Novel epoxy resin and application thereof

Abstract

The invention discloses novel epoxy resin which comprises the following raw materials: a carboxyl-containing imide curing agent, diethylenetriamine and epoxy resin. The novel epoxy resin has the beneficial effects that the number of rigid structures in the molecular structure of the epoxy resin is increased by introducing the carboxyl-containing imide curing agent into the epoxy resin, and higher energy is needed to break the structures, so that the decomposition temperature of the novel epoxy resin is increased, and the thermal stability of the novel epoxy resin is improved. According to the novel epoxy resin disclosed by the invention, by introducing the carboxyl-containing imide curing agent, epoxy resin with different properties and a composite conductive material thereof can be prepared, and the technical bottleneck that the epoxy resin and the composite conductive material thereof are difficult to use is broken through. The urgent requirements on the high-performance thermosetting epoxy resin and the composite conductive material thereof in the fields of aerospace, 5G electronic products and national defense and military are met.

Description

technical field [0001] The invention belongs to the technical field of manufacturing high-performance thermosetting materials, and in particular relates to a novel epoxy resin and its application. Background technique [0002] The rapid development of electronic equipment has led to a large increase in electromagnetic pollution, which has adverse effects not only on equipment performance, but also on the surrounding environment. Electromagnetic shielding materials have been widely developed to avoid harmful electromagnetic radiation. Especially in the fields of aircraft, spacecraft, drones, next-generation portable devices and wearable electronic devices, the application of ultra-thin, lightweight, high-strength and flexible EMI shielding materials with high shielding effectiveness is very urgent. In addition to the above requirements, with the rapid increase in the integration level and operating frequency of electronic devices, more and more heat is generated, resulting i...

AI Technical Summary

Problems solved by technology

In addition to the above requirements, with the rapid increase in the integration level and operating frequency of electronic devices, more and more heat is generated, resulting in a significant decline in device performance, and electromagnetic interference shielding materials also require high thermal conductivity

[0003] High conductivity is the main factor determining the shielding effectiveness of materials, which is beneficial to the reflection and absorption of electromagnetic waves. Although traditional metal shields have excellent electromagnetic interference shielding performance, they are heavy and poor in corrosion resistance. In order to meet the growing lightweight, Ultrathin thickness and flexibility requirements, polymer matrix composites with conductive nanomaterials such as conductive carbon black, carbon nanotubes, carbon fibers, MXenes, and metal nanowires as fillers have been widely explored for electromagnetic shielding applications

However, in the prior art, the electromagnetic shielding coatings used on aircraft have poor temperature resistance, which will limit the service life of the engine or the environment in which tasks are performed, and most of the current military electromagnetic shielding coatings are silver-based coatings, which will bring huge the cost of

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