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Production process of semiconductor-grade quartz ring

A production process and semiconductor technology, used in glass production, stone processing equipment, fine working devices, etc., can solve the problems of rough surface state, low dimensional accuracy, and high materials

Active Publication Date: 2021-09-10
江苏富乐德石英科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above-mentioned technical problems, the object of the present invention is to provide a production process of semiconductor-grade quartz ring: through cutting, water cutting, plane grinding, MC processing, degreasing and cleaning, chemical Washing, packaging, and finally getting a semiconductor-grade quartz ring, which solves the problem that the existing quartz products have low dimensional accuracy, rough surface state, high purity of materials required by semiconductor-grade quartz products, and it is difficult to meet the needs of the semiconductor industry.

Method used

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  • Production process of semiconductor-grade quartz ring
  • Production process of semiconductor-grade quartz ring
  • Production process of semiconductor-grade quartz ring

Examples

Experimental program
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Effect test

Embodiment 1

[0044] This embodiment is a production process of a semiconductor-grade quartz ring, comprising the following steps:

[0045] Step 1: Place one end of the quartz ingot on the conveying roller 310 of the crystal ingot cutting equipment, clamp it by the limit seat 303, put the other end of the quartz ingot into the inner cavity of the clamping mechanism 107, and clamp it by the clamping mechanism 107 , drive the quartz ingot to move to the top of the knife drop groove 308 by the moving motor 702 and the conveying motor 311, and cut the quartz ingot by the diamond cutting knife 304 to form a quartz wafer;

[0046] Step 2: Place the quartz wafer on the platform of the water jetting machine for inner and outer diameter processing to form a rough quartz ring with an inner and outer diameter allowance of 5mm for subsequent MC processing;

[0047] Step 3: Carry out plane grinding on the crude quartz ring to ensure that the flatness and parallelism requirements are within 0.02mm. After...

Embodiment 2

[0055] see Figure 1-8 As shown, the present embodiment is an ingot cutting equipment, including a mounting frame 101, a conveyor 102, a support frame 103, a cutting motor 104, a pressing cylinder 105, a slideway 106, and a clamping mechanism 107. One end of the mounting frame 101 is provided with a Conveyor 102, a support frame 103 is installed on the top of the end of the mounting frame 101 close to the conveyor 102, slideways 106 are installed on both sides of the top of the mounting frame 101 away from the end of the support frame 103, and a clamping mechanism is slidably connected to the slideway 106 107;

[0056] The clamping mechanism 107 includes a sliding base 701, a moving motor 702, a mounting rod 703, a mounting plate 704, a clamping plate 705, a stretching cylinder 706, a fixed plate 707, a fixed rod 708, a connecting plate 709, a turning plate 710, and a connecting arm 711 , clamping cylinder 712, transmission rod 713, gear column 714, toothed plate 715, the two...

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Abstract

The invention discloses a production process of a semiconductor-grade quartz ring, and relates to the field of semiconductor high-purity quartz machined rings. A quartz material used in the production process is a high-purity quartz base material, and the semiconductor-grade quartz ring is finally obtained through ingot cutting, water jet cutting, plane grinding, MC machining, degreasing cleaning, chemical cleaning and packaging. The production process has the advantages of being simple in process route, high in size precision of quartz machined products, high in cleanliness of surface cleaning, capable of achieving batch manufacturing, and capable of meeting the requirements of current semiconductor industries. According to the production process, ingot cutting equipment is used for performing ingot cutting on a quartz ingot. The ingot cutting equipment clamps the quartz ingot through a position-limiting base and a clamping mechanism, thereby achieving high clamping stability, avoiding the situation that cutting is not smooth enough due to shaking of the quartz ingot in the cutting process, ensuring ingot cutting accuracy, and further reducing the material loss of the quartz ingot. The automation degree is high, and the use is convenient.

Description

technical field [0001] The invention relates to the field of semiconductor high-purity quartz processing rings, in particular to a production process for semiconductor-grade quartz rings. Background technique [0002] Quartz glass is a kind of glass, other glasses have various components, and the main component of quartz glass is SiO 2 , the purity of quartz glass is very high, heat resistance, light transmission, electrical insulation and chemical stability are very good, so the semiconductor industry just needs such excellent performance, oxygen and silicon combine in nature to form silicon oxide, Including silica sand and colorless crystal, which are mined and smelted into quartz, and then manufactured into final quartz products. Due to the high hardness and fragility of quartz materials, quartz processing has always been a difficult point in the industry; [0003] At present, the dimensional accuracy of quartz products processed by the industry is low, and the surface s...

Claims

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Application Information

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IPC IPC(8): B28D5/04B28D7/00B28D7/04B24B1/00B08B11/00
CPCB28D5/042B28D5/0082B28D5/0058B24B1/00B08B11/00Y02P40/57
Inventor 杨军房玉林邹琴
Owner 江苏富乐德石英科技有限公司
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