials that can be formed at low cost by thermocompression and have better heat dissipation than glass are being widely used. [0003] Existing mirror-surface silver paste inks prepared by using ultra-thin electroplating aluminu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/107C09D11/03C09D11/104
CPCC09D11/107C09D11/03C09D11/104
Inventor 廖超军鲁英杰姜云峰
Owner 江苏德恒新材料科技有限公司
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