Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Maleimide, curable resin composition, and cured product

A maleimide and carbon number technology, applied in organic chemistry and other fields, can solve unreached problems and achieve excellent heat resistance and dielectric properties, excellent fluidity and handling properties

Pending Publication Date: 2021-11-30
DIC CORP
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, although the heat resistance and dielectric properties of the cured product of the resin composition described in the aforementioned Patent Document 1 have been improved to some extent, the heat resistance has not yet reached the level required in recent years.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Maleimide, curable resin composition, and cured product
  • Maleimide, curable resin composition, and cured product
  • Maleimide, curable resin composition, and cured product

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0093]

[0094] The curable resin composition of the present invention preferably contains the aforementioned maleimide. The above-mentioned maleimide has excellent solvent solubility, fluidity and handling properties during heating and melting, and can contribute to embrittlement resistance, heat resistance and low dielectric constant / low dielectric loss tangent. Therefore, by containing the above-mentioned The cured product obtained from the curable resin composition of maleimide is excellent in brittleness resistance, flexibility, flexibility, heat resistance, and dielectric properties, and thus is a preferred embodiment.

[0095] The curable resin composition of the present invention may contain various compounding agents such as a curing agent, if necessary, a curing accelerator, a silane coupling agent, a release agent, a pigment, an emulsifier, a non-halogen flame retardant, and an inorganic filler. . In addition, epoxy resins, phenolic resins, active ester resins, c...

Embodiment

[0101] Next, the present invention will be described concretely with reference to Examples and Comparative Examples. Hereinafter, "parts" and "%" are based on mass unless otherwise specified. In addition, softening point, amine equivalent, GPC, and FD-MS spectrum were measured and evaluated under the following conditions.

[0102] 1) softening point

[0103] Measuring method: According to JIS K7234 (ring and ball method), the softening point (°C) of the intermediate amine compound obtained in the synthesis example shown below was measured.

[0104] 2) Amine equivalent

[0105] The amine equivalent of the intermediate amine compound was measured by the following measuring method.

[0106] Accurately weigh about 2.5g of intermediate amine compound, 7.5g of pyridine, 2.5g of acetic anhydride, and 7.5g of triphenylphosphine as samples in a 500mL Erlenmeyer flask with a stopper, install a condenser and set it at 120°C Heated to reflux in an oil bath for 150 minutes.

[0107] Af...

Synthetic example 1

[0145] [Synthesis Example 1] Synthesis of Maleimide Compound A-1

[0146] (1) Synthesis of intermediate amine compounds

[0147] Put 48.5g (0.4mol) of 2,6-dimethylaniline, α,α'-dihydroxy-1 , 272.0g (1.4mol) of 3-diisopropylbenzene, 280g of xylene and 70g of activated clay were heated to 120°C while stirring. Furthermore, distilled water was removed with a Dean-Stark tube, the temperature was raised to 210° C., and the reaction was performed for 3 hours. Then, after cooling to 140 degreeC and throwing in 145.4 g (1.2 mol) of 2, 6- dimethyl aniline, it heated up to 220 degreeC, and performed reaction for 3 hours. After the reaction, the air was cooled to 100° C., diluted with 300 g of toluene, the activated clay was removed by filtration, and low molecular weight substances such as solvent and unreacted substances were distilled off under reduced pressure to obtain the following general formula (A-1 ) intermediate amine compound 364.1g. The amine equivalent is 298, and the s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
molecular weight distributionaaaaaaaaaa
softening pointaaaaaaaaaa
softening pointaaaaaaaaaa
Login to View More

Abstract

Provided are: a curable resin composition of which a cured product has excellent heat-resistance and dielectric properties; a cured product thereof; a prepreg having both excellent heat resistance and dielectric properties; a circuit board; a build-up film; a semiconductor sealing material; and a semiconductor apparatus. The present invention is characterized by having an indane skeleton represented by general formula (1). (In formula (1), Ra's are each independently an alkyl group, an alkyloxy group or an alkylthio group, which has 1-10 carbon atoms, an aryl group, an aryloxy group or an arylthio group, which has 6-10 carbon atoms, or a cycloalkyl group a halogen atom, a nitro group, a hydroxyl group or mercapto group, which has 3-10 carbon atoms, and q represents an integer value of 0-4. When q is 2-4, Ra's may be the same or different from each other in the same ring. Rb's are each independently an alkyl group, an alkyloxy group or an alkylthio group, which has 1-10 carbon atoms, an aryl group, an aryloxy group or an arylthio group, which has 6-10 carbon atoms, or a cycloalkyl group, a halogen atom, a hydroxyl group, or a mercapto group, which has 3-10 carbon atoms, and r represents an integer value of 0-3. When r is 2-3, Rb's may be the same or different from each other in the same ring. n is the average number of repeating units, and represents a numerical value of 0.95-10.0.).

Description

technical field [0001] The present invention relates to a maleimide having an indane skeleton, a curable resin composition containing the maleimide, and a cured product obtained from the curable resin composition. Background technique [0002] As a material for circuit boards for electronic equipment, it is widely used: epoxy resins, BT (bismaleimide-triazine) resins and other thermosetting resins are impregnated into glass cloth and heated and dried. A prepreg, a laminate obtained by heat-curing the prepreg, and a multilayer board obtained by combining the laminate and the prepreg and heat-cured. Among them, semiconductor package substrates are gradually becoming thinner, and warping of the package substrate during mounting becomes a problem. In order to suppress this, materials exhibiting high heat resistance are required. [0003] In addition, in recent years, high-speed and high-frequency signals have been increased, and it is desired to provide a thermosetting resin th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C07D207/452C08F22/40C08L35/00
CPCC07D207/452C08G2261/42C08G2261/1412C08G2261/1642C08G2261/342C08G61/02C08F22/40C08L35/00
Inventor 下野智弘冈本竜也
Owner DIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com