Polyimide adhesive remover composition for wafer and preparation method of polyimide adhesive remover composition

Abstract

The invention discloses a polyimide adhesive remover composition for wafers and a preparation method of the polyimide adhesive remover composition, and relates to the technical field of polyimide adhesive layer adhesive removers. According to the polyimide adhesive remover composition for the wafer, provided by the invention, the alkali, the organic solvent, the alcohol amine penetrant, the carbon-nitrogen heterocyclic corrosion inhibitor and the volatilization inhibitor are compounded to jointly achieve a synergistic adhesive removal effect. The alkali preferably adopts strong alkali with pKa greater than 12 to improve the protonation ability of the adhesive remover, the alcohol amine penetrant can enhance the permeability of the adhesive remover, and the carbon-nitrogen heterocyclic corrosion inhibitor can generate a coupling effect with metal to inhibit the corrosion of the alkali to the metal; besides, a layer of isolating membrane is formed on the surface layer of the adhesive remover by using the volatilization inhibitor, so that the volatilization loss of effective components in the adhesive remover is reduced. The composition has the advantages of high reaction activity and mild treatment conditions, and can be used for removing polyimide adhesive layers in the technical fields of semiconductors, photovoltaics, display panels and the like.

Description

technical field [0001] The invention relates to the technical field of polyimide adhesive layer remover, in particular to a polyimide adhesive remover composition for wafers and a preparation method thereof. Background technique [0002] With the rapid development of 5G communication technology, its terminal applications are becoming more and more abundant, requiring fast signal transmission speed, no delay and low loss, and the technical performance requirements for the semiconductor materials used will become higher and higher. At present, the application of many electronic chemicals in domestic semiconductor materials is restricted by foreign countries, and the demand for semiconductor process improvement is becoming more and more stringent for the corresponding electronic chemicals. However, there are many problems in domestic electronic chemicals such as unstable performance, harsh reaction conditions, and the use of harmful ingredients. It is urgent to optimize the for...

AI Technical Summary

Problems solved by technology

Although this method can remove the polyimide adhesive layer and has a wide range of effects, its operating temperature exceeds 160°C, and even some degumming processes require operating temperatures exceeding 200°C

The new type of polyimide adhesive layer is often polymerized at low temperature, the adhesive layer is thicker, and the simple use of alcohol amine-solvent cannot effectively remove the adhesive layer, and the addition of alkali is essential

[0006] The current general method uses an organic alkali solution with a high water content to remove the adhesive layer. However, the moisture greatly weakens the peeling force of the adhesive remover on the adhesive layer, and it is also extremely corrosive to the metal under the film.

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