Low dielectric constant bonding sheet containing hollow ceramic powder and preparation method thereof

A low dielectric constant, bonding sheet technology, used in film/sheet adhesives, adhesives, devices for coating liquids on surfaces, etc., can solve problems affecting the consistency and stability of high-frequency circuit signal transmission, Warp and weft weaving density difference and other issues, to achieve the effect of benefiting stability and consistency, stabilizing bond strength, and avoiding glass fiber effect

Active Publication Date: 2021-12-31
CHINA ELECTRONICS TECH GRP NO 46 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the PTFE substrate of the bonding sheet is obtained by impregnating PTFE emulsion with glass fiber cloth, and the glass fiber cloth reinforcement material has a difference in warp and weft weaving density, and the resulting bonding sheet will also seriously affect the consistency and stability of high-frequency circuit signal transmission sex

Method used

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  • Low dielectric constant bonding sheet containing hollow ceramic powder and preparation method thereof
  • Low dielectric constant bonding sheet containing hollow ceramic powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A low dielectric constant bonding sheet containing hollow ceramic powder, the bonding sheet includes a core layer, an upper surface layer and a lower surface layer, wherein the thickness of the core layer is 55um; the thickness of the upper surface layer and the lower surface layer are both 130um.

[0036] The core layer of the bonding sheet is composed of the following raw materials in mass percentage:

[0037] 65wt.% silica filler, 30wt.% polytetrafluoroethylene, 1.5wt.% silane coupling agent, 3.5wt.% surfactant.

[0038] The surface layer of the bonding sheet is composed of the following raw materials in mass percentage:

[0039] 65wt.% hollow silica, 30wt.% polybutadiene, 5wt.% lauryl oxide.

[0040] A method for preparing a low dielectric constant bonded sheet comprising hollow ceramic powder, the steps are as follows:

[0041] Core layer preparation process:

[0042] Step 1: Mix the surfactant with deionized water, stir at 50r / min for 15min, then add coupling a...

Embodiment 2

[0049] A low dielectric constant bonding sheet containing hollow ceramic powder, the bonding sheet includes a core layer, an upper surface layer and a lower surface layer, wherein the thickness of the core layer is 80um; the thickness of the upper surface layer and the lower surface layer are both 80um.

[0050] The core layer of the bonding sheet is composed of the following raw materials in mass percentage:

[0051]54wt.% silica filler, 42wt.% polytetrafluoroethylene and polychlorotrifluoroethylene, 1.5wt.% silane coupling agent, 2.5wt.% surfactant.

[0052] The surface layer of the bonding sheet is composed of the following raw materials in mass percentage:

[0053] 48wt.% titanium dioxide with hollow structure, 50wt.% polybutadiene and polyisoprene, 2wt% benzoyl oxide.

[0054] A method for preparing a low dielectric constant bonded sheet comprising hollow ceramic powder, the steps are as follows:

[0055] Core layer preparation process:

[0056] Step 1: Mix the surfact...

Embodiment 3

[0063] A low dielectric constant bonding sheet containing hollow ceramic powder, the bonding sheet includes a core layer, an upper surface layer and a lower surface layer, wherein the thickness of the core layer is 120um; the thickness of the upper surface layer and the lower surface layer are both 45um.

[0064] The core layer of the bonding sheet is composed of the following raw materials in mass percentage:

[0065] 80wt.% silica filler, 15wt.% polytetrafluoroethylene and ethylene-chlorotrifluoroethylene copolymer, 2.0wt.% silane coupling agent, 3.0wt.% surfactant.

[0066] The surface layer of the bonding sheet is composed of the following raw materials in mass percentage:

[0067] 34wt.% hollow structure silica, 65wt.% polyisoprene and polybutadiene, 1wt% dicumyl peroxide.

[0068] A method for preparing a low dielectric constant bonded sheet comprising hollow ceramic powder, the steps are as follows:

[0069] Core layer preparation process:

[0070] Step 1: Mix the su...

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Abstract

The invention relates to a low dielectric constant bonding sheet containing hollow ceramic powder. The bonding sheet comprises a core layer, an upper surface layer and a lower surface layer; the core layer is a PTFE substrate; the PTFE substrate is a core layer film obtained by adopting a coating process; the upper surface layer and the lower surface layer are hydrocarbon resin layers containing hollow filler; the hydrocarbon resin layer forms a film by adopting an impregnation process, the thickness is uniform, the porosity is low, and the efficiency is relatively high. The bonding sheet has the characteristics of high density, uniform and stable dielectric property, high bonding strength and the like, and can meet the high-frequency requirement, the stability requirement and the reliability requirement of a multi-layer board signal.

Description

technical field [0001] The invention belongs to the field of bonding sheets, and in particular relates to a low dielectric constant bonding sheet containing hollow ceramic powder and a preparation method thereof. Background technique [0002] With the wide application of integrated circuits, electronic products are developing towards miniaturization, multi-function and high performance. As an indispensable component of circuit interconnection, PCB is bound to face a change to high-frequency and high-speed characteristics. Therefore, the previous single-layer circuit boards cannot meet the demand, and multi-layer circuit boards are an inevitable product. The adhesive sheet combines the advantages of low dielectric loss tangent of PTFE (polytetrafluoroethylene) substrate and good adhesion of prepregs such as epoxy and other thermosetting resins, which ensures the stability of multilayer circuit boards in signal transmission sex and reliability. [0003] Chinese patent CN1125...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/24C09J7/30C09J147/00C09J11/04C08L27/18C08L23/08C08L27/12C08K3/36C08K9/00B05D7/04B05D7/24
CPCC09J7/245C09J7/30C09J147/00C09J11/04B05D7/04B05D7/24C08L27/18C08L23/0892C08L27/12C08K3/36C08K9/00C09J2301/124C09J2427/006C09J2301/408C08K7/26C08L9/00C08K7/24
Inventor 冯贝贝贾倩倩王丽婧冯春明武聪金霞李强洪颖
Owner CHINA ELECTRONICS TECH GRP NO 46 RES INST
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