Bi-component addition type heat-conducting silica gel for heat dissipation of LED lighting chip

A technology of heat-conducting silica gel and addition type, which is applied in lighting and heating equipment, cooling/heating devices of lighting devices, lighting devices, etc. Problems such as high viscosity of heat-conducting silicone products, to achieve the effect of good production operation, good curing effect and good mechanical properties

Inactive Publication Date: 2021-09-28
SHANDONG IND TECH RES INST OF ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] (1) The existing heat-conducting silica gel products, due to the low viscosity of the base silicone oil without reinforcement, have very low tensile strength and poor heat resistance
[0008] (2) If the selected basic silicone oil has a high viscosity, then the viscosity of the thermally conductive silicone product is too high and the fluidity is poor, which is not conducive to the coating between the LED chip and the heat sink, affecting the application of the product
[0009] (3) In terms of application, some products have a long curing time, which is prone to solid-liquid separation before complete curing; some products have a short curing time, which is not conducive to the complete contact between thermal silica gel and interface materials

Method used

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  • Bi-component addition type heat-conducting silica gel for heat dissipation of LED lighting chip
  • Bi-component addition type heat-conducting silica gel for heat dissipation of LED lighting chip
  • Bi-component addition type heat-conducting silica gel for heat dissipation of LED lighting chip

Examples

Experimental program
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Effect test

Embodiment 1

[0061] This thermally conductive silicone rubber is a two-component addition type liquid silicone rubber, in which

[0062] A component: vinyl silicone oil, platinum catalyst, alumina, copper powder, reinforcing and toughening additives

[0063] B component: hydrogen silicone oil, inhibitor, alumina, copper powder, graphene

[0064] Among them, the vinyl silicone oil is double-ended vinyl silicone oil produced by Jinan Guobang Chemical Co., Ltd., with a viscosity of 400mPa·s and a vinyl content of 0.86%; the hydrogen-containing silicone oil is selected from RH-H3 produced by Ningbo Runhe Material Co., Ltd. The hydrogen content is 0.28%, and the viscosity is 100mPa s; the platinum catalyst is the platinum catalyst produced by Huayuanhong Chemical Co., Ltd., and the platinum concentration is 5000ppm; the inhibitor is ethynyl cyclohexanol (PC00685) produced by Guangdong Wengjiang Chemical Reagent Co., Ltd. , and use dimethyl silicone oil to prepare it into a solution with a mass...

Embodiment 2

[0073] Compared with Example 1, the difference is that the white carbon black is replaced by an equal amount of phenyl vinyl silicone oil, the vinyl content is 1.78%, and the viscosity is 1670 mPa·s.

Embodiment 3

[0075] Compared with Example 1, the difference is that the white carbon black is replaced by vinyl MQ silicone resin, the vinyl content is 1.38%, and the viscosity is 8662mPa·s.

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Abstract

The invention discloses a bi-component addition type heat-conducting silica gel for heat dissipation of an LED lighting chip, the heat-conducting silica gel is composed of a component A and a component B. The component A comprises 50-60 parts of basic silicone oil, 3-20 parts of a catalyst, 80-110 parts of a heat-conducting filler A and 0.1-3 parts of a reinforcing and toughening additive; the component B is prepared from 8-13 parts of hydrogen-containing silicone oil, 1-15 parts of inhibitor, 30-60 parts of heat-conducting filler B and 0.1-3 parts of graphene; the base silicone oil is double-end vinyl silicone oil; the catalyst is a platinum catalyst; the inhibitor is a dimethyl silicone oil solution of ethynyl cyclohexanol; the reinforcing and toughening additive is one or a combination of more of white carbon black, phenyl vinyl silicone oil and vinyl MQ silicon resin; and both the heat-conducting filler A and the heat-conducting filler B consist of aluminum oxide and copper powder. The bi-component addition type heat-conducting silica gel for heat dissipation of the LED lighting chip has the advantages of excellent heat conductivity coefficient, proper viscosity, good mechanical property and good curing effect.

Description

technical field [0001] The invention relates to the technical field of LED lighting, in particular to a two-component addition type heat-conducting silica gel for heat dissipation of high-power LED lighting chips. Background technique [0002] In recent years, light-emitting diodes (LEDs), as a new generation of lighting sources, are playing an increasingly active role in the field of green environmental protection. With the continuous improvement of LED light source manufacturing process and the development and application of new materials, breakthroughs have been made in ultra-high brightness LEDs of various colors. In terms of chromaticity, full coverage of visible light bands has been achieved, especially ultra-high brightness white light. The popularization and application of LED makes the application field of LED more extensive. With the continuous improvement of the integration level of the chip, the energy consumption density continues to increase, and more and more...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04F21V29/85F21Y115/10
CPCC09J183/04C09J11/04F21V29/85C08K2003/2227C08K2003/085C08L2205/025F21Y2115/10C08K2201/003C08L2203/206C08L83/04C08K13/06C08K9/06C08K7/18C08K3/22C08K3/08C08K3/042C08K9/08C08K7/26
Inventor 陈威曹衍龙
Owner SHANDONG IND TECH RES INST OF ZHEJIANG UNIV
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