Gold removing and tin coating method and lead tin coating protective agent for lead of connector between gold-plated plates, and preparation method of lead tin coating protective agent

An inter-board connector and protective agent technology, applied in hot-dip plating process, metal material coating process, coating and other directions, can solve the problems of expensive equipment and materials, complicated removal process, etc., and achieve a reasonable and acceptable concentration of components. Control, preparation method is simple and easy, and the effect of good physical properties

Inactive Publication Date: 2021-11-09
XIAN MICROELECTRONICS TECH INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the formula of the protective agent is mainly multi-component organic glue. In the process of removing the protective agent in the later stage, organic solvents such as ethyl

Method used

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  • Gold removing and tin coating method and lead tin coating protective agent for lead of connector between gold-plated plates, and preparation method of lead tin coating protective agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A preparation method of a tin-coating protectant for connectors between gold-plated boards. Firstly, deionized water and acrylic acid emulsion are added into a reactor, and mixed evenly at a rotating speed of 400 rpm. Continue to stir, and add ammonium polyphosphate, pentaerythritol, melamine and titanium dioxide to the above slurry, and continue to stir for 10 minutes to make the slurry mix evenly. The mixed slurry is transferred to a grinder for grinding, and the slurry is ground to a fineness of 20 μm. Transfer the ground slurry to a mixer, stir at a rotational speed of 1500 rpm, add cellulose ether and high temperature resistant antioxidant, and continue stirring for 10 minutes to mix the slurry evenly to obtain a tin enamel protectant.

[0039] The mass concentration of each component in the tin enamel protectant in this embodiment is: 10% of acrylic emulsion, 25% of ammonium polyphosphate, 5% of pentaerythritol, 5% of melamine, 10% of titanium dioxide, 1% of cellu...

Embodiment 2

[0046] A preparation method of a tin-coating protectant for connectors between gold-plated boards. Firstly, deionized water and acrylic acid emulsion are added into a reactor, and mixed evenly at a rotating speed of 430 rpm. Continue to stir, and add ammonium polyphosphate, pentaerythritol, melamine and titanium dioxide to the above slurry, and continue to stir for 9 minutes to make the slurry mix evenly. The mixed slurry is transferred to a grinder for grinding, and the slurry is ground to a fineness of 35 μm. Transfer the ground slurry to a mixer, stir at a speed of 1600 rpm, add cellulose ether and high temperature resistant antioxidant, and continue stirring for 9 minutes to mix the slurry evenly to obtain a tin enamel protectant.

[0047] The mass concentration of each component in the tin enamel protectant in this embodiment is: 11.7% of acrylic emulsion, 25.3% of ammonium polyphosphate, 5.7% of pentaerythritol, 5.7% of melamine, 11.5% of titanium dioxide, 1.2% of cellul...

Embodiment 3

[0054] A preparation method of a tin-coating protectant for connectors between gold-plated boards. First, deionized water and acrylic acid emulsion are added into a reactor, and mixed evenly at a rotating speed of 460 rpm. Continue stirring, and add ammonium polyphosphate, pentaerythritol, melamine and titanium dioxide to the above slurry, and continue stirring for 8 minutes to make the slurry mix evenly. The mixed slurry is transferred to a grinder for grinding, and the slurry is ground to a fineness of 40 μm. Transfer the grinded slurry to a mixer, stir at a speed of 1700 rpm, add cellulose ether and high temperature resistant antioxidant, and continue stirring for 8 minutes to mix the slurry evenly to obtain a tin enamel protectant.

[0055] The mass concentration of each component in the tin enamel protectant in this embodiment is: 13% of acrylic emulsion, 26.4% of ammonium polyphosphate, 8% of pentaerythritol, 6.2% of melamine, 12.4% of titanium dioxide, 1.9% of cellulose...

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Abstract

A preparation method of a tin coating protective agent for a connector lead between gold-plated plates comprises the following steps: uniformly stirring deionized water and acrylic emulsion, adding ammonium polyphosphate, pentaerythritol, melamine and titanium dioxide, uniformly stirring, grinding the obtained slurry to required fineness, adding cellulose ether and a high-temperature-resistant antioxidant, and stirring to obtain the tin coating protective agent. The tin coating protective agent comprises, by mass,10-15% of the acrylic emulsion, 25-35% of the ammonium polyphosphate, 5-15% of the pentaerythritol, 5-8% of the melamine, 10-15% of the titanium dioxide, 1-3% of the cellulose ether and 3-5% of a high-temperature-resistant antioxidant. A gold removing and tin -coating method for the connector comprises the following steps: immersing a lead part needing to be protected in a protective agent, dipping in the protective agent, airing in the air, standing and drying, cooling to room temperature, and carrying out gold-removing and tin-coating. The connector lead is immersed in deionized water, the protective agent is removed, and airing is performed at room temperature to achieve the effects of removing gold and tinning. The protective agent is reasonable and controllable in component concentration, simple and feasible in preparation method, moderate in viscosity, easy to cure, resistant to high temperature, free of corrosion to a substrate and capable of being stripped after being washed with water.

Description

technical field [0001] The invention belongs to the application field of a gold-plated inter-board connector, and relates to a method for removing gold and tinning from a lead wire of a gold-plated inter-board connector, a lead wire tin-coating protectant and a preparation method. Background technique [0002] Gold plating has strong oxidation resistance, so gold is generally used as the surface coating of inter-board connector leads, and tin solder is used to weld gold-plated inter-board connector leads to form solder joints. Since gold-plated leads are not degolded, such solder joints are prone to occur The phenomenon of "golden brittleness" affects product reliability. In order to avoid gold embrittlement, gold-plated board-to-board connector lead soldering parts must be removed from gold. For board-to-board connectors, since the soldering part is located at the root of the lead wire, only the root part needs to be partially degolded, and the rest of the mating part need...

Claims

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Application Information

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IPC IPC(8): C09D133/00C09D7/61C09D7/63C09D7/65C23F1/02C23C2/08
CPCC09D133/00C09D7/61C09D7/63C09D7/65C09D5/18C23F1/02C23C2/08C08K2003/323C08K2003/2241C08L2201/08C08L1/26C08K3/32C08K5/053C08K5/34922C08K3/22
Inventor 赵艳陈元章屈云鹏
Owner XIAN MICROELECTRONICS TECH INST
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