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Selective performance field auxiliary machining system

A processing system and field-assisted technology, applied in metal processing, etc., can solve problems such as low processing efficiency, tool chipping, and low cutting speed

Active Publication Date: 2021-12-24
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when processing hard and brittle materials, there is a risk of tool chipping due to microscopic impact, and limited by the amplitude and frequency, the cutting speed is low and the processing efficiency is low

Method used

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  • Selective performance field auxiliary machining system
  • Selective performance field auxiliary machining system
  • Selective performance field auxiliary machining system

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Embodiment Construction

[0033] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0034] The invention provides a selective energy field auxiliary processing system, which can be used for selective processing of workpieces of any material and shape. The invention uses the system for selective processing of composite material workpieces as an example to describe in detail.

[0035] Please check first figure 1 , figure 1 It is a block diagram of a selective energy field assisted processing system provided by an embodiment of the present invention, such as figure 1 As shown, the selective energy field assisted processing system provided in this embodiment includes a micron-scale ...

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Abstract

The invention discloses a selective performance field auxiliary machining system. The system comprises a micron-sized high-speed identification module, a laser in-situ auxiliary module, an ultrasonic vibration auxiliary module, an energy field loading high-speed control module and a diamond cutter, wherein the micron-sized high-speed identification module is used for rapidly identifying the material matrix type of a to-be-machined workpiece in the machining process, machining the identified information into a corresponding control signal, and sending the control signal to the energy field loading high-speed control module comprising an electro-optical modulator and an ultrasonic power supply controller, so that selective machining of the to-be-machined workpiece is realized, that is, laser in-situ auxiliary machining of brittle particles is adopted, and ultrasonic vibration auxiliary machining of a soft metal matrix is adopted. According to the invention, the ultra-precision cutting of the brittle particles and the soft metal matrix can be simultaneously completed in one machining process, the high-precision low-damage ultra-precision cutting of the brittle particles can be realized, and the wear of the cutter can be effectively inhibited when the soft metal matrix is machined.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision processing, and more specifically relates to a selective energy field auxiliary processing system. Background technique [0002] Composite materials such as silicon-aluminum alloy and aluminum-based silicon carbide are composed of soft metal matrix and brittle particles (silicon, silicon carbide, etc.), with low density, high specific stiffness, high fatigue resistance, high wear resistance and high corrosion resistance And other excellent physical, chemical and mechanical properties, widely used in aerospace, electronic packaging and biotechnology. Machining surface integrity has a significant impact on composite part performance. With the progress and development of science and technology in our country, higher requirements are put forward for the processing accuracy and processing quality of composite matrix materials. [0003] Diamond cutting technology has the advantages of high pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P25/00
CPCB23P25/003B23P25/006B23K26/70H10N30/00
Inventor 许剑锋郑正鼎张建国陈肖骆易葳王茂肖峻峰
Owner HUAZHONG UNIV OF SCI & TECH
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