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Composition for packaging optoelectronic device and packaging structure formed by composition

A technology for optoelectronic devices and compositions, which is applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of reducing the service life of OLED devices, reducing the luminous efficiency of OLED devices, and enhancing them, so as to achieve improved heat resistance, good sprayability, etc. Ink printing performance, the effect of preventing optical corrosion

Pending Publication Date: 2021-10-26
XIAN SMART MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current system does not meet the above requirements
In addition, the absorption of ultraviolet light by most packaging materials still needs to be improved, because in practical applications, ultraviolet rays from nature pass through the screen body through the protective layer to reach the OLED layer, which enhances the OLED organic light-emitting material's ability to be irradiated by ultraviolet rays. possibility, reducing the luminous efficiency of the OLED device and reducing the service life of the OLED device; when the ultraviolet absorption capacity of the packaging material is significantly improved, it can absorb the external incident ultraviolet light, thereby reducing the engraving of the electronic material by the external ultraviolet light. Corrosion effect, so as to further protect the electronic devices

Method used

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  • Composition for packaging optoelectronic device and packaging structure formed by composition
  • Composition for packaging optoelectronic device and packaging structure formed by composition
  • Composition for packaging optoelectronic device and packaging structure formed by composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] Embodiment 1: Preparation of Encapsulation Composition 1

[0079] The components used are described below:

[0080] (A) Multi-component acrylate monomer: 0.5% of 3-[3-tert-butyl-5-(5-chlorobenzothiazol-2-yl)-4-hydroxyphenyl]-2-propyl methacrylate;

[0081] (B) Multi-component acrylate monomer: 40% of pentaerythritol triacrylate;

[0082] (C) Multi-component acrylate monomer: 29.5% of 3-propyl tri(trimethoxy silicon) methacrylate;

[0083] (D) monofunctional acrylate monomer: 25% of tert-butyl acrylate;

[0084] (E) Photoinitiator: (2,4,6-trimethylbenzoyl)diphenylphosphine oxide 5%.

[0085] In a brown glass bottle, add 0.5% (A), 40% (B), 29.5% (C), 25% (D) and 5% (E) of the total mass, shake and mix at room temperature for 2 hours, and then filter to obtain Composition 1 for packaging; then the composition is coated on the surface of the ITO substrate by inkjet printing to form a sample with an area size of 10cm × 10cm × 10 μm (length × width × thickness), and then ...

Embodiment 2

[0095] Embodiment 2: Preparation of encapsulation composition 2

[0096] (A) Multi-component acrylate monomer: 2.5% of 3-[3-tert-butyl-5-(5-chlorobenzothiazol-2-yl)-4-hydroxyphenyl]-2-propyl methacrylate;

[0097] (B) Multi-component acrylate monomer: 40% of pentaerythritol triacrylate;

[0098] (C) Multi-component acrylate monomer: 48.5% of 3-propyl tri(trimethoxy silicon) methacrylate;

[0099] (D) Monofunctional acrylate monomer: 6% of tert-butyl acrylate;

[0100] (E) Photoinitiator: (2,4,6-trimethylbenzoyl)diphenylphosphine oxide 3%.

[0101] In a brown glass bottle, add the above raw materials, shake and mix at room temperature for 2 hours, and then filter to obtain composition 2 for packaging; then apply the composition on the surface of an ITO substrate by inkjet printing to form an area of ​​10cm×10cm×10μm (length×width×thickness) sample, then pass through 100mW / cm 2 The UV curing equipment cures the packaging composition by ultraviolet curing for 10 to 30 seconds...

Embodiment 3

[0102] Embodiment 3: Preparation of encapsulation composition 3

[0103](A) Polyacrylate monomer: 3-[3-tert-butyl-5-(5-chlorobenzothiazol-2-yl)-4-hydroxyphenyl]-2-propyl methacrylate 9%;

[0104] (B) Multi-component acrylate monomer: 20% of pentaerythritol triacrylate;

[0105] (C) Multi-component acrylate monomer: 20% of 3-methacrylic acid propyl tri(trimethoxy silicon);

[0106] (D) monofunctional acrylate monomer: 50% of tert-butyl acrylate;

[0107] (E) Photoinitiator: (2,4,6-trimethylbenzoyl)diphenylphosphine oxide 1%.

[0108] In a brown glass bottle, add the above raw materials, shake and mix at room temperature for 2 hours, and then filter to obtain the composition 3 for packaging; then apply the composition on the surface of the ITO substrate by inkjet printing to form an area of ​​10cm×10cm×10μm (length×width×thickness) sample, then pass through 100mW / cm 2 UV curing equipment UV curing for 10 to 30 seconds to cure the packaging composition, and finally form a pac...

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Abstract

The invention discloses a composition for packaging a photoelectronic device. The composition comprises the following components in percentage by mass: 49-91% of a multi-component acrylate monomer; 6%-50% of a monofunctional group acrylate monomer; and 0.5%-5% of a photoinitiator. A packaging adhesive formed by using the silicon-containing acrylate component has the advantages that on one hand, the stress dispersion effect can be achieved, the internal stress is reduced, and the mechanical property of the organic packaging composition is improved; and on the other hand, the thermal performance and hydrophobic performance of the organic packaging composition can be effectively improved, and the service life of a device can be effectively prolonged when the organic packaging composition is used for film packaging of an optoelectronic device. In addition, due to the introduced aryl or heteroaryl and derivative units thereof, conjugation in molecules is enhanced, and the absorption effect of the packaging layer on ultraviolet rays is improved.

Description

technical field [0001] The invention belongs to the technical field of organic polymer film encapsulation, and in particular relates to a composition for encapsulation of optoelectronic devices and an encapsulation structure formed therefrom. Background technique [0002] With the development of science and technology, the upgrading of electronic products is also changing with each passing day, and many display devices have also changed from bulky and rigid to light and thin, foldable and bendable. Part of the performance and life of the display device is determined by its own characteristics, and the other part is guaranteed and extended by the external packaging protection. In traditional packaging technology, the substrates used are rigid materials (such as steel plates, acrylics, glass ceramics and other hard materials), which lack flexibility and cannot fully meet market demands. [0003] In the thin film encapsulation technology (TFE) in the OLED display field, the in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02H01L51/52
CPCC09J4/00H10K50/8426
Inventor 吴朝新雷霆李欢乐周桂江
Owner XIAN SMART MATERIALS CO LTD
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