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Powder metallurgy preparation method of high-thermal-conductivity Cu-Invar bimetal-based composite material

A composite material and powder metallurgy technology, which is applied in the field of powder metallurgy preparation of Cu-Invar bimetal matrix composite materials, can solve the problems that have not been published, and achieve the effect of zero performance, excellent comprehensive performance and uniform distribution

Active Publication Date: 2021-11-19
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The material design and preparation method of the above-mentioned Cu-Invar composite material are all original inventions of the patent of the present invention, and have not been published at home and abroad.

Method used

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  • Powder metallurgy preparation method of high-thermal-conductivity Cu-Invar bimetal-based composite material
  • Powder metallurgy preparation method of high-thermal-conductivity Cu-Invar bimetal-based composite material
  • Powder metallurgy preparation method of high-thermal-conductivity Cu-Invar bimetal-based composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Example 1: 50wt% Cu-Invar composite material sintered by SPS at 700°C using Invar alloy powder with a particle size of -400 mesh (<37 μm)

[0026] (1) Material selection: select the average particle diameter D50 of 25-100 μm, spherical gas-atomized Invar alloy powder and the average particle diameter D50 of gas-atomized Cu powder of 20-40 μm as raw materials for preparing the composite material;

[0027](2) Sieving: Weigh 100g of Invar alloy powder and place it in a vibrating sieving apparatus. The sieve is 400 mesh, the vibration frequency is 3000 times / min, the sieving time is 5min, and the particle size is -400 mesh (<37μm). Invar powder;

[0028] (3) Mixing: Weigh 10g of Invar powder with a particle size of -400 mesh (<37μm) and 10g of Cu powder into a nylon tank, and add zinc stearate with a mass fraction of 0.5wt% as a lubricant. After sealing, put it on the tank mill for mixing with two-axis rollers, the roller speed is 500r / min, and the mixing time is 10h;

[...

Embodiment 2

[0031] Example 2: Using Invar alloy powder with a particle size of -400 mesh (<37 μm), 50wt% Cu-Invar composite material sintered by SPS at 800 ° C. The preparation process of this example is the same as that of Example 1, except that the step (5 ) The sintering temperature is 800°C, and other processes and parameters remain unchanged.

Embodiment 3

[0032] Example 3: Using Invar alloy powder with a particle size of +200 mesh (>74 μm), 50wt% Cu-Invar composite material sintered by SPS at 700 ° C. The preparation process of this example is the same as that of Example 1, except that the step (2 ) obtained in the Invar alloy particle size is +200 mesh (>74μm), other processes and parameters remain unchanged.

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Abstract

The invention discloses a powder metallurgy preparation method of a high-thermal-conductivity Cu-Invar bimetal-based composite material. The powder metallurgy preparation method comprises the following preparation steps of (1) material selection, (2) screening, (3) material mixing, (4) reduction and (5) sintering. Compared with other preparation methods of Cu-Invar composite materials, the powder metallurgy preparation method has the advantages that Invar alloy powder with the large particle size is selected, a discharge plasma sintering process is adopted, the sintering temperature is reduced, the high-temperature retention time is shortened, Invar particles in the prepared Cu-Invar bimetal-based composite material are evenly distributed, the performance is free of anisotropy, interface diffusion is basically and completely inhibited, the comprehensive performance is excellent, and the Cu-Invar bimetal-based composite material can be used as a high-performance electronic packaging heat sink material.

Description

technical field [0001] The invention relates to a preparation method of a metal matrix composite material, in particular to a powder metallurgy preparation method of a Cu-Invar bimetallic matrix composite material used for electronic packaging, and belongs to the field of new materials and its preparation technology. Background technique [0002] In recent years, in order to break the Western technology blockade and technology monopoly, my country's microelectronics, power electronics and integrated circuit industries have developed rapidly, and the significant improvement in the integration and power density of electronic circuits has placed higher requirements on the heat dissipation capabilities of electronic devices. The electronic device dissipates heat outward through the substrate and the heat sink material. Therefore, the heat dissipation capability of the heat sink material dominates the heat dissipation efficiency of the electronic device. In addition, the thermal ...

Claims

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Application Information

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IPC IPC(8): C22C1/04B22F1/00B22F3/14C22C9/00H01L23/373
CPCC22C1/0425B22F3/14C22C9/00H01L23/3736Y02P10/25
Inventor 汤文明聂强强
Owner HEFEI UNIV OF TECH
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